Tokyo Seimitsu Co., Ltd.
Manufactures and sells semiconductor manufacturing equipment and measuring instruments.
- 042-642-1701
- 042-642-1798
- 2968-2, Ishikawa-machi
Hachioji-shi, Hachioji-shi 192-8515
Japan
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High Rigid Grinder
High-rigidity grinder is the device to grind the hard and brittle materials such as sapphire and Sic substrates that are considered to be hard-to-cut materials.
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Laser Interferometers
Measurements of the length displacement or yawing and pitching, measurements of rotation angles, measurements of overshoots during vibrations or when stopped and of uneven speed, etc. can be handled. Length measuring instruments can be used for a variety of purposes, including precise inspection of heavy duty equipment.
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Non-contact Displacement Sensors
This is a flexible sensor that can be installed anywhere and is equipped with high environmental resistance enabling use in harsh environments.
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Non-contact Surface Texture And Contour Measuring Instruments
From sub-nano level surface roughness to milli level profile with 3D.Tokyo Seimitsu provides non-contact type surface roughness and contour measuring instruments with the confidence born out of many years cultivating know-how of surface roughness measurements.
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Optical Shaft Measuring System
The measurements and shape of the shaft or rotating partsare measured in an overwhelmingly short time. In our lineup, we can handle inspection and automation during production processes, so we can contribute to increased productivity at your company.
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Air Micrometers
As the pioneer of air micrometers and electric micrometers in Japan, we respond to a variety of needs for high precision production line measurements.
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Auxiliary Equipment For Dicing Machines
We have a lineup of package singulation machines, automatic cleaning systems, chillers, etc. that support the dicing process.
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Auxiliary Equipment For Probing Machines
We have a lineup of products that support the probing process.
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Battery Jig
The Company provides battery evaluation jigs that realize "stable measurement", "equipment safety," "human safety," and "labor saving" in cycle tests and characteristic tests conducted when developing rechargeable batteries and capacitors.
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CMP
CMPs remove unevenness on wafer surfaces that occur during the production process. Applications are growing due to the increase of layers in semiconductor devices and the growing variety of wiring materials.
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*CNC Surface Texture Measuring Instrument
Surfcom C5
SURFCOM C5 allows customization of the workpiece feed unit and jig production to suit particular needs.Basic specifications are Type-C (mainly for cylinder heads, cylinder blocks, and other workpieces wherea 5-direction approach is required) and Type-S (for camshafts and other shaft workpieces that require arotary axis).
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*Coordinate Measuring Machine
PRISMO ultra
PRISMO ultra uses uncompromising precision technology and was developed for measurements that require extremely high accuracy. PRISMO ultra incorporates a well-balanced combination of cutting-edge accuracy, speed, rigidity, and cost performance. This 3D coordinate measuring machine is best suited for research and development of high-precision parts and calibration inspection of reference gages.
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Coordinate Measuring Machines
Tokyo Seimitsu is the pioneer that developed “Japan’s first coordinate measuring machine.” We respond to every need with a varied lineup to which we have added Carl Zeiss products linked to our products.
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Edge Grinding Machines
The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials. Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We make proposals that achieve the improvement of quality, CoO and yield with our machine.
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For Grinder And Lathe
We offer an abundant lineup such as the PULCOM series for in-process and post-process measurements, and the SBS products for the grinding wheel’s automatic balance system.
