Aries
Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip™ technology. Our website contains over 200 full-spec Product Data Sheets available for viewing, downloading, and printing.
- 215-781-9956
- info@arieselec.com
- 2609 Bartram Road
Bristol, PA 19007-6810
United States
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product
Fusion Bonded Cable Jumpers
Series 152FB
Fusion Bonded Cable Jumpers. Aries Series 152FB Fusion Bonded Cable Jumpers are flexible...plug them directly into PC boards or sockets. Stranded wire conductors are fusion bonded with an overcoat of tin for easy soldering or socketing. Each jumper is shipped with protective tabs on both ends for maintaining proper conductor spacing.
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product
24-Pin SOIC w/Package-to-22-Pin 0.400" DIP
22-304504-18
24Pin SOIC w/ Package to 22 Pin .4 DIP. A cost effective means of upgrading to SOIC without changing your PCB layout.
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product
Header Covers
Series 650
Header Covers. Aries offers a complete line of DIP headers and covers useful for mounting components such as resistors, diodes, etc. Consult Data Sheet 12032 for mating DIP header information. Four cover heights provide mounting of 1/8? [3.18] high to 3/4? [19.05] high components.
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product
SOIC and SOJ-to-DIP Adaptor
Series 35000X
SOIC & SOJ to DIP Adapters. A cost effective means of upgrading to SOJ or SOIC...without changing your PCB layout.
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product
Standard DIP Socket with Solder Tail Bifurcated Contacts
Series 511
Standard DIP Sockets with Wire Wrap Bifurcated Contacts. Features: Standard DIP sockets are available with solder tail or wire wrap pins, all with bifurcated contacts. Consult Data Sheet No. 12005 for wire wrap pins. Aries offers these standard DIP sockets in more sizes than any other manufacturer.
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product
QFP-to-PGA JEDEC 132-Position, 0.025 [0.64] Pitch Adaptor
95-132I25
QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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product
Flat Pin-Staked Flex Jumpers
Series 171 thru 173
Flat Pin Staked Flex Jumpers. Aries Flat Pin Staked Flex Jumpers combine thin, flexible, solid Copper conductors embedded between layers of tough, flexible, flame- retardant insulation.
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product
Deci-Center™ Jumpers
SERIES 150/151
DECI-CENTER JUMPERS. Pitch bars help maintain .100 [2.54] conductor spacing.Consult factory for jumper lengths under the specified minimum length.
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product
QFP-to-PGA Motorola 68340 144-Pin Adaptor
97-68340
144 Pin QFP to PGA Adapter for Motorola 68340. Convert surface mount QFP packages to a 15 x 15 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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product
Lock/Eject DIP Collet Socket with Surface Mount Pins
EJECT-A-DIP
Lock/Eject DIP Collet Sockets with Surface Mount Pins. Features: Aries Eject-A-Dip is a rugged, solderable socket with a unique ejector/latch for fast in-field board maintenance. The latch locks in the connector or device, making it ideal for high vibration environments. The latch, when used as an ejector, removes DIP packages without pin damage.
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product
Thru-Hole 0.040 [1.02] Female DIP Strip
Series F40
Thru-Hole .040 [1.02] Female DIP Strips. This female DIP strip is used in conjunction with Aries Shorting Plug SP200, available separately, for your programming needs.
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product
PLCC-to-PGA JEDEC Type 0.050 [1.27] Pitch Adaptor
Series 505
PLCC to PGA Adapter for JEDEC Type .050 [1.27] Pitch Devices.
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product
Vertisocket™ Horizontal Mounting
Series 800
Vertisockets Horizontal Mounting with Bifurcated Contacts. Aries offers a full line of VertisocketsTM for DIP packaging of LEDs, incandescent lamps, DIP switches, test points, etc. The variations of mounting position and pin configuration provide exceptional design freedom.
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product
TSOP-to-DIP (0.600 [15.24]) Adaptor
655000
TSOP to .600 [15.24] DIP Adapter. Designed to allow user to cut 32 position adapter down to any size desired. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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product
SOIC-to-SOWIC Adaptor
XX-666000-00
SOIC to SOWIC Adapter. Allows the use of a narrow package IC in place of a wide one.
