PCIe 3.0 Protocol Analyzer
Summit T3-16 - Teledyne LeCroy
The Summit T3-16 is Teledyne LeCroy's fifth generation of protocol analyzers targeted at high speed PCI Express I/O-based applications such as workstation, desktop, graphics, storage, and network card applications.
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CCIX
The CCIX® Consortium was founded to enable a new class of interconnect focused on emerging acceleration applications such as machine learning, network processing, storage off-load, in-memory data base and 4G/5G wireless technology. CCIX is a high performance, low latency interface that is based on PCIe Physical layer, up to speeds of 32GT/s. Teledyne LeCroy provides a range of Protocol Analysis tools to support development and debug of CCIX based devices.
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NVM Express
NVM Express is a scalable host controller interface designed to address the needs of Enterprise, Data Center and Client systems for supporting chip-to-chip, board-to-board, adapter and distance solutions. The protocol can efficiently use interconnect and fabric technologies such as PCI Express, Ethernet and Fibre Channel. Teledyne LeCroy provides protocol analysis, emulation, exerciser and other test equipment to service all NVMe storage applications.
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PCI Express
PCIe
PCI Express (PCIe) has become the leading interconnect technology to succeed the Peripheral Connect Interface (PCI) architecture. The PCI Express(PCIe) architecture retains the PCI usage model and software interfaces for investment protection and smooth development migration. The technology is aimed at multiple market segments in the computing and communication industries, and supports chip-to-chip, board-to-board and adapter solutions. PCI Express 5.0 currently runs at 16GT/s or 32Gbps per lane in each direction, providing a total bandwidth of 128GBps in a 16-lane configuration which is the largest size in use.
