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Failure Analysis
examination of faults, determine root cause and recommend corrective actions.
See Also: Crush, Performance Testing, Investigation
- InterWorking Labs, Inc.
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SilverCreek SNMP Tests
Set up in less than five minutes - Windows or LinuxCustomize tests via Wizards, Script Generators, and moreAutomate operation with unambiguous test resultsIntegrate with other test harnesses and test toolsIncludes conformance, compliance, vulnerability, robustness, stress, and performance testingInvestigate failures and quickly resolve them with powerful diagnostic and analysis tools
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Failure Analysis
Failure Analysis (FA) plays a crucial role in the production of semiconductors. It provides process and design feedback to determine the root cause of any failures. Time-to-data for the FA Engineer is a critical measurement and SemiProbe’s Probe System for Life ® (PS4L) is ideally suited to excel in this application. All key components are interchangeable, making it easy to switch between individual die, wafers, and packaged parts.
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Failure Analysis And Magnetic Imaging Services
Micro Magnetics offers failure analysis services on a contractual basis. We maintain two current density metrology systems at our headquarters in Fall River and can produce maps of current flow in a wide variety of ICs and packages, usually with initial results delivered within 48 hours. Our engineers will work closely with you to understand and interpret the results in order to determine the root cause of the failure.
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Regenerative Battery Pack Test System
17020E
Charge/discharge modes (CC, CV, CP)Power Range: 10kW / 20kW per channelVoltage Range: 60V/ 100VCurrent Range: 100A/200A/300A/400A/ 500A/600A/700A/800A per channelRegenerative battery energy discharge, efficiency 85%Channels paralleled for higher currentsDriving cycle simulationFast current conversion without current interruptHigh precision measurementSmooth current without over shootTest data analysis functionData recovery protection (after power failure)Independent protection of multi-channel
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Semi-automatic Measuring And Alignment System
McBain Z-NIR Near Infrared Inspection Microscope
The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
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Failure Analysis
MicroINSPECT 300FA
The MicroINSPECT 300FA is an automated wafer inspection tool used for semiconductor wafer failure analysis. Its small footprint, high speed, and low cost relative to its rich features yield a superb cost of ownership and makes this an ideal tool for your fab or failure analysis lab. The MicroINSPECT 300FA combines advanced robotics, wafer sorting, an intelligent wafer inspection microscope together with SiteVIEW Software to produce an integrated failure analysis tool.
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MPI Automated Probe Systems
MPI Advanced Semiconductor Test
MPI’s 200 mm and 300 mm automated probe systems are dedicated and designed to address current and future requirements for all facets of Device Characterization for Modeling and Technology/Process Development, Failure Analysis, Design Verification, IC engineering, Wafer Level Reliability as well as special requirements for MEMS, High Power, RF and mmW device testing.
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System Modeling for Diagnostic Design and Analysis
EXpress
eXpress is a comprehensive model-based diagnostics engineering software application providing an environment for the design, capture, integration, evaluation and optimization of complex or large-scale system diagnostics, prognostics health management (PHM), systems testability engineering, failure mode and effects analysis and system safety analysis. eXpress is uniquely suited to influence the diagnostic development for new designs or to exploit the diagnostic challenges of existing legacy systems. Its robust structure facilitates the capture of extensive interdisciplinary design knowledge providing an unmatched ability to corroborate, reuse and re-purpose expert knowledge in performing standardised testability, reliability and maintainability analyses.
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Electrical Property Measurement
Materials Analysis Technology Inc.
This technology is used to identify the electrical characteristics, such as resistance, capacitance and inductance, of semiconductor devices. Characteristics measured from fail and normal chips could provide important clues for further failure analysis.
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Electrical Testing
Innovative Testing Solutions, Inc.
Our specialty is Direct Current automotive components. We perform product validation and design verification testing on both electrical components and systems. Also, we perform warranty investigation testing and failure analysis. We have voltage capabilities to 300 volts and current capabilities to 1000 amperes. Both two-wire and four-wire resistance measurements are supported from NanoOhms to GigaOhms.
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Bench & Characterization Boards
Engineer, Design, Fabricate & Assemble Custom Boards for:*Device Characterization and Verification*Bench Testing*Failure Analysis*General Laboratory Use
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Failure Analysis
Failure analysis on electronic components is a continuous challenging task. The smaller transistor dimensions, increasing functional complexity and changing device packaging styles requires new tools and skills for sample preparation, fault localization techniques, high resolution imaging and analysis.
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Real-Time X-Ray Imaging and Variable Pressure Scanning Electron Microscope
Trialon has the equipment and experienced staff to operate this highly technical piece of laboratory equipment. Our state-of-the-art materials analysis lab located in Auburn Hills, MI is managed by a Ph.D with over 20 years of hands-on experience in root cause failure analysis of design, material and process for current and future products.
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Material Analysis Laboratory
Trialon’s world class Material Analysis Laboratory consists of state-of-the-art equipment and experienced staff. Our specialty is to determine failure analysis of design, material, process and root cause in both current and future products across multiple industries.
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Failure Analysis Services
Innovative Circuits Engineering, inc
Innovative circuits engineerin's failure analysis group performs root cause analysis on a wide variety of integrated circuit devices.
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Digital Microscope
VHX-6000 Series
Next-generation optical microscope with a large depth-of-field and advanced measurement capabilities for inspection and failure analysis.
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Plasma Profiling TOFMS
PP-TOFMS
Plasma Profiling TOFMS addresses the needs of materials scientists across a wide range of application areas. PP-TOFMS provides fast elemental depth distribution of any inorganic material. The speed and ease of use of PP-TOFMS permit to reduce optimization time of growth processes as many research scientists strive to reduce the time from discovery to applications of new materials.The simultaneous full coverage of TOFMS available for each point of depth permits the detection of non suspected contamination. This is key for failure analysis and optimization of thin film processes that tend to no longer be based on ultra-high grade methods (i.e. ink jet printing…).
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Scanning Electron Microscope (SEM)
Prisma E
Prisma E scanning electron microscope (SEM) combines a wide array of imaging and analytical modalities with new advanced automation to offer the most complete solution of any instrument in its class. It is ideal for industrial R&D, quality control, and failure analysis applications that require high resolution, sample flexibility and an easy-to-use operator interface. Prisma E succeeds the highly successful Quanta SEM.
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Resistive AC Load Bank
AC load bank testing offers you whole solutions of predictive failure analysis for UPS(uninterrupted power supply), generator, transformers, PV system, inverter etc, to validate the condition and output of such power systems comprehensively. Integrated AC & DC load bank could be made in one unit or separately with different load voltages as per your need for different applications.
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Shake Table Testing
Response Dynamics Vibration Engineering, Inc.
Shake table testing is often used in prototype analysis, failure analysis, shipping vibration testing and vibration sensitivity testing. We know what boundary conditions are vital for effective testing, how and where to instrument the system, how to deal with for off axis excitation (often not accounted for), and make the most efficient use of testing time. Let us have a look at your system and any specified vibration criteria before the shake test is designed. We can interpret the criteria, make sure it is applied appropriately, and make recommendations that will save valuable time and expense.
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Failure Analysis Services
BMP Testing and Calibration Services Inc.
Failure analysis plays a crucial role in product development that enables industries to prevent future product failures and improve them for the end-user. It’s a multi-faceted approach to finding how and why a product failed and involves an in-depth investigation of the circumstances surrounding the failure and discovery of relevant background information, including but not limited to the type of application, environmental factors, service life, and pertinent design information.
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Vibration Measurement Tools
SKF Condition Monitoring Center
Abnormal vibrations are often the first indication of a potential machine failure. Conditions that can cause these vibrations include unbalance, misalignment, looseness of parts, deteriorating rolling element bearing and gear damage. Vibration analysis instruments and systems can help detect many serious problems at an early stage, allowing personnel to undertake remedial work in a timely manner.
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Leeb Hardness Tester
HT6561
Product synopsis1.1 Typical Applications* Die cavity of molds* Inspection of bearing and other mass produced parts on aproduction line* Failure analysis of pressure vessel, steam generator andother equipment* Inspection of installed machinery, permanent parts ofassembled systems and heavy work pieces.* Testing surface of a small hollow space* Material identification in the warehouse of metallic materials* Rapid testing in large range and multi-measuring areas forlarge-scale work piece1.2 Testing Features* Palm size for narrow space.* Test at any angle, even upside down.* Direct display of hardness scales HRB, HRC, HV, HB, HS,HL.* Large memory could store 250 groups including singlemeasured value, impact direction, material and hardnessscale etc.* User recalibration function allowed.* Can communicate with PC computer for statistics andprinting by the optional cable.* Manual or automatic shut down.* Low battery indication.1.3 Technical SpecificationsDisplay: 12.5mm LCD with back lightAccuracy: Display error ±0.8% at LD=900Measuring range: 200-900LConversion: HL-HRC-HRB-HB-HV-HSDMaterials: 9 different common materialsWith RS232C interfaceMemory: 250 data can be stored and re-readableImpact device: D Will handle the majority of hardness testingapplications. Weight: 75gPower supply: 2x1.5V AAA size batteryDimension: 146×65×36mmWeight: 130g (not including batteries)Working temperature： - 10℃～＋50℃Storage temperature：- 30℃～＋
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FTIR Spectrometers
FTIR spectroscopy is used to quickly and definitively identify compounds such as compounded plastics, blends, fillers, paints, rubbers, coatings, resins, and adhesives. It can be applied across all phases of the product lifecycle including design, manufacture, and failure analysis.
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Component Test and Analysis Laboratories
The Component Test and Analysis team specializes in electronic and mechanical components such as hybrids, connectors, cables, harnesses, passive or discrete components, and digital or linear devices. The test lab has extensive experience in developing test software to electrically and environmentally characterize virtually any integrated circuit, including analog, digital, mixed signal, converters, FPGA and ASICs, as well as experience in developing actual radiation environments for parts testing. The component analysis team offers the analytical expertise and advanced instrumentation to identify root cause explanation for a wide range of component-level failures, as well as the resources to evaluate for possible quality and reliability issues through non-destructive and destructive techniques. With access to a detailed database, the Component Test and Analysis team offers a 25-year history of test and analysis data — a valuable resource for addressing new customer requirements.
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FEA Software
Helius PFA
Helius PFA software provides powerful tools for enhanced FEA (finite element analysis) of composite structures, including progressive failure analysis.
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Predictive Vibration Monitor Solutions
VMU
Vibration Monitor Units (VMUs) from Astronics employ proven vibration analysis to predict the failure of fans and other rotating equipment on passenger and cargo aircraft. Accurate prediction allows maintenance to intervene before a failure can occur, eliminating the resulting smoke or smoke smell event that can result in costly flight delays, diversions, emergency landings, or cancellations.
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ADLINK Software
The plug and play Edge IoT solution for machine condition monitoring enabling remote equipment monitoring, health scoring and predictive failure analysis to maximize overall equipment effectiveness (OEE).
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Diagnostic Test System™
The original Teseda system for bench-top stimulus, test pattern debug, validation, device failure mode stimulation in-situ with other Failure Analysis lab equipment such as an EMMI, etc.
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Electronics Failure Analysis System
Sentris
Due to the continued decrease in integrated circuit feature size and supply voltages, detecting and locating the miniscule amount of heat generated by failure sites has become increasingly difficult. Sentris pinpoints low-level infrared thermal emissions from IC faults such as short circuits and leakage current.
