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Inductively Coupled Plasma Spectrometry
Is an analytical technique that can be used to measure elements at trace levels in biological fluids.
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Inductively Coupled Plasma Emission Spectroscopy
Inductively Coupled Plasma Emission Spectroscopy
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Inductively Coupled Plasma Mass Spectrometer
ICPMS-2030
With its newly developed collision cell and optimized internal structure, the ICPMS-2030 provides superior sensitivity. At the same time, thanks to the adoption of its proprietary mini-torch unit and provision of an Eco mode, the quantity of argon gas needed for analyses has been greatly reduced to the industry's lowest levels. As a result, low running costs are assured. The Development Assistant function of the software automatically sets the optimal analysis conditions for quantitative analysi...show more -
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Inductively Coupled Plasma Mass Spectrometry / ICP-MS Systems
Agilent ICP-MS systems utilize innovative technology to deliver excellent sensitivity, accuracy, ease of use and productivity. Our 7800 and 7900 quadrupole ICP-MS systems offer the highest matrix tolerance, widest dynamic range and most effective interference removal for trace elements across most typical applications. The 8900 Triple Quadrupole ICP-MS (ICP-QQQ) adds MS/MS operation, providing precise control of reaction cell processes to ensure the most consistent and accurate results, resolving interferences that are beyond the capability of quadrupole and sector-field high resolution ICP-MS.
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Inductively Coupled Plasma Optical Emission Spectroscopy / ICP-OES Systems
Industry-leading performance, speed and ease of use – no compromises
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Inductively Coupled Plasma Spectroscopy (ICP-OES/MS), ICP Analysis Services
ICP-OES measures the light emitted at element-specific characteristic wavelengths from thermally excited analyte ions . This light emitted is separated and measured in a spectrometer, yielding an intensity measurement that can be converted to an elemental concentration by comparison with calibration standards. ICP-MS (ICP-Mass Spec) measures the masses of the element ions generated by the high temperature argon plasma. The ions created in the plasma are separated by their mass to charge ratios, enabling the identifcation and quantitation of unknown materials. ICP-MS offers extremely high sensitivity (i.e. low detection limits) for a wide range of elements
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ICP Plasma System
The AXIC IsoLok® Inductively Coupled Plasma (ICP) Load-Locked Processing System from AXIC, Inc. defines a new concept in Deep Reactive Ion Etch (DRIE) and low temperature-low damage Plasma Enhanced Chemical Vapor Deposition (ICP-PECVD) plasma processing. The system is based on a modular design starting with a universal chamber and cabinet unit with ICP etch or deposition bottom electrodes available for easy installation into the chamber unit combined with a load-lock. We are confident you will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma product in the market.
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Multichamber Plasma CVD & RIE Processing Systems
Model MPS-2000
Accurate linear wafer transporter with low particulate generation. Automated options with programmable controls. Safety interlocked with local and global interfaces. Base pressures to 10-8 torr. Optional clean room load lock entry port. Option for inductively coupled plasma processing is available. Complete and ready to operate.
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ICP-OES Analyzer
ARCOS
SPECTRO Analytical Instruments GmbH
For the most demanding elemental analyses in industry and research. ARCOS analyzer represents a new pinnacle of productivity and performance for inductively coupled plasma optical emission spectrometers. SPECTRO ARCOS excels in industrial and academic applications for the most advanced elemental analysis of metals, chemicals, petrochemicals, and other materials.
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Chemical Analysis and Corrosion Testing
Performing chemical analysis of metal alloys including both ferrous and non-ferrous alloys.Chemical analysis involves determining the chemical constituents of metals and related materials.An industry leader and co-operating laboratory for qualifying Calibration Standards for Chemical Analysis.Our chemical laboratory processes include Spectroscopy – Optical Emission Inductively Coupled Plasma, gas analysers, wet chemical, Intercrystalline/ Intergranular Corrosion (including G28, G48 etc).
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Desolvating Nebulizer
Aridus3
The CETAC Aridus3 Desolvating Nebulizer System is a specialized liquid sample introduction accessory for inductively coupled plasma mass spectrometry (ICP‑MS). The Aridus3 can enhance analyte sensitivity up to 10 times or more and can greatly reduce solvent-based interferences such as oxides and hydrides.The Aridus3 couples a low-flow (50, 100, or 200 µL/min) PFA nebulizer and a heated PFA spray chamber with an inert fluoropolymer membrane. This combination provides enhanced analyte sensiti...show more -
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Inductively Powered Telemetry Systems
Advanced Telemetrics International
ATi Inductively Powered Telemetry Systems are typically used to transmit data from rotating shafts or machinery to a stationary receiver.
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Coupled Cavity TWTs
Communications & Power Industries
• Frequencies from 2.7 to 37.5 GHz• Peak levels: 500 W to 180 kW• Cooling type: air, liquid, conduction• Depressed or grounded collectors• CW (Continuous Wave) and Pulsed
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Plasma Emission Controller
RU-1000
The optical technology developed by HORIBA and the gas control technology offered by HORIBA STEC have been combined to make further advances in plasma control technology. The plasma emission controller RU-100 offers; faster deposition by controlling the transition region, optimized distribution in a large-area, high-capacity chamber, plasma stabilization in a long sputtering process (stable deposition), and mixture optimization of compounds for reactive sputtering.
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Plasma Etcher / Asher
PA-3000-A ETCHER
Process chamber with plasma view window and full access hinged door. RF hot process shelves with opposing ground electrodes. Throttle valve. Capacitance manometer. Internal pumping system with option for Fomblin filled chemical series mechanical pump. Flow control electronics and cabinet. Up to four mass flow control assemblies can be incorporated into our system. RF matching network and 600 watt maximum power supply. Fully enclosed cabinet. Custom internal fixturing to accommodate specific substrate shapes and sizes. Plasma gas selection for optimal performance.
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Plasma Power Generators
Advanced Energy’s field-proven, Precision PowerTM solutions offer extreme control, peerless arc handling, and cutting-edge match technology. Unlock new fabrication processes and benefit from our plasma power generators’ comprehensive capabilities.
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Plasma Process Monitors
Plasma process monitors to monitor plasma emissions during semiconductor manufacturing processes such as etching, sputtering and CVD.
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Plasma Profiling TOFMS
PP-TOFMS
Plasma Profiling TOFMS addresses the needs of materials scientists across a wide range of application areas. PP-TOFMS provides fast elemental depth distribution of any inorganic material. The speed and ease of use of PP-TOFMS permit to reduce optimization time of growth processes as many research scientists strive to reduce the time from discovery to applications of new materials.The simultaneous full coverage of TOFMS available for each point of depth permits the detection of non suspected contamination. This is key for failure analysis and optimization of thin film processes that tend to no longer be based on ultra-high grade methods (i.e. ink jet printing…).
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Microwave Plasma Subsystems
AX2600 And AX2700
The AX2600 and AX2700 Microwave Plasma Delivery Subsystems are complete and highly reliable solutions for the cost-effective generation and safe delivery of atomic species to the wafer. Available in 3 kW, these highly reliable, field-proven plasma delivery subsystems deliver highly concentrated atomic species. Suitable for multiple chemistries, the high speed and precision of this plasma system’s automatic tuning guarantees immediate ignition and fast transition from plasma conditions for high productivity. Robust closed-loop control ensures high accuracy, precision, and optimal repeatability of the process from wafer to wafer and system to system.
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UV Plasma Sources
UVS300|UVS 10/35
The UVS300 and UVS 10/35 are UV Plasma sources with high intensity, working with different gases.
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Remote Plasma Source
Xstream
The highly efficient Xstream® RPS dissociates large volumes of NF3 and quickly cleans chambers, improving your overall tool performance. Its plasma chamber showcases high-purity aluminum alloy and patented cooling capabilities. Built to last for years without repair or expensive chamber coatings, the Xstream RPS is the smart choice for dependability and efficient performance.
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Remote Plasma Source
MAXstream
Advanced Energy’s MAXstreamTM line is the next generation of remote plasma sources for chamber cleaning. The MAXstream is available in 3, 6, 8, 10, and 12 SLPM NF3 flow rates to optimize price and performance.
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Remote Plasma Sources
Equip your manufacturing and abatement processes with high functionality and exceptional reliability. Customize your chemistry. Expand your operating range. Deliver higher process rates. Advanced Energy’s remote plasma sources offer sophisticated options in streamlined designs.
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Remote Plasma Sources
Semiconductor and Electronic Thin Film applications use plasma sources to generate low-energy ions and radicals to react with material surfaces and chamber walls to remove contaminants and act as a precursor to aid in material deposition. MKS provides multiple options for radical generation including Toroidal and Microwave based Remote Plasma Sources supporting Fluorine, NF3, oxygen, nitrogen and hydrogen process chemistries.
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RF Plasma Generators
Choose from a broad range of RF plasma generators and access unique features for configuration, control, and application requirements. From various mounts and sizes to full digital control and plasma dynamic response, our RF generators can ignite your process innovation.
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Plasma Processing Systems
PlasmaSTAR
The PlasmaSTAR® Series of Plasma Processing Systems from Axic, Inc. defines a new concept in barrel plasma processing. The systems are based on a modular design concept. Starting with a universal base unit, multiple electrode modules are available for easy insertion into the base unit. You will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma.
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DC Coupled Current Probe
34134A
Measure a wide range of applications with this battery-powered, clamp-on probe; use with DMMs or voltmeters
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Plasma CVD & Etching Systems
MODEL DRIE-1000
A High Quality Plasma Deposition & Etch System, Ideal for R&D and Small Scale Production. Modified designs with capabilities of 12" wafers. Substrate heating to 500 C. Top loading / Optional loadlock. Multifunctional plasma network. Diversified pumping configurations. Variable electrode spacing. Customized features and components for specific applications.
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