Solder Paste Measurement
assures volume and area of paste application.
See Also: Solder Paste, Solder Paste Inspection
- Advanced Telemetrics International
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Half Shaft Torque Measurement Systems
Advanced Telemetrics International
ATi’s Half Shaft Telemetry System transmits torque signals from rotating shafts to a stationary telemetry receiver. It connects directly to strain gages adhered to the shaft converting it into a torque sensor allowing it to transmit shaft torque while the vehicle is operating. This system is a testing tool used by automotive and racing engineers to obtain real-time torque measurements from vehicle drivelines.
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5D SPI
On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
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Printing / Squeegee Force
CmPrint
Measurement of the Force-Time Curve while Printing. The first step into the manufacturing of electronic printed circuit boards (PCBs) is printing. The solder paste is printed on the PCB using a stencil. The equal distribution of the paste pressure is crucial and affects the overall quality of the finished circuit board. An important influencing factor is the accuracy and reproducibility of the squeegee force.
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AOI & SPI Test Systems
Xceed AOI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The Xceed enables true 3D measurement and provides the most accurate and repeatable inspection results with the minimum false calls. It’s designed with Advanced Signal Processing which gives results in noise-less, clear, and accurate 3D images.
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2D/3D AOI Series
MV-6e
- Exclusive10MP/18MPCameraTechnology- Precision Telecentric Compound Lens Design- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Extremely Simple Programming and Operation- Integrated INTELLI-SCAN® Laser Inspection System- 3D Co-Planarity Inspection of Gull-Wing Leads, BGA and CSP - - -- Devices- Enhanced 3D Solder Paste Height Measurement Capability- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Solder Paste Inspection Machine
3D SPI
The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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PXIe Measurement Accelerator
M9451A
The M9451A PXIe Measurement Accelerator combined with Option DPD Digital Pre-Distortion & Envelope Tracking Gateware shows what is possible when you combine state of the art FPGA's with Keysight's trusted measurement expertise and PXIe's high speed data handling. As part of Keysight's RF PA/FEM Characterization & Test, Reference Solution, this combination provides unprecedented performance for demanding envelope tracking and digital pre-distortion measurements required for testing modern...show more -
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PXI FPGA & Measurement Accelerator
Keysight PXI FPGA & measurement accelerator provide digital-pre-distortion (DPD) and envelope tracking (ET) measurements that are embedded in high performance FPGA processing cards.
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Solder Paste Printers
Shenzhen Leadsmt Technology Co.,Ltd
Is mainly used to print the solder paste to the circuit board, is one of the essential equipment in electronic manufacturing.
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3D Solder Paste Inspection (SPI)
Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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3D Inline Solder Paste Inspection System
TROI 7700 SERIES
Using Moire' pattern, Pemtron's three-dimensional lead applicationdosage tester combines 2D color images with 3D measurement data toprovide more detailed, near-real PCB images, unlike traditionalcolor maps. We will also provide you with the best solution forhigh-quality and high-precision PCB production with a varietyof statistical programs, along with information you need toquickly and accurately judge positive/failure.
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High Speed Solder Paste Inspection
VisionPro HSi
The VisionPro HSi offers high speed solder paste inspection. Utilizing the most advanced high resolution staging and sensor technologies, the VisionPro HSi provides the accuracy and reliability needed to compliment your overall screen print process improvement strategy.
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Solder Paste Wetting Tester
SP-2
SP-2 is wettability testing machine forsolder paste, parts electrode and PC board,adopted SP-Tension-Method (Temperature Profile Method).
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Solder Cup Connector Kit
Y1142A
Used to build custom cables for 34950A – 78-pin Dsub male – 60 V.
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Solder Paste Inspection System
KY8030-3
The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
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Solder Joint Inspection System
DMC developed the software to inspect the solder joints of automotive power door lock switches.
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Tool, Solder Kit, Mini Coax with Solder Sleeve
910121144
Used to solder Mini Coax Solder Sleeve contacts.
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Solder Wettability Tester
5200 Advanced
This is an ultra-high-sensitivity wettability tester developed to evaluate the solder wettability of ever-miniaturizing electronic components. Electronic devices, especially mobile devices, are becoming more compact and multi-functional. As the number of electronic components mounted on them increases and the pitch of connectors that connect each device increases, soldering parts are becoming increasingly miniaturized. expected to respond to further miniaturization of electronic components and miniaturization of joints in the future .
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High-speed 3D Solder Inspection Machine
YSi-SP
a high-speed 3D solder paste inspection machine that enables high-speed high-accuracy inspections based on our “1-head solution” concept for using a single type of head to handle various inspections. It is used to inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto PCBs. Available April '18.
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Ultrasound Measurements
Is sound waves with frequencies higher than the upper audible limit of human hearing. Ultrasound is no different from 'normal' (audible) sound in its physical properties, except in that humans cannot hear it. Ultrasound devices operate with frequencies from 20 kHz up to several gigahertz.Ultrasonic devices are used to detect objects and measure distances. Ultrasound imaging or sonography is often used in medicine. In the nondestructive testing of products and structures, ultrasound is used to detect invisible flaws.
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37-Pin D-Type Female Solder Bucket
92-960-037-F
Accessory allows a user to create their own PCB based termination solution mounted directly on the front of the product or on the end of a cable. Interfacing PCBs should be designed with suitable clearances for the voltage the application requires. 37-Pin Female connectors can be directly mated to a corresponding Pickering Switching Module while Male versions can be used to interface to a Female cable assembly termination.
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Stability Measurement
Biodiesel Rancimat
In the Biodiesel Rancimat, increased temperature and a continuous stream of air through the sample accelerate its aging. The time that passes until oxidation takes place at a high rate – the induction time or oxidation stability index (OSI) – is measured.
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temperature Measurement
Educated Design & Development, Inc.
Up to 8 resistance reading channels, 4-wire methodUp to 12 temperature reading chanels, use of Type K, 24 AWG, Teflon thermocouplesIn the Box:8 - data cable (Cat5e) to connect the isolation modules to the Resistance Reading Channels8 - Isolation Module connected between the HOT-30 and EUT (Equipment Under Test) to isolate high voltage8 - Banana Jack Sets (2 red, 2 black), to replace Kelvin Leads in tight places8 - Kelvin Probe Set12 - 72 inch K Type Thermocouple1 - USB2.0 Type A (standard) to Type B USB cable
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37-Pin D-Type Male Solder Pin HV
40-960-037-M-HV
This connector is designed to allow users to directly terminate cables with soldered connections.
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Horizontal Measurement
Our innovative horizontal/vertical instruments fulfill quality requirements for many applications.
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Measurement Sensors
measurement sensors convert a physical phenomenon (such as sound or temperature) into a measurable analog voltage or digital signal. This signal is then further processed and converted into a legible display.
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Nanometer Measurement
The Nano-Gauge™ is an ultra high precision, single axis, displacement measuring instrument capable of resolving dimensions down to 1.5 nanometers (0.06 microinches) over a full scale range of 25mm (1 inch). Combining ease-of-use and small physical size, the Nano-Gauge™ can be quickly adapted to a wide variety of precision measurement situations without lengthy or complex setup procedures.
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Resistance Measurement
Precision resistance measurement equipment for a range of applications. Specialist units measure down to fractions of a micro-ohm with high accuracy.
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Fast-CW Measurements
S93118B
S93118B Fast-CW mode is a software capability to perform FIFO (first-in-first-out) data acquisition for fast measurement on PNA/PNA-L/PNA-X Series B model network analyzers.
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Measurement & Test
Electronic test engineers use a variety of precision instruments for R&D, vendor verification, and production testing. ETPS can supply a number of general test instruments that can be used in stand alone mode or automated for high throughput testing. Dedicated battery test systems with automatic charge and discharge modes with data logging are available. The standard 16 and 32 channel systems have range up to 5VDC ensuring their suitability for a wide variety of cells.
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Measurement Microphones
All microphones are omni-directional and 48V phantom powered. The XL2 Analyzer microphones include an electronic data sheet. The Automated Sensor Detection (ASD) of the XL2 automatically reads this data sheet, and recognizes the microphone model, sensitivity and calibration data. This ensures accurate measurement results.
