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SPI
assures volume and area of paste application.
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3D SPI
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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5D SPI
On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
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SPI Isolators
SPI (Serial peripheral interface) is one of the most widely used interfaces between microcontrollers and peripheral ICs such as sensors, ADCs, DACs, shift registers, SRAM, and others. Analog Devices has your isolated SPI bus covered with our dedicated SPI digital isolators which support this synchronous, full duplex master-slave-based interface. Options include devices built with ADI's proven iCoupler® technology and offering a small footprint, simple design-in, fast speeds, and high data integrity, as well as integrated µModules which require no external components. Our SPI isolator solutions increase performance and reduce board space. This simple, compact solution is ideal for isolated SPI data requiring communication across different ground potentials or through large common mode transients often found in Industrial PLCs (programmable logic controllers) and Instrumentation and data acquisition systems.
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3D SPI Series
MS-11e
- Exclusive15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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3D SPI Series
MS-15
- Exclusive 15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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SPI | AOI | AXI
Suitable for a wide variety of SMT applications, Omron’s automated inspection solutions are designed to ensure the highest degree of quality and consistency in PCB production.
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AOI & SPI Test Systems
Xceed AOI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The Xceed enables true 3D measurement and provides the most accurate and repeatable inspection results with the minimum false calls. It’s designed with Advanced Signal Processing which gives results in noise-less, clear, and accurate 3D images.
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AOI & SPI Test Systems
To keep the quality of your production at its best you need a good inspection of your boards. For efficient and detailed in-depth board inspection ensure you have SMT inspection equipment that meets your needs. Our AOI & SPI units will provide the quality you need for reliable inspection of soldering inspection.
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AOI & SPI, Test Systems
SigmaX SPI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The SigmaXs inspection technology is unaffected by varying materials, surface conditions, or colors. The system profiles the board to generate accurate 3D shapes far superior to other brands and technologies.
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TTL/I2C/SPI Expansion Kit
OP-SB85L
OP-SB85L is the interface expansion kit that has a port to measure TTL / CMOS signal level communications, and the one to measure the voltage of high-speed analog input. The port for TTL / CMOS supports the measurement of TTL / CMOS level communications that power supply system is from 1.8V to 5V. It is suitable for monitoring the communication between the LSI and the interface IC on the printed circuit board by directly probing into the lines. It supports the protocol of not only UART and HDLC but also I2C and SPI on monitoring and simulating.
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TTL/I2C/SPI* Expansion Kit
OP-SB5GL
OP-SB5GL is the interface expansion kit that has a port to measure RS-232C(V.24) and a port to measure the TTL / CMOS signal level communications. The port for TTL / CMOS supports the measurement of TTL / CMOS level communications that power supply system is from 1.8V to 5V. It is suitable for monitoring the communications between the LSI and the interface IC on the printed circuit board by directly probing into the lines. It supports the protocol of not only UART and HDLC but also I2C and SPI* on monitoring and simulating.
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USB/RS232/SPI Programmable Attenuator
RUDAT-13G-90
Mini-Circuits’ RUDAT-13G-90 is a general purpose programmable RF attenuator supporting frequencies from 10 to 13000 MHz with attenuation from 0 to 90 dB in 0.5 dB steps. Its unique design maintains linear attenuation change per dB, even at the highest attenuation and frequency settings. The attenuator is controlled via USB, RS232 or SPI. It comes housed in a compact, shielded metal case with SMA(F) input/ output RF ports (RF ports are interchangeable), a USB type Mini-B socket, and a 9-pin D-sub(F) RS232 and SPI port. Power can be supplied via either USB or the D-sub port. The RUDAT-13G-90 is supplied with our easy-to-install, user-friendly GUI software, API objects for Windows® environments, and complete programming instructions for 32 and 64 bit Windows® and Linux® operating systems. See p. 9 for a complete list of included accessories.
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3D Solder Paste Inspection (SPI)
Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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3D Solder Paste Inspection (SPI)
TR7007 SII
Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
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High-Speed Multi-IO SPI Host Adapter
BusPro-S™
The BusPro-S High-Speed Multi-IO SPI Host is designed with speed, versatility, and value in mind. Featuring a 60 MHz clock rate with up to 200 Mb/s throughput and support for standard, dual, quad, and 3-wire modes, the BusPro-S is the right tool for all SPI debugging applications-present and beyond.
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Process Improvement Software for SPI & AOI
SIGMA Link
SIGMA Link software suite links altogether solder paste inspection (SPI), automated optical inspection (AOI) and manufacturing execution system (MES). For Smart Factories, SIGMA Link is the essential element to connect inspection machines to Manufacturing Execution System. This real-time interface ensures full traceability and enables interlocking of machines to automate SMT lines while driving yield to new levels.
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Relay Test Set Type SP-I
Supreme Instrument Laboratories
Supreme make relay testing set is designed for site testing of protective relays which simulate in common fault conditions under which a protective relay will be called into positive function. Periodic field testing is the best way of ensuring the integrity of the protective relays. We offer our relay testing set with specific testing capacity to suit different group of protective relays. The testing set operates on single phase 230 V, A.C. 50Hz. Supply.
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SPI Flammability Tester (Vinyl Material)
TF318
TESTEX Testing Equipment Systems Ltd.
SPI Flammability Tester (Vinyl Material), to determine the ignition properties of vinyl plastic film material according to CFR 16 Part 1611 U.S.A. Flammable Fabrics Act for flammability of apparel vinyl plastic film.The rate of burning shall not exceed 1.2 in./s as judged by the average of five determinations lengthwise and five determinations transverse to the direction of processing, when specimen is placed at an angle of 45 degree and expose to the standardized flame (22# fire nozzle, 1/2 inch. In length).
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Breakout - General Purpose USB to GPIO+SPI+I2C
FT232H
This chip from FTDI is similar to their USB to serial converter chips but adds a ''multi-protocol synchronous serial engine'' which allows it to speak many common protocols like SPI, I2C, serial UART, JTAG, and more! There''s even a handful of digital GPIO pins that you can read and write to do things like flash LEDs, read switches or buttons, and more. The FT232H breakout is like adding a little swiss army knife for serial protocols to your computer!
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Low Speed Protocol Decode/Trigger Software (I2C, SPI, RS232, I2S, JTAG)
D9010LSSP
This bundle includes powerful decoding and triggering for the following serial bus standards: I²C, SPI, Quad SPI, eSPI (including Quad eSPI), RS232/UART, Manchester, I²S, SVID, and JTAG (IEEE 1149.1). It is compatible with S-Series, V-Series, Z-Series, EXR-Series, MXR-Series, UXR-Series, 9000 Series, and 90000 Series Infiniium oscilloscopes. For detailed information on the decode and trigger settings, please refer to the datasheet.
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USB-8451, 250 kHz I2C, 12 MHz SPI I2C/SPI Interface Device
779553-01
The NI USB‑8451 is a master interface for connecting to and communicating with inter-integrated circuit (I2C), System Management Bus (SMBus), and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8451 is a portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices or toggling LEDs. The USB‑8451 can be physically located more closely to I2C/SPI devices than PCI interfaces, reducing I2C bus length and minimizing noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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USB-8451, 250 kHz I2C, 12 MHz SPI I2C/SPI Interface Device
779553-50
The NI USB‑8451 is a master interface for connecting to and communicating with inter-integrated circuit (I2C), System Management Bus (SMBus), and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8451 is a portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices or toggling LEDs. The USB‑8451 can be physically located more closely to I2C/SPI devices than PCI interfaces, reducing I2C bus length and minimizing noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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USB-8452, 3.3 MHz I2C, 50 MHz SPI I2C/SPI Interface Device
781964-02
The NI USB‑8452 is a master interface for connecting to and communicating with inter-integrated circuit (I2C) and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8452 is a bus-powered, portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices, toggling LEDs, or strobing convert and data ready lines common to analog converter chips. You can physically place the USB‑8452 more closely than PCI interfaces to I2C/SPI devices, which reduces I2C bus length and minimizes noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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USB-8452, 3.3 MHz I2C, 50 MHz SPI I2C/SPI Interface Device
781964-03
The NI USB‑8452 is a master interface for connecting to and communicating with inter-integrated circuit (I2C) and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8452 is a bus-powered, portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices, toggling LEDs, or strobing convert and data ready lines common to analog converter chips. You can physically place the USB‑8452 more closely than PCI interfaces to I2C/SPI devices, which reduces I2C bus length and minimizes noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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USB Logic Analyzer- High Speed Data Logger -SPI / IC Analyzer
LOG Storm
Logic analyzers are key tools for that process – they offer visibility over what happens in your digital electronic system.
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Robust RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, COM, SPI, I2C, 2 LANs And DIO (2-in/1-out)
IFB125
The IFB125 is powered by the low-power Freescale i.MX6UL processor in the ARM® Cortex™-A7 micro architecture. It supports extended operating temperature ranging from -40°C to 70°C, and can withstand vibration up to 5G. Its flexible wide voltage range 9V - 48V DC power input with a lockable terminal block type connector also enhances its reliability in harsh environments. To meet most of Industrial IoT needs, the IFB125 supports multiple communication interfaces for maximum flexibility, including LAN, serial, USB, and digital I/O ports. The Industrial IoT gateway has 256MB onboard memory that features data transfer rates of DDR3-1600, as well as 4GB eMMC flash memory onboard for storage. This embedded IoT gateway platform is equipped with one PCI Express Mini Card slot and one SIM card slot. Additionally, it supports DB9 connectors with both SPI and I2C function as communication protocols to suit for specific applications
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16-Bit, 12 GSPS, RF DAC and Direct Digital Synthesizer
AD9164
The AD9164 is a high performance, 16-bit digital-to-analog converter (DAC) and direct digital synthesizer (DDS) that supports update rates to 6 GSPS. The DAC core is based on a quad-switch architecture coupled with a 2× interpolator filter that enables an effective DAC update rate of up to 12 GSPS in some modes. The high dynamic range and bandwidth makes these DACs ideally suited for the most demanding high speed radio frequency (RF) DAC applications. The DDS consists of a bank of 32, 32-bit numerically controlled oscillators (NCOs), each with its own phase accumulator. When combined with a 100 MHz serial peripheral interface (SPI) and fast hop modes, phase coherent fast frequency hopping (FFH) is enabled, with several modes to support multiple applications.
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1Gsps, 18 Channel, Logic Analyzer with Protocol Analyzer plugins and Hardware Compression
DigiView™ DV518
- Physical Channels: 18- Sample rate: 4ch@1 Gsps or 9ch@500Msps or 18ch@1Gsps (4 ch. are sampled every 1ns or 9 ch. are sampled every 2ns or 18 ch. are sammpled every 4ns)- Typical capture: 100M transitions (> 1B samples)- Hardware based triggers with 8 universal match circuits, and partitionable 16 stage sequencer- Adjustable Threshold (± 4V)- Real-time, Hardware-based, Adaptive Compression- Channels protected to ± 20V- Ground leads protected to ± 12V- High-quality test leads: 66 strand soft copper wires, flexible insulation, and gold plated connectors. Fit .025 square posts as well as the included clips.- Extra ESD protection- Streaming storage with auto fall-back to Store & Forward mode ensures large storage and reliability.- USB 3.0 (SS) or USB 2.0 (High Speed)- USB powered- Each DigiVIew includes all avialable Protocol Analyzer plugins (including: I2C, SPI, CAN, Async, Sync, 1-wire, I2S, TDM)- Free Plugin Developers' Kit- Requires Windows 7 or greater OS (32bit or 64bit)- Free Lifetime sofware updates.- 1 year warranty
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1Gsps, 9 Channel, Logic Analyzer with Protocol Analyzer plugins and Hardware Compression
DigiView™ DV509
- Physical Channels: 9- Sample rate: 4ch@1 Gsps or 9ch@500Msps (4 ch. are sampled every 1ns or 9 ch. are sampled every 2ns)- Typical capture: 100M transitions (> 1B samples)- Hardware based triggers with 8 universal match circuits, and partitionable 16 stage sequencer- Adjustable Threshold (± 4V)- Real-time, Hardware-based, Adaptive Compression- Channels protected to ± 20V- Ground leads protected to ± 12V- High-quality test leads: 66 strand soft copper wires, flexible insulation, and gold plated connectors. Fit .025 square posts as well as the included clips.- Extra ESD protection- Streaming storage with auto fall-back to Store & Forward mode ensures large storage and reliability.- USB 3.0 (SS) or USB 2.0 (High Speed)- USB powered- Each DigiVIew includes all avialable Protocol Analyzer plugins (including: I2C, SPI, CAN, Async, Sync, 1-wire, I2S, TDM)- Free Plugin Developers' Kit- Requires Windows 7 or greater OS (32bit or 64bit)- Free Lifetime sofware updates.- 1 year warranty
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3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
Saki's 3D SPI identifies critical defects and assists with process improvement.
