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Radar solution for fill level in DC & die casting
For quality control in DC casting (direct chill casting) and die casting, a continuous, high-precision level control of the steel and aluminum melt in the casting pit is required. Our radar sensors measure the filling level of molten steel, copper or aluminum in DC casting with a measurement accuracy in the sub-millimeter range – even at metal temperatures of up to 1600 degrees Celsius.
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Open-source CAD tool to simulate 2D and 3D-ICs.
IntSim v2.0
Simulate and optimize 2D and 3D-ICs. Pre-silicon estimates for die size, number of metal levels, size of each metal level and chip power.
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Gas Analysis
Our infrared gas detectors provide superior sensitivity and reliability that may be translated into a more effective early warning system when monitoring atmospheres for gases at trace levels. Our technology also offers the opportunity to perform sophisticated gas analysis. One example: To assure personal safety during a medical procedure, our gas detectors deliver a precise monitoring of the ratio of exhaled gases of a hospital patient who is under general anesthesiology. Another example, no canary need die in a mine if Dexter gas detectors are installed on the job. Infrared lead detectors, whether mobile or mounted, can be a critical element in your health and safety strategy at home and on the job, whatever life forms it is your responsibility to protect.
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Local and Lattice Stress Measurement
127 Raman
Local and Lattice Stress Measurement, Die level Topography for in-die and in-device stress and composition control.
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Mid-end
Growth in the advanced packaging market and the challenges raised by the various packaging types requires the highest level of inspection and metrology, ensuring high yields of each die as well as of the whole package.
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Ultra Broadband SSPA
Exodus Advanced Communications
Exodus Chip & Wire Hybrid ultra broadband amplifiers feature GaN, GaAsFET discrete die on ceramic substrate covering frequency ranges from 4GHz to 26.5GHz and power levels exceeding 500W.
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Ultrasonic Generators
F&K Physiktechnik develops and manufactures fully digital ultrasonic generators. Ultrasonic power levels are available for fine wire bonding as well as for heavy wire and die bonding applications. All generators could be used with our ultrasonic transducers, but also with third party transducers.
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Wafer/Chip/Package Semi-automated ESD Tester
400SW
Tokyo Electronics Trading Co., Ltd.
Semi-automated ESD tester featuring Ecdm 400E, Universal ESD Simulator. Used with a manual wafer probing system or a die manipulator, wafer or die level semi-auto ESD test can be done, as well as packaged device test. Damage is detected by V-I curve or leakage current change detection. Stress level and measurement points are programmed by personal computor via GP-IB. Once test terminals are selected, ESD endurance is automatically measured.
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Wafer Test
Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Probe Series
CAPELLA Series
MPI Photonics Automation is the industry leading provider of turnkey test solutions for the LED / Mini LED manufacturing industry. With more than 10,000 MPI probers installed worldwide, the CAPELLA series of probers have a proven track record of superior performance and reliability. The CAPELLA series probers support electrical and optical characterization of all LED product types (Vertical chip, Lateral chip, Flip-chip) from wafer to packaged die level. Whether you need a high-performance, cost-effective or specialty prober system, MPI PA has the most comprehensive range of LED wafer/chip probers to meet your exacting requirements.
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Moving Die Rheometer
SG-S05A
It tests the feature about vulcanization and searches for the best suitable vulcanization time.It adopts digital intelligent temperature-controller to adjust and sets easily.Its stability, reappear and accuracy is better than the general rotor rheometer.The microcomputer uses import CMOS chip which has high dependability.It draws、calculates and prints automatically,and has copy or blowwing up function. It adopts computer-control and interface to collect、store or deal with data and print test result .This machine's function is better than other types and shows high automatization features. It has functions about curve-comparing and blow up.It uses series of windows operation system flat and graphical software operation interface.The data is dealed with much truly.The user's test operation becomes faster, flexibly and protect conveniently.
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Paper Die Cutter
The Paper Die Cutter is used for preparing the standard specimens for ring crush test, tensile test or others. The precise cutting mechanism with a sharp blade is helpful to make your specimen easily.
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TOOL STACK (DIE)
CASTING AL PASTE
Pigmented paste, provided with:Elevated sliding power Very high anti-sticking capacityHigh consistency also at high process temperatures.
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Wafer & Die Inspection
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Die Cast Products
Astronics’ start-to-finish die casting, CNC, painting, and finishing provides customers with vertically-integrated manufacturing. Close collaboration between customers and our in-house multidisciplinary teams reduce manufacturing time and delivery lead times.
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Die Sorter Handler
4605-HTR
4605-HTR is a MAP Sorter which picks up devices from wafer ring and sorts to tape or bin according to the MAP file created by film frame test handler or prober. 4605-HTR is a high speed handling system, available for 12 inches wafer rings. When used in combination with 4170-IH, 4605-HTR much improves efficiency in testing process of leadless devices as a high speed sorting machine.
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DIE Sorting Tester
MS-100D
MS-100D has a very good architecture, with different probe card the same tester is able to test almost all DRAM DIE on the market, specially Mobile Low Power DRAM: LPDDR2, LPDDR3 & LPDDR4.
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Inspection System for Die Casting
X-eye 7000BS
Appropriate for medium•large size component inspection and detecting surface structure and defects(inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's reduced significantly and enables long-term use with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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Radarlösungen für die Bergbauindustrie
Mit OndoSense Radarsensoren steigern Sie die Produktivität Ihrer Bergbauanlagen und Minen, reduzieren ungeplante Wartungszeiten Ihrer Bergbaumaschinen und automatisieren die Arbeitsprozesse in der Industrie 4.0.
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Radarlösungen für die Landwirtschaft
OndoSense Radarsensoren tragen dazu bei, die Produktivität Ihrer Landmaschinen und den Ertrag Ihrer Felder zu erhöhen, den Einsatz von Dünger oder Pflanzenschutzmitteln zu verringern sowie Arbeitsprozesse in der Landwirtschaft zu automatisieren und zu optimieren.
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Drawing Die And Wire Measurement
Drawing Die Inspector DDI
Optik Elektronik Gerätetechnik GmbH
Special microscope setup for visual inspection of wire drawing dies.
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Drawing Die And Wire Measurement
DGMS – Die Geometry Measuring System
Optik Elektronik Gerätetechnik GmbH
Measuring system for diameter, roundness, reduction angle and bearing length of wire drawing dies.
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Drawing Die And Wire Measurement
Wire Diameter And Roundness Measurement
Optik Elektronik Gerätetechnik GmbH
The DGMS is a measuring system for diameter and roundness of wires, drawing dies and enameling dies. The wire diameter is measured highly accurate by an image processing system. To measure the roundness, an additional special holder is necessary to rotate the wire for the diameter measurement in several azimuths. The accuracy of the measurement is ‹1micron.
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Levels
ZAL200 Automatic Level Series
The GeoMax ZAL200 Series are dependable and durable tools, specifically designed for construction professionals.
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Levels
ZAL100 Automatic Level Series
The ZAL100 Auto Level Series is your guarantee to get the job done accurately and on time.
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Levels
ZAL300 Automatic Level Series
Get all your tasks done with GeoMax’s premium auto level. From daily leveling tasks to high accuracy, the ZAL300 Series is your first choice where robustness, comfort and accuracy count. It simply “works when you do!"
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Level Measurement & Level Sensors
With so many technologies, products and parameters to consider, selecting the best technology for level measurement can be challenging. Choose from the comprehensive Rosemount portfolio of level devices for the best solution for your level application.
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Patented DPEM Process for Die Removal
DPEM (Decapsulate Plastic Encapsulated Module) is DPACI’s patented Turn-Key Solution to replacement of obsolete high reliability devices in legacy systems. From dissolving the plastic encapsulation of a semiconductor device to re-bonding new wires onto a chip or package lead frame, complete solutions are offered. DPACI retains reliability test data as well as customer testimonials for the process and can share this information on a need-to-know basis.
