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Wafer Level Test Handler
Kronos
Wafer level test handler for 6/9DOF sensors with real stimulus. Very high UPH capacity and the lowest cost of test (COT). KRONOS is one of the only wafer level test solutions for motion sensors with real stimulus.
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Automated Wafer Handler up to 450mm
GPR-GB7S
The GB7S Robot System employs Genmark’s breakthrough and patented GPR™ Technology to achieve the highest level of performance currently available in an automated wafer handler which is capable of handling up to 450mm diameter wafers. The patented GPR technology enables the servo-controlled robot to interface compliantly and intelligently with misaligned cassettes, FOUPS and process modules, as well as provide software-controlled end-effector deflection compensation during transport of heavier payloads. The unique and patented YAW technology feature of the GPR-GB7S Robot System enables it to access in-line process modules, FOUPS and cassettes from a fixed centralized location, and eliminates the need for radial placement of process and other stations around the robot. The GB7 Robot System can have various arm configurations to accommodate a wide range of SMIF/cassettes front-end layouts.
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Equipment Front End Module Wafer Handler
Sigma EFEM
Integration transforms the bond tester into a fully automated system. We offer various types of EFEM (Equipment Front End Module) wafer handlers, to combine with a Sigma W12 for operator-free bond testing.
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ATOM Handler
The ATOM-IC Handler is a benchtop handler designed for use on engineering test floors and in development operations. Its innovative design allows for maximum flexibility and minimum cost and maintenance.
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Gravity Handler
State of the art model, which features a high throughput capability, eight sites, and high and low temperature measurements, and meets all high-frequence contact requirements. Complete measures to prevent jamming and lead deformation enable high availability. This model is highly regarded by top users around the world because of its high throughput and high reliability.
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MEMS Handler
4664-IH
The ULTRA P is a high performance production handler that provides thermal conditioning, full 6 DOF mechanical stimulus and an electrical ATE signal path for testing Micro-Electro-Mechanical Systems (MEMS) Accelerometers and Gyroscopes.
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Test Handler
M4841
High-Throughput Device Handler for Volume Production Testing of MCUs and DSPs.
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Test Handler
ETH
The ENGMATEC test handler as the "heart" of our inline test solutions impresses with its wide range of applications for in-circuit, functional or final tests. All components of the modular system are coordinated with one another and can be combined with one another and with various production systems. Vision systems, scanners, marking devices and many other functions can be integrated.
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Test Handler
Logic Family
To meet the demands of this diverse set of end-user requirements and to keep their products differentiated from the competition, device manufacturers continually pursue new technologies, and there are now over 100 IC package types offered. To this end, with time-to-market a critical measure for success, device manufacturers are seeking ways to get better performance from their equipment, while reducing the production time and labor associated with frequent changes in package types.
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Test Handler
JOT M5
Simple, cost-effective way to automate PCB and pallet based testingSafe, reliable product handlingQuick-adjust ease: no product-specific partsFaster handling of smart productsIndustry 4.0 autonomous interconnectivityTruly scalable for growing test needsReusable, application-specific test boxesM-TestBoxes compatible with M1 handlerBoxes are fully independent, just pull out from M5 rack and use in off-line testingFail product separation to integrated magazineSpacious service-friendly constructionErgonomic workspaceTouchscreen UI with base statistics and service capabilityEasy start-stop operabilityAutomated width adjustment
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Test Handler
M4872
Improve Efficiency in High-Volume Manufacturing and Device Characterization.
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Test Handler
Memory Family
As semiconductors proliferate and continue to increase in complexity, they are found in an ever-expanding array of state-of-the-art applications, including PCs, digital appliances, mobile devices, and automobiles. To meet the demands of this diverse set of end-user requirements and to keep their products differentiated from the competition, device manufacturers continually pursue new technologies, and there are now over 100 IC package types offered. To this end, with time-to-market a critical measure for success, device manufacturers are seeking ways to get better performance from their equipment, while reducing the production time and labor associated with frequent changes in package types.
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Test Handler
M6242
Optimal Test Handler for Mass-Production DRAM, with Double the Throughput.
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Test Handler
M4171
Advantest’s M4171 single-site handler combines these capabilities in a portable design that is ideally suited for use in engineering environments.
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Test Handlers
Boston Semi Equipment test handlers are designed for optimum production performance on your test floor.
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Test Handlers
Multitest Elektronische Systeme GmbH
Multitest has more than 30 years of experience in device handling. Our broad portfolio ensures the most efficient solution for your test application including:*leaded and leadless devices*singulated packages and packages in strips*tri-temp test*MEMS test
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Wafer Analyzer
RAMANdrive
RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
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Wafer Bonder
AML
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Wafer Chucks
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Wafer Chucks
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Wafer Manufacturing
Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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WAFER MVM-SEM
E3300 Family
The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Wafer Prober
Prexa MS
The latest fully automated 300mm wafer prober for memory devices. Featuring high rigidity and exceptional thermal control, the system enables full-wafer contact testing.
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Wafer Prober
Precio octo
200mm wafer prober. The system adapts ultra-high speed indexing and high-speed wafer exchange functions to reduce test cost and improve overall equipment effectiveness (OEE) markedly enhancing productivity.
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Wafer Prober
Prexa
The latest fully automated 300mm wafer prober. The system offers excellent productivity and advanced functions, contributing to KGD (known good die) testing for advanced packaging.
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Wafer Prober
Precio XL
Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Wafer Probers
Full Automatic Wafer Prober. Semi Automatic Wafer Prober. High Current Probe Block. 6-inch Manual Prober. 8-inch Manual Prober. 12-inch Manual Prober.
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Wafer Sort
TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
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