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3D SPI
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
See Also: 3D Solder Paste Inspection
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3D SPI
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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3D SPI Series
MS-11e
- Exclusive15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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3D SPI Series
MS-15
- Exclusive 15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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3D Solder Paste Inspection (SPI)
Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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3D Solder Paste Inspection (SPI)
TR7007 SII
Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
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5D SPI
On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
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3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
Saki's 3D SPI identifies critical defects and assists with process improvement.
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Dual Projection 3D In-Line Solder Inspection System
KY8030-2
The new KY8030-2 delivers 2x fasterinspection without compromising performanceand accuracy.Using patented dual projection, the systemeliminates the critical Shadow problem thatall 3D SPI systems can be vulnerable to.Easy UI and SPC Plus are included in the systempackage in order to help users achieve faster& easier printer process optimization
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CyberOptics SE Series
SE Series
The CyberOptics SE Series offers the most accurate and repeatable, high speed 3D solder paste inspection in the market today. Utilizing the most advanced sensing technology, CyberOptics SPI products will provide manufacturers the reliability needed to compliment your overall screen print process improvement strategy.
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Solder Paste Inspection System
KY8030-3
The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
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SPI Isolators
SPI (Serial peripheral interface) is one of the most widely used interfaces between microcontrollers and peripheral ICs such as sensors, ADCs, DACs, shift registers, SRAM, and others. Analog Devices has your isolated SPI bus covered with our dedicated SPI digital isolators which support this synchronous, full duplex master-slave-based interface. Options include devices built with ADI's proven iCoupler® technology and offering a small footprint, simple design-in, fast speeds, and high data integrity, as well as integrated µModules which require no external components. Our SPI isolator solutions increase performance and reduce board space. This simple, compact solution is ideal for isolated SPI data requiring communication across different ground potentials or through large common mode transients often found in Industrial PLCs (programmable logic controllers) and Instrumentation and data acquisition systems.
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SPI | AOI | AXI
Suitable for a wide variety of SMT applications, Omron’s automated inspection solutions are designed to ensure the highest degree of quality and consistency in PCB production.
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AOI & SPI Test Systems
Xceed AOI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The Xceed enables true 3D measurement and provides the most accurate and repeatable inspection results with the minimum false calls. It’s designed with Advanced Signal Processing which gives results in noise-less, clear, and accurate 3D images.
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AOI & SPI Test Systems
To keep the quality of your production at its best you need a good inspection of your boards. For efficient and detailed in-depth board inspection ensure you have SMT inspection equipment that meets your needs. Our AOI & SPI units will provide the quality you need for reliable inspection of soldering inspection.
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AOI & SPI, Test Systems
SigmaX SPI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The SigmaXs inspection technology is unaffected by varying materials, surface conditions, or colors. The system profiles the board to generate accurate 3D shapes far superior to other brands and technologies.
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TTL/I2C/SPI Expansion Kit
OP-SB85L
OP-SB85L is the interface expansion kit that has a port to measure TTL / CMOS signal level communications, and the one to measure the voltage of high-speed analog input. The port for TTL / CMOS supports the measurement of TTL / CMOS level communications that power supply system is from 1.8V to 5V. It is suitable for monitoring the communication between the LSI and the interface IC on the printed circuit board by directly probing into the lines. It supports the protocol of not only UART and HDLC but also I2C and SPI on monitoring and simulating.
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TTL/I2C/SPI* Expansion Kit
OP-SB5GL
OP-SB5GL is the interface expansion kit that has a port to measure RS-232C(V.24) and a port to measure the TTL / CMOS signal level communications. The port for TTL / CMOS supports the measurement of TTL / CMOS level communications that power supply system is from 1.8V to 5V. It is suitable for monitoring the communications between the LSI and the interface IC on the printed circuit board by directly probing into the lines. It supports the protocol of not only UART and HDLC but also I2C and SPI* on monitoring and simulating.
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USB/RS232/SPI Programmable Attenuator
RUDAT-13G-90
Mini-Circuits’ RUDAT-13G-90 is a general purpose programmable RF attenuator supporting frequencies from 10 to 13000 MHz with attenuation from 0 to 90 dB in 0.5 dB steps. Its unique design maintains linear attenuation change per dB, even at the highest attenuation and frequency settings. The attenuator is controlled via USB, RS232 or SPI. It comes housed in a compact, shielded metal case with SMA(F) input/ output RF ports (RF ports are interchangeable), a USB type Mini-B socket, and a 9-pin D-sub(F) RS232 and SPI port. Power can be supplied via either USB or the D-sub port. The RUDAT-13G-90 is supplied with our easy-to-install, user-friendly GUI software, API objects for Windows® environments, and complete programming instructions for 32 and 64 bit Windows® and Linux® operating systems. See p. 9 for a complete list of included accessories.
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3D Antennas
A 3D capable printing technology designed to create printed electronics directly on 3D surfaces using modern software controlled digital process.
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3D AOI
Zenith2
Zenith 2 AOI platform, which provides the AI-driven Auto Programming for rapid job programming. The Zenith 2 also combines Koh Young’s advanced vision algorithms with innovative high-resolution optics. The latest platform expands inspection capabilities, delivering best-in-class performance, functionality, and accessibility. Koh Young’s side-view solution allows Zenith 2 to quickly detect and analyze defects on a wide range of mounted components and chips.
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3D AOI
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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3D Bundle
Cost effective bundle of eVision's 3D librariesIncludes Easy3D, Easy3DLaserLine, Easy3DObject and Easy3DMatch
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3D Camera
The ARAMIS 3D Camera is a measuring system for full-field and point-based measurements. With a high resolution of 6 megapixels and a maximum image recording rate of 25 Hz at full resolution, the sensor is suited for medium-fast applications in the field materials and components testing. In a different configuration with a resolution of 2.3 megapixels and a maximum image recording rate of 130 Hz at full resolution expands the range of applications. The ARAMIS 3D Camera is employed in general research and industrial applications for measurements of small specimens up to large objects.
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3D Cameras
*Visual assessment of distance, level or volume*Time-of-flight measurement principle*Illumination, measurement and evaluation in one unit*Output of distance and grey values*Integration by means of intuitive parameter setting software
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3D Design
Rapid Design Exploration. Created for design engineering workflows, our intuitive product design software generates a fast user experience. Rapid design exploration includes detailed insight into real-world product performance. Live physics and accurate high-fidelity simulation combine into an easy-to-use interface that supports faster-time-to-market.
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3D Design
The power of 3D Design keeps JGB on the cutting edge of system design, while giving more options to our customers in terms of mounting and customization.
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3D Geo-Magnetometer
For the measurement of magnetic equilibria such as the earth's magnetic field, for the determination of anomalies and biologically active location factors. Three highly sensitive magnetic field sensors, as well as a dedicated microprocessor, are integrated into the measuring probe. The sensitive magnetic field sensor is connected to a PC, notebook or laptop (not included). The main features in brief:
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3D LaservScanners
With unsurpassed accuracy and scan quality API’s Hemispherical Scanner is ideal for use Building Information Modeling (BIM), historical preservation and forensics.
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3D Measurement
PSD-Array
The PSD array consists of 16 parallel one-dimensional PSD elements on the same chip. By utilizing the triangulation technique the reflection of a laser line or multiple laser spots onto the PSD array will provide information about the contour of the illuminated object. The possibility for simultaneous readout of the 16 elements together with the fast response of each element makes the PSD array suitable for applications like high speed 3D contour measurements and measurements of parallel, moving objects such as cantilevers.
