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Failure Analysis
A partial list of our state of the art test equipment, applicable to these testing disciplines, will include the following: Two Scanning Electron Microscopes with EDS (SEM/EDS) Three Differential Scanning Calorimeters (DSC) Three Thermogravimetric Analyzers (TGA) Three Thermo Mechanical Analyzers (TMA) One Dynamic Mechanical Analyzer (DMA) Two Real-Time Fluoroscopic X-ray Systems, including a Microfocus System One Fourier Transform Infrared Microscope (FTIR) (capable of identifying a single particle of an unknown material) Two Ion Chromatographs (IC) (capable of identifying ionic impurities in ppm)
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Failure Analysis
MicroINSPECT 300FA
The MicroINSPECT 300FA is an automated wafer inspection tool used for semiconductor wafer failure analysis. Its small footprint, high speed, and low cost relative to its rich features yield a superb cost of ownership and makes this an ideal tool for your fab or failure analysis lab. The MicroINSPECT 300FA combines advanced robotics, wafer sorting, an intelligent wafer inspection microscope together with SiteVIEW Software to produce an integrated failure analysis tool.
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Failure Analysis
Failure analysis on electronic components is a continuous challenging task. The smaller transistor dimensions, increasing functional complexity and changing device packaging styles requires new tools and skills for sample preparation, fault localization techniques, high resolution imaging and analysis.
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Failure Analysis
Failure Analysis (FA) plays a crucial role in the production of semiconductors. It provides process and design feedback to determine the root cause of any failures. Time-to-data for the FA Engineer is a critical measurement and SemiProbe’s Probe System for Life ® (PS4L) is ideally suited to excel in this application. All key components are interchangeable, making it easy to switch between individual die, wafers, and packaged parts.
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Partial Load Failure
PLF Device
The control device series “PLF” has been designed to monitor the partial and/ or total failure of the alternating current absorbed by loads driven by static switches and / or electromechanical relays.
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Failure Analysis – Materials
Failure analysis – materials is the investigation into the background or history of a sample, or an event, to determine why a particular failure occurred. A product failure may include premature breakage, discoloration or even an unexpected odor. It is useful to know if this failure is a new, unique occurrence or if it has been an ongoing issue. The investigation can involve analyzing the sample as it currently exists and extrapolating from that data what may have caused the failure. A sample of the “good” vs. “bad” product may also be useful for comparison purposes.
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Failure Analysis Services
Introducing our Failure Analysis services partner, close neighbour and collaborator NanoScope Services. Working together with NanoScope we offer the following portfolio of advanced FA services.
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Failure Analysis Services
Innovative Circuits Engineering, inc
Innovative circuits engineerin's failure analysis group performs root cause analysis on a wide variety of integrated circuit devices.
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Failure Analysis Services
BMP Testing and Calibration Services Inc.
Failure analysis plays a crucial role in product development that enables industries to prevent future product failures and improve them for the end-user. It’s a multi-faceted approach to finding how and why a product failed and involves an in-depth investigation of the circumstances surrounding the failure and discovery of relevant background information, including but not limited to the type of application, environmental factors, service life, and pertinent design information.
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Failure and Technology Analysis
Failure analyses in order to clarify the failure cause soonest possible.From single device to the whole system - and from highly complex IC up to printed circuit board (PCB), mounting & interconnection technology and printed board assembly (PBA).
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Fatigue Failure Tester
EKT-2002FF
EKT-2002FF Flexing Fatigue Tester is designed in accordance with ASTM D4482 to test the fatigue life under a tensile strain cycle on different kinds of vulcanized rubber compound to determine the fatigue life at various extension ratios.
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Benchmark, Competitive and Failure Analysis
Helping you determine the root cause of product failures and evaluate products against industry competition and standards.We provide third-party verification and support for claims related to performance versus competition, root product failure cause, and benchmark industry performance. As an independent laboratory with over 60 years of product testing experience, our expertise helps you evaluate products for a variety of performance related characteristics. Additionally, we can provide expert witness legal testimony for insurance claims, CPSC filings, and civil/criminal court cases through our testing results and data.
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Electronics Failure Analysis System
Sentris
Due to the continued decrease in integrated circuit feature size and supply voltages, detecting and locating the miniscule amount of heat generated by failure sites has become increasingly difficult. Sentris pinpoints low-level infrared thermal emissions from IC faults such as short circuits and leakage current.
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Failure Analyziz and Quality Assurance
NX20
There's no room for error in the data provided by your instruments. Park NX20, with its reputation as the world's most accurate large sample AFM, is rated so highly in the semiconductor and hard disk industry for its data accuracy.
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Root Cause Failure Analysis
Maintenance Reliability Group, LLC
Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of grease from failed component and visual inspection for Root Cause Analysis.Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of grease from failed component and visual inspection for Root Cause Analysis.
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Failure Analysis And Magnetic Imaging Services
Micro Magnetics offers failure analysis services on a contractual basis. We maintain two current density metrology systems at our headquarters in Fall River and can produce maps of current flow in a wide variety of ICs and packages, usually with initial results delivered within 48 hours. Our engineers will work closely with you to understand and interpret the results in order to determine the root cause of the failure.
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Destructive Physical Analysis & Failure Analysis
DPACI's component analysis laboratory performs major analytical functions, such as destructive physical analysis, failure analysis, counterfeit analysis, and material analysis on components & devices. Our destructive physical analysis techniques are performed in accordance with standards and methods used in most military and space program requirements. Solutions for difficult production problems are resolved through our failure analysis procedures.
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Materials, Structure, Surface, and failure analysis Services
Materials Analysis Technology Inc.
MA-tek provides wide span of materials analysis, structure analysis, surface analysis, and failure analysis. By technology segment, MA-tek provides 9 major service lines:1. Electrical Failure Analysis (EFA). 2. Physical Failure Analysis (PFA). 3. Structure Analysis. 4. Surface Analysis. 5. FIB Circuit Editing6. Reliability Testing. 7. Reverse Engineering of Benchmark Analysis. 8. IP Consultancy. 9. Quality Management Training Course.
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GPS Master Clock
Signals & Systems India Private Limited
GPS Master Clock System – MCS-GPSMC-1010 is a 3U Card rack type, 19” Rack-mountable Redundant GPS Time Server which synchronizes and maintains the timing and frequency requirement of power and process industry equipment using a signal obtained from any one of the sources like GPS or GLONASS or Time protocols such as NTP and IRIG. It distributing the same time signal through several types of interfaces. It provides redundancy for Power and GPS receiver to increase reliability and offers protection against time synchronization failure. The system is field-upgradeable and an extremely flexible system, designed to handle time synchronization requirements today and in the future. It provides nanosecond accuracy when external time references are not available. It has a storage facility to store the system log file. It delivers NTP, SNTP, IRIG-B, PFC-Pulse, DCF77, BCD parallel data, Ethernet Fiber Optic & RS485/RS232 outputs. System enables configuration and monitoring through Web-based application. It supports a wide range of power supply either 90V-260V AC/DC or 18-36VDC or 36V-72VDC. Power supply model can be mixed and matched as required by the user, depending upon power supply options available at the installation site.
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Grease Analysis
Maintenance Reliability Group, LLC
MRG Labs follows grease sampling and analysis standards outlined in ASTM D7718 and ASTM D7918. Grease analysis is a valuable tool for determining the condition of the lubricant and discovering abnormal conditions in equipment that may otherwise lead to unexpected failures. Our customized grease test slates are designed to identify the specific failure modes that may be damaging the component.
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Half Slim SATA3 RunCore Embedded SATA3 “Elite Series”
RunCore Innovation Technology Co. Ltd.
Half Slim SATA3 utilizes high-performance SATAIII SSD controller and NAND flash, with or with no DRAM buffer to support power failure mechanism. This series SSD compliant with Serial ATA Revision 2.6/3.1 specification, compatible with 6.0Gbps, 3.0Gbps and 1.5Gbps interface rate and support Native Command Queuing (NCQ) up to 32 commands. As a standard SATA drive, it can support mainstream OS, such as Windows/Linux/Unix/Solaris/ Mac OS and so on.
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Halt Hass Chambers
HALT and HASS chambers from WEIBER provide extreme temperature & vibration capabilities used during the product design and manufacturing cycles to compress the time normally required to identify design and process weaknesses. HALT techniques are important in uncovering many of the weak links inherent to the design and fabrication process of a new product. HASS techniques are incorporated during the production phase to find manufacturing process defects that could cause product failures in the field.
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HALT – Highly Accelerated Life Test
HALT is a process used on electronic assemblies and modules to determine weaknesses and the stress limits of a product by temperature cycling and omni-axial random vibration step stress. Inherent weaknesses in a products design and build are stimulated by applying increasing levels of mechanical stress. Within an accelerated timescale, faults in a product can be realised prior to product release and preventing failures occurring during after-sale user operation, very often during the warranty period.
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Hamburg Wheel-Tracking Tester
The Hamburg Wheel-Tracking Tester is used to test submerged, compacted Hot Mix or Warm Mix Asphalt specimens as per standard.The device consists of a reciprocating wheel that is rolled over the specimens while measuring the rate of permanent deformation. A constant load of 705 N ±4.5 N is applied to the specimens with a sinusoidal wheel speed of 1 ft/sec in a constant temperature controlled water bath up to 70 °C (± 1.0 °C). An LVDT jig is used for continuous measurement of permanent deformation along the path of the rolling wheel. Accommodates cylindrical or slab specimensSoftware for automatic determination of Stripping inflection PointNumber of passes to SIP, number of passes to failure and other calculated parametersStainless steel construction with temperature controlled water bath up to 70ºC
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Handheld Singlemode Multimode
OTDR X60
Palm OTDR X-60 is a very reliable and good performance OTDR, it can measure the optical fiber length, transmission attenuation of optical fiber, attenuation of splice, and failure location, etc accurately. It is widely used in the maintenance, construction and monitoring of cable line.
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Handheld Turns Ratio & Winding Resistance Tester
TWR-H Series
Handheld TWR-H device is DV Power single-phase instrument designed for measuring transformer winding resistance and turns ratio.The instrument has two output DC sources for measuring transformer winding resistance. The first DC source can output up to 2 A DC and is used for injecting current to the transformer’s high voltage winding. The second DC source can output up to 10 A DC and is used for testing the transformer’s low voltage winding. This is especially useful when measuring winding resistance of distribution transformers. These transformers have large turns ratio and therefore a big difference between resistances of high voltage and low voltage windings. Upon the winding resistance test, it is also possible to demagnetize the transformer core. The demagnetization process is completely automatic and safe.Together with the turns ratio, the instrument also measures excitation current and phase shift. This enables detecting transformer core or winding turns failures which cannot be spotted by measuring turns ratio only. The instrument can output test voltage up to 40 V AC for this test, but it can also output a very low test voltage of 1 V AC which is necessary for turns ratio verification of the majority of current transformers.TWR-H is powered by an internal Li-Ion battery. Up to 100 tests can be performed with a fully charged battery.
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HASS / HALT Chamber
Typhoon 4.0 PLUS
This system is designed specifically for the task of performing Highly Accelerated Stress Screening (HASS) and HALT on large products. With the Lowest Total Cost of Ownership within the AST industry, the 48" x 48" vibration table is capable of supporting hundreds of pounds of products and fixturing, and delivers more energy in the lower frequency ranges necessary to stimulate failures in these large products.
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HDMI Phy and Protocol Aux Channel Analyzer Module
The Teledyne LeCroy quantumdata 980 HDMI Phy & Protocol Aux Channel Analyzer module supports compliance testing of the HDMI DDC bus and HDMI 2.0 CEC testing (partial support only). The module’s CEC compliance tests enable you to identify compliance failures early in the development cycle. The solution is ideal for pre-testing and self-testing (where permitted) your HDMI 2.0 device. The module also supports compliance testing of the HDMI DDC bus voltage and timing parameters in accordance with HDMI 1.4b. Future releases of the module will support functional tests and compliance tests on other HDMI auxiliary channels.
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HD-SDI/ASI Input+output With Relay Bypass For PCIe
DTA-2175
A general-purpose HD-SDI input and output, both ASI capable. A relay automatically connects input port to output port upon software- or hardware failures, enabling highly-available system configurations without requiring a failover switch.
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Helicopter FADECs
The EMC-100 is dual channel Full Authority Digital Engine Control (FADEC) system, designed for helicopter turboshaft engines. The electronic control unit’s (ECU) primary channel provides precise engine power management and rotor speed control throughout the operational range of the engine. The reversionary backup channel provides full mission capability should a primary system failure occur.
