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Memory Test System
T5230
T5230 memory test system for NAND/NVM devices adopts a combined array architecture to achieve best-in-class cost-of-test performance for wafer test, including wafer-level burn-in (WLBI) and built-in self-test (BIST). The system can perform on-wafer test of 1,024 memory devices per test head in parallel, delivering high productivity and enabling floor space savings of up to 86%. Multiple test cells are connected per system controller in the T5230, allowing independent wafer test of each test cell. The test cells can be stored in a general multi-wafer prober while minimizing the test cell floor space, and the tester can be docked with probers in both linear and multi-stack configurations. For functional tests at a maximum test rate of 125MHz/250Mbps, the T5230 assures high timing accuracy, repeatability, and failure detection capability.
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Memory Test System
T5835
The new T5835 has full testing functionality, from package testing to high-speed wafer testing, for any memory ICs with operating speeds up to 5.4 Gbps, including all next-generation memories from NAND flash devices to DDR-DRAM and LPDDR-DRAM. It can handle 768 devices simultaneously for final package-level testing. It additionally features functions such as an enhanced programmable power supply (PPS) for advanced mobile memories, and a real-time DQS vs. DQ function to improve yield.
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Memory Test System
T5511
Offering Multi-functionality and Industry's Top Test Speed of 8Gbps.
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Memory Test System
T5851/T5851ES
The T5851 system is designed to provide a cost-effective test solution for evaluating high-speed protocol NAND flash memories including UFS3.0 universal flash storage and PCIe Gen 4 NVMe solid-state drives (SSD), both of which are expected to be in high demand for the LTE 5G communications market.
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Memory Test System
T5831/T5831ES
High-productivity tester achieves low cost-of-test by performing massive parallel testing of NAND Flash and MCPs for SSDs and mobile applications
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Memory Test System
T5830/T5830ES
Highly flexible tester which has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories
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Memory Test System
T5833/T5833ES
T5833 system is a cost-efficient, high-volume test solution capable of performing both wafer sort and final test of DRAM and NAND flash memory devices. Amid surging sales of mobile electronics, DRAMs, NAND flash memories and multi-chip packages (MCPs) — the main device types used in smart phones and tablets — are quickly evolving toward higher speeds and greater device capacity. Internet and cloud servers also are driving demand for faster, higher-capacity ICs. Yet the cost of testing today's wide array of memory devices is an obstacle for chipmakers, which urgently require solutions that can deliver high functionality, high performance and low cost of test (COT). Advantest's new, multifunctional T5833 memory test system meets these needs, delivering both wafer sort and final test capabilities for a full range of memory devices, including LPDDR3-DRAMs, high-speed NAND flash memories and next-generation non-volatile memory ICs.
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Memory Test Systems
T5503HS2
Semiconductor memories are in high demand to meet the needs of fast-growing end markets such as portable electronics and servers. It has been forecasted that applications ranging from mobile devices and data centers to automobiles, gaming systems and graphics cards will consume an estimated 120 billion gigabits of DRAM capacity. To meet this market demand, new generations of memories with data-transfer speeds of 6.4 Gbps and higher are being developed. Advantest’s second-generation T5503HS2 tester is designed to handle these ultra-high-speed memory ICs.
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Flash Memory Test System
T5830
T5830 memory tester, the latest member of its T5800 product family, optimized for testing a wide range of flash memory devices used in mobile electronic devices. The highly flexible T5830 tester has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories.
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Memory Burn-In Test
The N3500 is Neosem Technology’s fourth generation memory test system. Specifically designed for Flash Components and Flash Cards, the N3500 tester-on-a-board architecture targets the broadest range of DUT technologies in various form factors and packages. Each Tester Board (or “Blade”) contains 288 I/O pins and 32 DPS supplies.
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High-Speed Memory Test Solution
UltraFLEX-M
The UltraFLEX-M builds on the advanced test technology and architecture of the proven UltraFLEX test system to ensure high test quality at the lowest cost of test for high-speed memory devices.
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Semiconductor Memory Tester
T5851
Advantest Corporation has introduced the T5851 system, designed to provide a cost-effective test solution for high-performance universal flash storage (UFS) devices and PCIe BGA solid-state drives (SSDs) memory ICs in high demand by makers of low-power, mobile applications such as smart phones, tablets and ultra-portable laptops. The flexible T5851 tester is available in both production and engineering models. This allows the system to be used for reliability and qualification testing as well as test-program development or, when equipped with an automated component handler such as Advantest''''s M6242, high-volume production. As a fully integrated, system-level test solution, the T5851 provides multi-protocol support in one tool while its tester-per-DUT architecture and proprietary hardware accelerator allow it to achieve industry-leading test times.
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Flash Device Test System
MS7208
The MS7208 system can test a wide range of device families including – but not limited to – NAND flash, NOR flash, multi-level flash, multi-die flash, EEPROM, RAM, and mixed-technology memory devices.
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Full Wafer Test System
FOX-1P
Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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Multi-Wafer Test & Burn-in System
FOX-XP
The key features of the new FOX-XP test cell that contribute to the cost-effectiveness of the solution include the ability to provide up to 2,048 "Universal Channels" per wafer, which allows the system to test all the devices on the wafer in parallel. The new "Universal Channel" architecture allows any channel to be any function (I/O, Device Power Supply (DPS) or Per-pin Precision Measurement Unit (PPMU)). This enhanced architecture now allows customers to perform per pin parametric testing, more extensive digital pattern test with deeper data stimulus / capture memory (32M per pin), and deeper scan (768M) optimized for BIST/DFT testing.
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Single Event Effects Test System
SEE-RAD
The SEE-RAD test system brings together the proven features of our ETS780 tester (such as true APG memory test and powerful FA tools) with the newest technology of the Griffin III. With all new high-accuracy DC Parametrics, superior precision pin drivers, and capture memory of 64M, the Griffin SEE-RAD combines the newest innovations in the test industry with our years of experience in Radiation Test.
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Audio Test Software
1. Distortion free stimulus even the equalized stimulus.2. Unlimited channels acquisition and processing. (Hardware limited)3. Human correlated listening test(Bark Scale intensity chart). (Requires large memory)4. Hi Res intensity chart for buzz/pop detection. (Requires large memory)5. Auto equalization method with target dBSPL accuracy.6. TCP client for test framework integration.7. Easy limits and logs development.8. Easy logs visualization module.9. Auto waveform alignment and triggering.(Upto single point alignment accuracy)10. Easy regression testing via TCP client.11. Standard Magnitude, Phase, THD, THD+N, Rubb&Buzz, Pink Noise, Noise Tests.12. Unlimited calibrations and equalization for scaling to different products and stations.13. Lowest test system and test sequence development times.14. Requires minimal training and debugging.15. Automatically avoid Reference speaker play and stop pops.16. WMD/ASIO driver compatible sound cards supported.(B&K 3670 recommended)
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Digital Test Hammers
James Instruments? digital test hammers are an advanced, completely automated system for estimating concrete compressive strength. Its calculation, memory and recording functions allow for quick, easy and accurate test results.
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JTAG Functional Test
JFT
JFT comprises a series of software modules that support boundary-scan test and programming activities under Python, National Instruments LabVIEW and Microsoft .NET framework. Using JFT users can create JTAG/boundary-scan test application scripts, VIs or programs for PCB assemblies and systems that control individual driver/sensor pins, groups of pins declared as variables or register bits. These applications are typically used to test logic devices or mixed signal clusters and can also be transformed into re-usable test 'modules'. Pairing JFT with JTAG CoreCommander emulative test modules gives an effective, low-cost system for performing tests through embedded device peripherals (ADCs, Memory Controllers etc..)
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3U PXI-E System Controller
PX32101
LinkedHope Intelligent Technologies Co.,Ltd.
PX32101 is a 3U PXI-E system controller based on the newest Intel® Haswell platform. It is designed to provide comprehensive and reliable system controller to support hybrid PXIe-based systems for multiple environments test and measurement applications.Hybrid PXIe-based systems are often required to complete independent diversified complex testing tasks on the PXI test platform. PX32101 provides rich interfaces: 4 USB2.0 / 3.0 for peripheral connectivities; UART for communication or control equipment; dual 1000Base-T Ethernet, one port for LAN connection and the other one for the control of the next generation of LXI instruments. PX32101 can support 4 x4 or two PCIe x8-link, and up to 16GB / s system bandwidth. The ExpressCard 34 expansion slots on the front panel allow users to expand the system modules flexibly. If you install a hybrid multi-slot backplane in the system, then various standard PXI-E and PXI / CPCI peripheral cards could be fitted. In a multitasking environment, PX32101 processor is able to complete multiple tasks independently. The CPU and memory chips soldered with PCB increase reliability performance in shock and vibration environments. Combined with a variety of instrument control interfaces and reliable mechanical & electronic design, PX32101 can meet your hybrid PXIe-based testing for system application requirements perfectly.
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System Control Modules for 34980A
The 34980A System and Control modules provide additional measurement and control capabilities that are typically used in test applications. Choose from modules that include digital I/O with programmable polarity, D/A converter with onboard memory to create waveforms, and frequency counter/totalizers.
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Flex Socket Test Module
JT 2127/Flex Socket Test Module
The JT 2127/Flex STM memory socket tester is a family of hardware adapters specifically designed for the testing of of PCB-mounted DIMM & SODIMM sockets using a JTAG/boundary-scan controller and supporting software. The testing of memory sockets has always been troublesome for test and production engineers using JTAG/boundary-scan systems. Even when it is possible to create memory writes/reads from a boundary-scan compliant access device on the UUT (Unit Under Test), the initialization process may fail leaving you with little diagnostics information. What’s more it can still be uncertain whether fault lays with the DIMM module itself or the socket. Using the new JT 2127-Flex system from JTAG Technologies you get pin-point diagnostics from a known-good test interface so you can be certain that your socket is soldered correctly.
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Premier Diagnostic Test Meter
PDSMP50-2-01-15-CAN
Parker's SensoControl Service Master Plus diagnostic test kits are the premier choice for measuring, recording and analyzing critical system data for any hydraulic or pneumatic system. Up to 1 billion data points memory storage.
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AFDX®/ARINC664P7 Modules
AIM’s AFDX®/ARINC664P7 test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with multiple processors for real time bus protocol and application support, massive memory and IRIG-B time code encoder/decoder functions are standard. Versions are available to support the Boeing specific ARINC664P7 extensions.
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Aircraft Escape Spares/Repairs
As the OEM of all of our products, both end items and support equipment, Teledyne can support all repair needs for end users. Turn-around times are typically less than 90 days with units being returned fully tested to their specific program requirements. All repairs are performed using new materials and components. Once the repair has been received, and purchase order issued, a Test and Evaluation report is sent to the end user fully describing our findings and the proposed repair.Following live ejections, Teledyne will download and prepare a post ejection report for any of our ejection seat sequencers AT NO COST to the end user. This report will document the data stored in the flash memory of the unit. The data will be a representation of what the sequencer recorded. However, Teledyne is unable to give any opinions or technical advice on the operation of the seat system.
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ARINC 429 Bus Interfaces
AIM’s > ARINC 429 test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with multiple processors for real time bus protocol and application support, massive memory and IRIG-B time code encoder/decoder functions are standard. The latest versions also support avionics discrete I/O.
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ARINC818 Cards
> ARINC818 is a specification which has become an Industry standard for the transmission of uncompressed digital video. This commercial standard uses Fibre Channel as a point-to-point communication link for low latency with the ARINC818 defining the packetized protocol for transmission of the digital video information. It is highly flexible and can be used for a variety of onboard display systems in both commercial and military applications. AIM’s ARINC818 cards use our field proven Common Core hardware design giving the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with one dual core RISC processor per port, massive DDR3 memory and IRIG-B time encoder/decoder functions are standard. The ARINC818 modules are available in PCIe formats.The new ultra high performance intelligent 4-lane PCIe 2.0 interface modules offer 2 ports with full function test, simulation, monitoring and analyzer functions for ARINC818 interfaces. The dual core processor provides onboard processing and data transfer capabilities for the most demanding applications including ARINC818 support done on board level. Large and high data throughput DDR3 RAM is accessible for the onboard processor as is a high performance FPGA implementing the customized ARINC818 Interfaces enabling the board to analyze incoming data in real time. Each module provides 2 ARINC818 compliant ports. SFP cages make it suitable for different media types as optical or electrical network technologies. Each module is delivered with a Board Support Package (BSP) containing the onboard driver software, a full Application Programming Interface (API) and detailed getting started and programming guides. Powerful PBA.pro databus test and analysis software is optionally available for all our ARINC818 cards.
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Audio Generator & Impedance Meter
MR-PRO/MR2
The Minirator MR-PRO provides a full set of analog audio signals including sine wave, pink noise, white noise, delay test signal, polarity test signal, stepped sweep and continuous sine sweep. Further, a set of wav-files, useful for system optimization, is stored in the internal flash memory. Add your own personal favorites to this set.
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Auto Wire Integrated Tester Series
LX-1024A+
Shenzhen Lian Xin Technology Co., Ltd.
The system provides Chinese/English free switch operation interface,．·Up to 1500Vdc/1000Vac Test Voltage ,．·1024 Max. Test Points ,(Max of all series)．·500 Max Files Memory,support USB or PC unlimited expansion,．·Using Embedded Linux operating system，．·Adopted high resolution colour 640*480 TFT LCD ,．·Large 320×240 LCD display ,．·Instant test time :0-60s , optional adjustment.．·Providing Single-End ,Multi-segment ,Standard ,and Spot test of wire.．·Auto Scan and Auto Pin Search ,．·The system provides advanced instant open-circuit, short-circuit, continuity test,．·Intermittent Conductance Test,．·Intermittent Open/Short Test ,
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Boundary-Scan DIMM Socket Tester
ScanDIMM
Maximizing test coverage is an important piece in test procedure development. Unfortunately, not all designs have the necessary requirements in place to accommodate boundary-scan test methods on memory devices. ScanDIMM digital socket test modules are designed to overcome such limitations when testing DIMM sockets utilizing boundary-scan test techniques.ScanDIMM modules provide the capability to instantly turn any DIMM socket into a fully compliant IEEE-1149.1 device. Integration is as simple as assigning the included BSDL file to the reference designator of the target socket and compiling test vectors.In multi-socket systems, multiple ScanDIMM modules can be linked to provide even greater boundary-scan test depth.
