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TLP
1) sensitivity tests to analyze IC ESD protection circuitry. 2) Transmission Line Pulse
See Also: Transmission Line Pulse, Very Fast Transmission Line Pulse
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TLP Tester
Tokyo Electronics Trading Co., Ltd.
A method for semiconductor characterization of Electrostatic Discharge (ESD) protection structures.
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TLP Tester lineup
Hanwa Electronic Ind. Co.,Ltd.
The tester can implement simulate operating characteristic of protective circuit In addition capable of the VFTLP test.
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TLP Probe Arm Kit
TPA-95
High Power Pulse Instruments GmbH
*Flexible pulse force, pulse sense combined TLP probe arm kit based on TPA-95L and TPA-95R*Compatible with typical standard micropositioner mechanical interfaces*4.7 kΩ pulse sense voltage divider, which results in a voltage transfer ratio of (4700 + 50)/50 = 95 : 1 into 50 Ω*Variable probe pitch configuration*1 m flexible 50 Ω cables with SMA connector for pulse sense*0.1 m flexible 50 Ω cables with SMA connector for pulse force*Tungsten probe tips*Can be used for chuck backside grounded TLP measurements
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120 A High Voltage 50 Ω Pulse Generator
TLP-12010C
High Power Pulse Instruments GmbH
- High pulse output current up to 120 A (short circuit)- Ultra-fast 50 Ω high voltage pulse output with typical rise time 100 ps (0 A to 40 A) and 300 ps in high-current mode (0 A to 120 A)- Wafer, package and system level TLP, VF-TLP and HMM testing- Up to 180 kW peak output power into 50 Ω load- Built-in HMM pulse up to ±32 kV in 50 Ω-configuration- High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)- 6 USB programmable pulse rise times: 100 ps to 50 ns (custom selectable)- 8 (optional 9) programmable pulse widths: 0.5 ns (optional), 1 ns to 100 ns (0 A to 40 A), 1 built-in pulse width: 100 ns (>40 A)- The optional pulse width extender TLP-3011C enables pulse width up to 1.6 µs in 68 GPIB programmable steps (0 A to 40 A)- Optional external pulse width extensions from 5 ns to 500 ns (>40 A to 120 A)using the external pulse width extender TLP-12012A6- Built-in pulse reflection suppression- Fast measurement time, typically less than 0.2 s per pulse including one-point DC measurement between pulses- Efficient sofware for system control and waveform data management- The sofware can control automatic probers for fast measurements of complete wafers- Combines TLP-12010A and TLP-4010C into one system- Can be operated together with TLP-12012A6 and TLP-3011C pulse width extenders- Integrated interlock safety shut-down- Industrial isolated and EMI/ESD protected USB control interface
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Automated Robot Test System
ATS-8000A
High Power Pulse Instruments GmbH
The ATS-8000A test system is a fully automated 2-pin probing solution for HBM, TLP, HMM and CC-TLP on package- and wafer-level.Future extension for CDM is optional.
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CC-TLP Probe
CC-TLP-50-A1
High Power Pulse Instruments GmbH
*Capacitively coupled TLP probearm (CC-TLP) compatible with standard probing stations*18 GHz SMA connector*Tilt angle adjustment*Calibration gauge for needle height
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Compact TLP/VF-TLP/HMM Probearm Set for Temperature Measurements
PHD-4001A
High Power Pulse Instruments GmbH
*Electrically isolated probearm kit for VF-TLP, TLP, HMM, HBM force and sense probingbased on the GGB Picoprobe Model 10 replacement probe tips*Buried coaxial cable channel for thermo-chuck in isolated chamber temperature measurements*Compatible with GGB Picoprobe Model 10 replacement probetips*Compatible with all standard micropositioner interfaces*High precision rotation of the probearm by backlash-free 80:1 gear*Rugged stainless steel design*SMA connectors
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ESD, Latch-up testing / design service
ESDdoctor
ESDdoctor consulting service can identify, diagnose, and solve any ESD/EOS problem quickly and definitively, at a surprisingly low entry cost. You can choose testing and diagnosis only, or add ESD design services to the consulting package. ESD, Latch-up testing: HBM (ANSI/ESDA and JEDEC) on packaged dies. MM (ANSI/ESDA and JEDEC) on packaged dies. Latch-up JEDEC on packaged dies TLP on packaged and bare dies.VF-TLP on bare dies.
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ESD Testing & Latch-Up Testing Services
EAG is an industry leader in ESD testing (Electrostatic Discharge) and Latch up testing. Our highly experienced engineering team use their industry leading knowledge and years or real world experience of the latest semiconductor technologies, circuit design, and device physics to optimize our customer's ESD and latch-up results. Human Body Model (HBM) and Machine Model (MM), Charged Device Model (CDM), Latch-up, Transmission Line Pulse (TLP).
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High Level of Customization at an Affordable Price
TLP
The Impulse transmission line pulser (TLP) discharge networks are easily integrated with other instruments for a custom system matched for your device and process applications. Specifications include 1-10 nanosecond rise times, up to 40 amps peak, for 10-500 nanosecond pulse widths. It is a proven design incorporating 15 years of hardware and device development experience. Reliable performance over hundreds of processes, and thousands of products. All TLP systems are built by special request, contact us with your specifications or application.
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High Voltage 50 Ω Pulse Generator
TLP-12010A
High Power Pulse Instruments GmbH
- High pulse output current up to ±120 A (short circuit)- Ultra-fast 50 Ω high voltage pulse output with typical 300 ps rise time- Wafer, package and system level TLP and HMM testing- 180 kW peak output power into 50 Ω load- Built-in HMM pulse up to ±32 kV in 50 Ω-configuration- High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)- 6 digital programmable pulse rise times out of: 300 ps to 50 ns (optional)- 1 built-in pulse width: 100 ns- Optional external pulse width extensions from 5 ns to 500 ns using the external pulse width extender TLP-12012A6- Built-in pulse reflection suppression- Fast measurement time, typically less than 0.2 s per pulse including one-point DC measurement between pulses- Efficient software for system control and waveform data management- The software can control automatic probers for fast measurements of complete wafers- Integrated interlock safety shut-down- Industrial isolated and EMI/ESD protected USB control interface
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Impulse Semiconductor High Current Integrated
Transmission Line Pulse Test System
The Impulse Semiconductor High Current Transmission Line Pulse (TLP) test system is the tool of choice for extracting ESD parameters for transient protection devices in a package, or at wafer level. With accuracy better than 100 milliohms at 40 amps peak current, the Impulse high current TLP is specially tailored to the needs of today's ESD device designers who must accurately measure low values dynamic resistance irrespective of breakdown voltage.
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JESD22-A115 Machine-Model (MM) Pulse Emulator
MM-10A
High Power Pulse Instruments GmbH
- Pulse unit to generate JESD22-A115 machine-model (MM) waveforms with TLP- Extremely stable and reproducible machine-model (MM) waveforms- Compatible with HPPI TLP-3010C/4010C/8010A/8010Csystems which have installed pulse width of 25 ns and rise time of 100 ps to 300 ps- Up to ±10 A machine-model peak current with TLP-3010C, which is equivalent to ±667 V (MM)- Up to ±15 A machine-model peak current with TLP-4010C, which is equivalent to ±1000 V (MM)- Up to ±30 A machine-model peak current with TLP-8010A and TLP-8010C, which is equivalent to ±2000 V (MM)- Same measurement procedure as TLP including DC test of the DUT- Compatible with HPPI TLP software and waveform data storage and management- 50 Ω SMA input and output connectors- Compact size: 61 mm x 25 mm x 17 mm
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PCIe Oscilloscope Software Triggering and Decoding
The R&S®RTO2000,; R&S®RTO6 and R&S®RTP; oscilloscopes support triggering and decoding of PCI Express Gen 1.1 and 2.0 signals. In addition, the R&S®RTP supports Gen 3.0 signals. Users can set up decoding in seconds via the intuitive menu dialogs. For detailed analysis, results can be viewed as color-coded telegrams and/or in a table. Errors and other protocol-specific fields, such as TLP and OS are identified efficiently using the oscilloscopes' protocol trigger.
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Probing Solutions
ES62X-CMPS
The ES62X-CMPS compact manual probe station is a rugged wafer probing solution designed for high reliability, compact size and low investment cost. It enables manual wafer level measurements up to 300 mm wafers. The probing station can also be used for TLP, HMM, HBM, LV-Surge, RF, S-parameter and DC-measurements. Micro positioners with vacuum as well as magnetic base can be attached. The chuck has a vacuum interface for the wafer and is electrically isolated. Multiple 4 mm connectors can be used to connect a voltage potential to the wafer backside.
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Pulsed IV-Curve Solutions
Pulsed IV-Curve Test and Analysis System is our new development for 2015. It is an advanced and compact pulsed IV-curve characterization system designed to simulate pulsed ESD events such as TLP, vf-TLP, HMM, HBM, EFT, and LV-Surge. It will monitor the transient voltage and current waveform during the pulse in ps or ns segment, and test the pre- and post-pulse status (leakage current, breakdown voltage, biasing current, static IV curve, etc) of the device under test (DUT), such as protection devices, semiconductors, circuit modules, touch panel sensor, etc.
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Services
Application & retrofit, start up, training/tech support, and more from TLP Solutions
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Test System
4003 TLP+™
The Model 4002 TLP+™ test system was the first turn-key commercial TLP developed for the ESD industry and has remained the leader in the ESD square pulse testing field since this method was first introduced in 1989. This tester is the ultimate design and analysis tool for ESD protection circuits. It provides Pulse Curve Traces of circuit characteristics which simulate ESD tests. This allows you to see into a chip’s operation taking out the guesswork which speeds your design and minimizes lost time.
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Transmission Line Pulse Testing
Transmission Line Pulse testing, or TLP testing, is a method for semiconductor characterization of Electrostatic Discharge (ESD) protection structures. In the Transmission Line Pulse test, high current pulses are applied to the pin under test (PUT) at successively higher levels through a coaxial cable of specified length. The applied pulses are of a current amplitude and duration representative of the Human Body Model (HBM) event (or a Charged Device Model – CDM – event in the case of Very Fast TLP, or VF-TLP).
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Wafer ESD Tester lineup
Hanwa Electronic Ind. Co.,Ltd.
◆Correspond to 300mm Wafer. This tester can measure LED or the large sizes Wafer, such as a system LSI. And Zap of HBM/MM can be performed. The Automatic destructive judging by V/I measurement can also be performed after Zap.◆Waveform guarantee in Zap needles. HED-W5100D carries out the calibration before shipment in the place of Zap needles. Therefore, Correlation of the Result of a Package Device becomes clear easily.◆Correspondence to Standards This Tester corresponds to the Standard of JEITA, ESDA, and JEDEC. A Zap unit adopts the plug-in system and also has the waveform of Customer's requests.◆Connection with TLP This Tester is the best for TLP Testing with deep relation of ESD. The protection circuit of a device with an ESD problem is investigated.
