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Defect
other than specified, imperfection .
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Defect Detection
StarProd LTB
The StarProd LTB is a unique defect detection bench for linear array antennas such as BTS. Tests performed on this bench instantly identify defects such as flawed or absent soldering, swapped wiring or short circuits. Results provide information on the position and type of any existing error. Operators can then immediately step in to make corrections knowing precisely how and where they are needed. StarProd LTB also performs tilt computations which can reveal a misconfiguration, or a mechanical or RF component defect. The end result: improved production processes and product quality.
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Defect Inspection
With over 20 years of experience in defect inspection, microelectronics manufacturers around the world partner with us to improve yield by performing high-speed, automated inspection and then transforming the defect data into actionable process control with powerful analytical software.
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Defect Isolation
*Traverse through the physical design to trace nets and vias down to the defect location*Utilizes industry standard LEF/DEF design files, scan-based test information, tester fail logs and diagnostic reports to determine and isolate the physical defect location*Enables the user to leverage their diagnostic experience to determine the root cause of the defect*Interactive layout viewer displays scan chains, mapped mismatches of scan cells, layers, nets and subnets with search capabilities(component, net, cell)*Physical XY coordinates are always displayed for components and nets to guide the user through the design to quickly identify suspect sites for FA using techniques like Emission, OBIRCH, LIVA, TIVA, or FIB
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Pipeline Defect Mapper
The non-intrusive measuring device takes measurements along the pipeline and plots the results directly onto the screen of the receiver. There is no need to carry extra logging and display devices. All the data is displayed and logged into the receiver for downloading to a spreadsheet or dedicated analysis program.
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Transistor-Level Defect Simulator
Tessent DefectSim
Tessent DefectSim is a transistor-level defect simulator for analog, mixed-signal (AMS), and non-scan digital circuits. It measures defect coverage and defect tolerance. Tessent DefectSim is perfect for both high-volume and high-reliability ICs. Tessent DefectSim replaces manual test coverage assessment in AMS circuits needed to meet quality standards such as ISO 26262 and provides objective data to guide improvements in DFT. Tessent DefectSim dramatically reduces SPICE simulation time compared to simulating every potential defect.
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Manufacturing Defects Analyzer
406A
The 406A is designed to target the highest number of assembly failures for the least amount of capital equipment cost, programming time, and maintenance costs. The precision Stimulus Measurement Unit provides AC/DC analog measurements that are accurate, stable, repeatable, and reliable.
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Manufacturing Defects Analyzer
eloZ1-400
The eloZ1 Manufacturing Defects Analyzer is an in-circuit tester of the very latest generation, reliably detecting connection and assembly faults on printed circuit board assemblies. The eloZ1-400 is the compact version of the eloZ1. It is particularly suitable if there is only limited space to fit test appliances. The eloZ1-400 can also be used as a mobile test system.
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Manufacturing Defects Analyzer
eloZ1-1600
The eloZ1 Manufacturing Defects Analyzer is an in-circuit tester of the very latest generation, reliably detecting connection and assembly faults on printed circuit board assemblies. The eloZ1 can be integrated into table systems as well as into inline-systems.
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Defect Inspection and Review
KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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Defect Inspection Module
EB40
The Class 1 certified E40 and B40 modules (available separately or combined in one module) can automatically detect defects on the entire edge, from zone 1 to 5, and the entire backside. The ability to inspect the entire backside allows for faster root-cause analysis of zone 5 defects since such defects can migrate from the wafer interior.
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Defect Inspection System
NovusEdge
The NovusEdge System provides high sensitivity inspection for the edge and backside of bare unpatterned wafers for current and advanced nodes. Multiple modules can be configured on the same automation platform for increased throughput while maintaining a small footprint for an improved cost of ownership.
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Defect Inspection System
F30
The F30 System boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations.
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Defect Inspection Systems
Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
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Large Surface Defect Gauge
4D InSpec® XL Surface Defect Gauge
The 4D InSpec XL Surface Defect Gauge expands 4D Technology’s 4D InSpec product line—they’re the first handheld, precision instruments for 3D non-contact surface defect measurement.
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Building Defect Investigations and Surveys
Building defect investigations and surveys are needed not only when problems arise but when assurance is required that defects do not exist or that the standard of construction is such that problems are unlikely
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Counterfeit Defect Coverage Tool
The SAE Counterfeit Defect Coverage Tool is a dynamic, web-based application that supplements SAE Standard AS6171 authored by the SAE G-19A Test Laboratory Standards Development Committee. It provides potential test sequences for the identification of counterfeit electrical, electronic, and electromechanical (EEE) parts along a range of risk levels and EEE part types. Allowing users to compare alternative test sequences as a function of resources needed to implement those tests, the SAE CDC Tool is appropriate for those ordering counterfeit detection tests as well as those performing the tests.
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Solar EL Defect Detector
Jiangsu Keyland Laser Technology Co., Ltd.
Features: - Reveals invisible defects- Improves line yield prior to lamination- Improves quality and reliability of final product- Exceptional optical resolution in its class- Flexible system configuration for framed or unframed modules testing
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Source Code Defect Analysis
TotalView® Debugger
Dynamic source code and memory debugging for C, C++ and Fortran applications. TotalView provides analytical displays of the state of your running program for efficient debugging of memory errors and leaks and diagnosis of subtle problems like deadlocks and race conditions.
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Surface Defect Inspection System
Wafer for inspection of surface condition of specular flat substrate, glass substrate, others φ 100 ~ φ 300 compatible
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Luminescence Defect Inspection System
INSPECTRA® PL Series
This system uses luminescent images created using photoluminescence (PL) to perform high-speed, high-sensitivity automatic inspection for crystal defects, cracks, and luminescence defects which cannot be detected with conventional visible light surface inspection!
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Manufacturing Defects Analyzer (MDA)
TR518 SII DRAWER
*The DRAWER Type is the new Manufacturing Defect *Analyzer (MDA) platform.
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Wafer Defect observing instrument
HS-WDI
Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
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In-Line Wafer Surface Defect Inspection
ALTO-SD-150/200
ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
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NUV-PL SiC Defect Inspection System
VS6845E
Industrial Vision Technology Pte Ltd.
Comply with IEC63068-3 Standard: Test method for defects using photoluminescence, Model VS-6845 SiC Wafer defect inspection system has capability on Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices.
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Auto Macro Wafer Defect Inspection
EagleView
EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.
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Sapphire Defect Laser Probe and Glasses
LP-100
Easy to use and portable■ low price with long lifetime■ can be used to detect many defects, like micro crack, bubbles, impurity, crystal subgrain■ When the laser go though the crystal, if it is monocrystal the light should be scattering, in macro it should be white.
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Front and Back Side Topography Defect Detection
LIGHTsEE
High throughputNanometer range vertical sensitivitySimultaneous double side inspectionNanotopography and Topography measurementDetection of Slip lines, particles, Hairline cracks, SOI voids, Comets, EPI defects…Compliant with thin or thick wafers, taiko wafers, highly warped wafers
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200mm and 300mm Defect Detection and Review Systems
DDR200 and DDR300
The McBain DDR200 and DDR300 for 200mm and 300mm wafer defect detection and review are unmatched in value and features in this special application and price category. The systems offer significant and unique advantages for both production and engineering use, and provide an ideal solution when both defect detection and dimensional metrology are required. They can be used as dedicated production tools or as versatile process development tools.
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Defect Review Station Software for electrical test
Faultstation
Centralize all error review for your different testers in a single seat! To capture PCB layout information, FaultStation offers the choice of DPF or IPC input. In combination with a Ucamco data-prep seat, DPF is the obvious choice, while industry standard IPC provides a doorway to all other data-prep systems in today’s marketplace. Once the layout data is available, you combine it with the error information from a variety of different models and makes of testers.
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Semiconductor Wafer Defect Inspection Management Software
ProcessGuard
Microtronic ProcessGUARD Software is the desktop client for the EagleView auto macro wafer defect inspection system. ProcessGUARD is a high volume, high speed semiconductor wafer defect inspection management solution that provides an easy-to-use, customizable and extensible platform and interface to automate your fabs defect inspection process. ProcessGUARD is feature rich (see below) and its newest releases include complete wafer randomization software, a user-defined defect library, and an integrated trainer and knowledge base.
