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BGA Test Sockets
Ball Grid Array package test connection between BGA and board.
See Also: Test Sockets, Burn-In Sockets
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BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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BGA Socket Adapter Systems
Advanced Interconnections Corp.
BGA Socket Adapter Systems convert surface mount device packages to through hole (pinned) assemblies, making it easy to plug and unplug SMT devices whether you are planning for future device upgrades, field programming at point of use, or need the ability to quickly swap out device packages in the field or the test lab. Protects valuable PC boards and saves time by eliminating the need to desolder packages during device removal.
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Test Socket Based Elastomeric Matrix Connectors
Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
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Stamped Spring Pin Sockets
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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Silver Ball Matrix Sockets
SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
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Near Zero Footprint SMT Spring Pin Sockets
Ironwood Electronics socket is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with any type IC packages- BGA, LGA, QFN, DFN and even leaded devices where you need to fit a socket in place of your device to allow fast, easy testing and development.
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µHELIX® Test Probes
Series S200, S300, S400, and S500
Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations.
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EFT Module for Teststand
The Electronics Functional Test (EFT) Module for TestStand provides out-of-the-box tools to speed up development of automated tests for electronic assemblies including PCBAs, subassemblies and final assemblies. Test engineers can develop, deploy and execute test sequences quickly and efficiently with minimal custom code development for a shorter time-to-solution.
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Prototyping & Test Consulting Services Solutions
Don’t cut corners on the path to quality. We are experts in Design for Test (DFT), Design for Manufacturing (DFM), agile development, prototyping and standards/best practices in many industries. Speak to our prototyping and consulting services experts to ensure you make the right decisions and investments at the start of your project.
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Headlamp Test Platform
Leverage 25+ years of automotive test experience, with the specialized design and manufacturing of automotive lighting testers. Using specialized know-how in this field, including photometric, electro-mechanical equipment and software solutions, accelerate your time to market with a higher quality product.
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In-Circuit Test (ICT) Fixtures
At Forwessun we support and manufacture In-Circuit Test Fixtures for a range of Test Systems. We regularly build fixtures that are supported on a range of systems including - - HP3070- Agilent- Keysight- GenRad- TeradyneWith over 50 years in the industry, we provide a weatlth of knowledge and support to our customers. We are a global company and can support businesses all over the world with the help of over 30 experienced test engineers.
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In-Circuit Test System Calibrations
Regular calibration is essential to ensure accuracy and reliability in testing. Forwessun offers precise calibration services tailored to your test systems, verifying that all components meet industry standards. Our calibration services maintain peak accuracy and compliance, so you can be confident in your system’s performance for any testing application. Choose from one-off calibrations or scheduled service contracts to meet your needs.- HP3070 - Agilent- Keysight - GenRad- Teradyne
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In-Circuit Test System Rentals
Forwessun offers flexible test system rental options to meet short-term or seasonal testing demands. Our rental systems are rigorously tested for reliability and performance, giving you access to high-quality equipment without the need for a full purchase commitment. Customised rental agreements allow you to return the equipment when it’s no longer required, providing an ideal solution for scaling up production or filling in during periods of high demand.
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In-Circuit Test System Repairs
Forwessun provides expert repair services for a wide range of Test Systems, helping you maintain optimal performance and extend the life of your equipment. Our team of skilled technicians quickly identifies and addresses issues, ensuring that your system is back in operation with minimal downtime. We handle both routine and complex repairs, offering comprehensive solutions to keep your systems running efficiently and reliably.
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In-Circuit Test Systems For Sale
Forwessun offers a comprehensive range of global services for a variety of Test Systems. We provide refurbished systems that have undergone rigorous testing, giving you reliable performance at a fraction of the cost of new equipment. Whether you’re looking for a long-term solution to enhance your testing capabilities or a temporary setup to meet increased production demands, we have flexible options to suit your needs. - HP3070- Agilent - Keysight- GenRad- Teradyne Our bespoke rental agreements make it easy to scale up without permanent investment—simply return the system when it’s no longer required. For ongoing support, we offer calibration, repair, and maintenance services through convenient service contracts. If you’re looking to retire any outdated or non-functional In-Circuit Test (ICT) systems, we’ll offer fair market prices, helping you maximise value on any surplus equipment.
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In-Line Test System
With an Averna in-line test system, clients boost production/yields, catch defects invisible to the human eye, reduce equipment downtime, and ensure repeatable results.
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Iridium Physical Layer Test Systems
PLTS
Averna has worked with Iridium to ensure you have the right equipment to support their test coverage. The Iridium PLTS verifies product performance to Iridium’s standards. Find out more!
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Laser Diode Burn-in Reliability Test System
58604
The Chroma 58604 is a high density, multi-function, and temperature controlled module for laser diode burn-in and lifetime tests. Each module has up to 256 SMU channels which can source current and measure voltage in various control modes as described below.
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Laser Diode Reliability Burn-In / Life-Test System
58602
Chroma 58602 is a high density, precision multi source measurement Unit (SMU) module with temperature control and exchangeable interface developed for burn-in, reliability and life test of optoelectronic components including laser diodes, VCSELs, VCSEL Arrays, silicon Photonics, photo-diodes and other similar components.
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Lens Module Test Platform
The Lens Module Test Platform is a flexible solution to deliver the quality that is expected from your brand for all types of lenses and cameras. The system can be configured to measure objective, eyepiece or camera lenses. As the platform can efficiently measure lenses as small as 2 mm3, it is perfect for the critically precise applications of life sciences, consumer electronics, automotive and other industries. With 25+ years of quality experience, the Lens Module Test Platform ensures that all products shipped to market work as intended.
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NTS Platform
Manufacturers all over the world are leveraging our NTS platform for products with rotating or otherwise moving parts, or produce sounds. Typical applications include mass production of air conditioning units, pumps or small electric motors, where errors in assembly can cause malfunctions or significantly shorten service life. This test platform is customized to your specification and application. Feasibility studies are available to ensure your solution is exactly what you are looking for.
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OLED Lifetime Test System
58131
The 58131 Lifetime Test System is designed specifically for the OLED industry. Model 58131 provides twoquadrant constant current (CC) and constant voltage (CV) stimulus to each OLED panel and acquires electrical and optical characteristics automatically. Two independent and isolated precision source-and-measure units (PMU) are incorporated in one modular card, which is capable of testing two OLED panels. Additional instrument cards are added to expand test capacity. Hot plug and play is a key feature of 58131. When a UUT fails or an instrument card needs to be replaced, 58131 does not have to be shutdown and testing continues for other UUTs. Hot plug and play obviates life test cycle restarts due to isolated faults and significantly improves life test efficiency. We firmly believe that hot plug and play capability should be mandatory for all lifetime test systems.
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PCIe 5.0 Test Platform
PXP-500A
The Teledyne LeCroy PXP-500A Test Platform provides a convenient means for testing PCIe 5.0 cards with a self-contained portable and powered passive backplane. The PXP-500A provides power required for both cards under test.
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PCI Express 5.0 Test Platform
Teledyne LeCroy’s PCI Express 5.0 Test Platform is part of a suite of tools that facilitates complete protocol testing of PCI Express devices up to and including version 5.0. The latest feature of the Teledyne LeCroy Test Platform is the addition of an integrated interposer, which eliminates the need for an external interposer. This innovation simplifies setup with fewer connection points and outboard devices, making analysis easier and more reliable than ever. In addition to using the Test Platform with the Exerciser, the user can connect two of their own devices and use the Test Platform as a PCIe 5.0 backplane and as an interposer to capture protocol traffic between the systems.
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Photodiode Burn-in Reliability Test System
58606
The Chroma 58606 PD/APD Burn-in system is a high density, multifunction and temperature controlled module based system for photo diode burn-in and lifetime test. Each module has up to 256 Source Measurement Unit channels which can source current and measure voltage in various scenarios such as one described below. The system can accommodate 7 modules for a total of 1,792 device channels.
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Photonics Module Test System
58625
Chroma 58625 provides characterization testing for 3D sensing illumination devices. various test modules are combined for validation testing under precise temperature control.
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Photonics Wafer Probing Test System
58635
The advancement of the photonics device technology continues to enable broader and more demanding applications in the industry.
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Active Alignment Assembly & Test Platform
Quickly deliver flawless camera & LiDAR modules, MEMS devices, die based sensors, LED and laser-based headlights and other high-end products with a supremely accurate standardized platform.
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Advanced SoC/Analog Test System
3650
Chroma 3650 is an SoC tester with high throughput and high parallel test capabilities to provide the most cost-effective solution for fabless, IDM and testing houses.
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Advanced SoC/Analog Test System
3650-EX
Chroma 3650-EX is specifically designed for high-throughput and high parallel test capabilities to provide the most cost effective solution for fabless, IDM and testing houses.
