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BGA Test Sockets
Ball Grid Array package test connection between BGA and board.
See Also: Test Sockets, Burn-In Sockets
- Virginia Panel Corporation
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Module Accessory Kit, Quantity 39 0-80 x .250" Socket Head Cap Screws
510109300
Module Accessory Kit, Quantity 39 0-80 x .250" Socket Head Cap Screws.Used with 90 Series modules p/n's : 510104120, 510104123, 510104267 and 510104270.
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Fine Pitch Probes
Fine pitch probes are spring contact probes with pitches between 0.10 / 4mil and 1.00mm / 40mil.In this pitch, direct soldering and the use of mounting receptacles is usually no longer possible. Therefore, almost all fine pitch probes are designed as double-sided spring-loaded contact probes. Fine pitch probes are installed in corresponding test sockets, which enable exact contacting of the test points. Feinmetall fine pitch probes are suitable for common components such as BGA, LGA, QFP, QFN or WLCSP. Precision and 100% quality control characterize these probes.In smaller pitches of 60 – 300µm, carrier needles (beams) are also used.
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Silver Ball Matrix Sockets
SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
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Near Zero Footprint SMT Spring Pin Sockets
Ironwood Electronics socket is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with any type IC packages- BGA, LGA, QFN, DFN and even leaded devices where you need to fit a socket in place of your device to allow fast, easy testing and development.
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Test Socket Based Elastomeric Matrix Connectors
Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
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BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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BGA Socket Adapter Systems
Advanced Interconnections Corp.
BGA Socket Adapter Systems convert surface mount device packages to through hole (pinned) assemblies, making it easy to plug and unplug SMT devices whether you are planning for future device upgrades, field programming at point of use, or need the ability to quickly swap out device packages in the field or the test lab. Protects valuable PC boards and saves time by eliminating the need to desolder packages during device removal.
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Stamped Spring Pin Sockets
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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µHELIX® Test Probes
Series S200, S300, S400, and S500
Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations.
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Configurable Functional Test System
ATS-5000
Maximize the uptime of your most critical electronics with the ATS-5000 Functional Test System from Astronics Test Systems. Deployed globally for more than 20 years, the newest version of this tester provides a configurable, affordable solution that delivers just enough test.
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NTS Platform
Manufacturers all over the world are leveraging our NTS platform for products with rotating or otherwise moving parts, or produce sounds. Typical applications include mass production of air conditioning units, pumps or small electric motors, where errors in assembly can cause malfunctions or significantly shorten service life. This test platform is customized to your specification and application. Feasibility studies are available to ensure your solution is exactly what you are looking for.
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In-Line Test System
With an Averna in-line test system, clients boost production/yields, catch defects invisible to the human eye, reduce equipment downtime, and ensure repeatable results.
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ESD Test System
58154 Series
ESD (Electrostatic Discharge) Test Systems are PXI/PCI controlled module to simulate electrostatic discharge pulse during electronic device testing. The 58154 series offer both ESD STM5.1-2001-Human Body Model and ESD STM5.2-1999-Machine Model. The user friendly software offers programmable and flexible features, such as sampling test on a wafer, ESD model, ESD pulse polarity, ESD pulse interval in a sequence, and automatic testing function.
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Fixture Kit In-Line 6TL35 455x600mm
AH500
Fixture Kit for Platforms featuring receiver Virginia Panel 9025 and external pusher system. Its heavy duty design supports more than 3000N.nnThe fixture kit includes the Base fixture (probe plate) as well as the Puhsers plate.
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Communications Test System for Frontline Diagnostics
ATS3000P
The ATS3000P is designed using Astronics Test Systems’ proven Synthetic Instrumentation architecture. Featuring 23instruments, and both Automated and Standalone modes to test, record, and diagnose faults, the unit provides complete RF, Analog and Digital capabilities. The ATS3000P also includes the sophisticated IF and baseband I/Q DigitalSignal Processing required for modern radios. The fieldupgradeable, software-defined architecture features easyto-use graphical user interfaces and enables testing with minimal operator intervention. Test Program Sets are available for a full range of tactical radios, or you can create new TPSs easily using the included TestEZ® software suite.
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Functional Test
UTS
The UTS functional test system is perfect for electronics manufacturing operations that have a mix of products where operators load and unload devices under test (DUT) and routinely change out fixtures for each type of DUT.
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Faraday Chamber for RF w/Exchangeable Cassettes 340x350mm RCV 9025 for 6TL36
AN133
The Faraday Chamber is an add-on for the 6TL36 test handler. This kit is installed into the 6TL36 in the same way a normal test fixture would be installed, being the only difference the fact that different products to be tested will, from that moment on, only need an additional exchangeable cassettes to be tested.
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Test Platforms
Leverage 20+ Years of Test Industry Experience with Built-In IP for Maximum Reuse
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In-Circuit Test System Calibrations
Regular calibration is essential to ensure accuracy and reliability in testing. Forwessun offers precise calibration services tailored to your test systems, verifying that all components meet industry standards. Our calibration services maintain peak accuracy and compliance, so you can be confident in your system’s performance for any testing application. Choose from one-off calibrations or scheduled service contracts to meet your needs.- HP3070 - Agilent- Keysight - GenRad- Teradyne
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Electronics Functional Test
Functional test for productive manufacturing. Manufacturers of products enabled by electronics must assure proper operation prior to shipment. Bloomy’s line of universal test systems are ideal for functional test of your PCBAs and subassemblies, from the simplest to the most complex. The UTS family of products combines high-performance test instruments, switching, power control and mass-interconnect hardware with our robust UTS software suite into a low-risk, cost-effective and powerful test solution for your device under test (DUT).
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EVSE Test Platform
To manage both the challenging high-power requirements of electric vehicle supply equipment and the market demand, it is crucial to rely on a test system that performs to your specs. The right system needs to combine the tools for reliable asset communication, microgrid management, effective protocol simulation and high-power testing. This EVSE platform combines the right energy regeneration equipment with 25+ years of test experience to deliver the results you need to meet conformance in the time you need it.
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ARINC 818 Tester
iWave 3U VPX High-Speed Video/Data Processing Card is a rugged standalone module in the 3U VPX form factor, aimed for the high-speed data, video processing, and display applications is ideal for military, defense, and aerospace applications requiring an optimal balance of performance and power efficiency. iWave 3U VPX High-Speed Video/Data Processing Card is implemented using Xilinx Kintex-7 device architecture and has I/O interfaces including High speed 16 channels of transceiver interfaces capable of operating up to 6 Gbps data rate, Gigabit Ethernet, RS232, RS422, PCIe interface, Built-in health monitoring circuits, HDMI input, and output interfaces
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EOL RF Functional Test
AS652
With this RF test platform, integrable according to the specific needs of the product, we cover a very wide range of test needs with manual feeding.Ergonomics have been fully observed in the design, including the option of servo adjustment of the working height according to the operator.
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Environmental Control System Test Platform
The Airframe Environmental Control System Test Platform provides a hardware-in-the-loop (HIL) closed-loop test environment for dynamic and maintenance testing of cockpit and cabin environmental control systems for airframes. The system simulates a military or commercial airframe cabin, including sensors and actuators from the control system and the passengers. The system delivers repeatable, cost-effective testing in a fraction of the time needed with typical in-house simulation systems.
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Test Instruments
Test instrumentation from COTS to custom, including VXI, PXI and LXI-based platforms.
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Functional Test
cUTS
Get the essentials of measurement automation to power tests of simpler PCBAs and subassemblies. compactUTS (cUTS) is a cost-effective platform for automating manual tests of devices with fewer than fifty cable-accessible test points in manufacturing environments with moderate production volume. DUT-specific electrically keyed cables make changeover quick and easy.
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PXI Integration Platform
ATS-3100
The new ATS-3100 enables you to rise above the module level and shift your focus to the sophisticated test solution you’re actually building. Simply add your instruments, software, and customization to create a complete solution. Or, if you're short on time or resources, ask Astronics Test Systems to do the finishing work for you.
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Iridium Physical Layer Test Systems
PLTS
Averna has worked with Iridium to ensure you have the right equipment to support their test coverage. The Iridium PLTS verifies product performance to Iridium’s standards. Find out more!
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Photonics Wafer Probing Test System
58635
The advancement of the photonics device technology continues to enable broader and more demanding applications in the industry.
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6TL23 Off-Line seat operation Base Test Platform w/o Table
H71002301
- 18U height 19inch rack space (580mm depth)- VPC G12 or G12X interface- Man Machine interface H73000301 (not included)- stand-up operation
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Photodiode Burn-in Reliability Test System
58606
The Chroma 58606 PD/APD Burn-in system is a high density, multifunction and temperature controlled module based system for photo diode burn-in and lifetime test. Each module has up to 256 Source Measurement Unit channels which can source current and measure voltage in various scenarios such as one described below. The system can accommodate 7 modules for a total of 1,792 device channels.
