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Burn-in and Test Sockets
Loranger International Corporation
Loranger International Corporation designs and manufactures thousands of socket styles for the burn-in and test of semiconductors and electronic components. Some of the socket styles are listed below.
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Burn-In Test Sockets
The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
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Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
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Burn-In Test
C.C.P. Contact Probes Co., LTD.
Customized Burn-In Test Sockets for temperatures of up to 180°C.
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Burn-In Board Tester
Focus-275
Focus275 is a tester for burn-in board.It can improve reliability of burn-in board by inspecting boards for burn-in test by Focus275 regularlyBoth short open test and component test can be done by sending electric signals for special socket contactor and edge part.
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LGA Sockets
We’ve taken our QFN expertise and combined it with the versatility and performance of the H-Pin® to leverage an LGA socket platform that serves the demanding requirements of today’s market. Plastronics LGA sockets using the H-Pin provide a high-performance socket that is affordable for all burn-in operations. These LGA sockets meet the power, temperature and signal performance needs of the higher density, larger package outline, and sometimes mix-pitch LGA designs. The LGA platform serves package sizes from as small as 2.0mm X 2.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages.
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BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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QFN/QFP35 Sockets
Test sockets are designed for testing today’s high-performance QFN, QFP, DFN and SOIC devices. For development, characterization, at speed burn-in, and low volume production manual testing.
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Open Top BGA Sockets
Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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Stamped Spring Pin Sockets
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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BIB Loading
FALCON Series
The Falcon Series is an automated BIB loading and unloading machine. It is designed to provide precise high-speed loading of DUTs from Trays/Tube to Burn-in boards and precise high-speed unloading of DUTs from Burn-in boards to Trays/Tube for different device packages. The Falcon Series also has a simple conversion kit which allows end-users to re-configure the equipment for different types of sockets and package combinations.
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Semiconductor
With ultra-multi pin count and fine pitch, our general-purpose IC socket lineup corresponds to every need. For semiconductor burn-in sockets for thermal acceleration tests, and test sockets for semiconductor electrical testing, we continue to hold a high market share all over the world.
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Burn-In Boards
Manufacture of burn-in boards since 1976. Established for more than 40 years in the market, Trio-Tech is recognized and is an approved global supplier to all major semiconductor companies. Trio-Tech has the capability to design and manufacture boards for all system types, with solutions available for many test conditions, Including HTOL, PTC, HAST and 85/85.
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Burn-In Boards
Meets burn-in requirements, including extreme temperatures or continual handling. 2 or more layers of polyimide. 200 C maximum temperature. Gold-plated connectors.
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Burn-in System
Sonoma
High power burn-in system with advanced testing functionality at DUT level for substantially lower cost and high performance using State-of-the-Art technology
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Burn-In System
The COBIS-II Series Burn-in System is designed to test the latest high frequency integrated circuits (ICs) and combines a large capacity oven with well proven Accutron FlexBID™ dynamic driver technology. This system is engineered for productive dynamic device testing and reliable monitoring.
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Burn-in Systems
Incal Offers A Line Of State-Of-The-Art Burn-In Testing Hardware And Software For Retrofit And/Or Total, Customized Burn-In System Configurations.
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Burn-In Systems
OPTIMUM Series
Advanced Microtechnology, Inc.
The OPTIMUM product line of burn-in systems has a model to meet your individual testing requirements. Please select one of the models below for more specific information
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Burn-In Test
Trio-Tech provides a comprehensive range of semiconductor testing services through its state-of-the-art laboratories in the Far East. The laboratories provides static and dynamic Burn-in /HTOL /SLT testing and other testing services. All of the company’s testing facilities are ISO9001, ISO14000, ISO17025 and DSCC certified ensuring that operating policies and procedures meet stringent international standards for consistency and reliability.
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Sockets
Ironwood Electronics Sockets – Embedded gold plated wire elastomer (SG) – Stamped & Etched spring pins (SBT) – Embedded silver ball elastomer matrix (SM/SMP)– Compressible silver button in polyimide (GT/GTP)– Surface mount adapters for sockets (SF)
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LED Burn-In Test
Burn-in system, based on LXI instrumentation, for concurrent testing of up to 80 DUTs in a climatic chamber. Devices to be tested include modern light emitting diodes and LED modules.The system consists of 2 control cabinets, each with 40 independent supply and measurement channels. Each channel can be configured individually via the operator software (current or voltage, including the relevant limit values). The software supports logging of current and voltage values for each DUT on all 80 channels with a sampling rate of <1s. Additionally, the software and system also support digital I/O channels, e. g. for controlling the climatic chamber. Inputs for connecting temperature sensors are also provided.
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Burn-In Test Fixtures
Burn-in generally involves the extended operation of a product in a temperature-controlled environment. With possible humidity and supply voltage margining - the burn-in process can then be extended to include power stress (levels and on/off cycles) tests, high humidity environmental simulation as well as the classic "four corner test" of high voltage + high temperature, high voltage + low temperature, low voltage + high temperature and low voltage + low temperature.
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Burn-In Test System
ATS 5030
Transform your burn-in testing strategy with the ATS 5030 Burn-in Test (BiT) Platform. This next-generation semiconductor tester offers independent per-site burn-in for semiconductor packaged devices. Deployed globally, the ATS 5030 BiT Platform is a turnkey system that consistently delivers industry-leading thermal stress test for billions of semiconductor devices.
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Memory Burn-In Test
The N3500 is Neosem Technology’s fourth generation memory test system. Specifically designed for Flash Components and Flash Cards, the N3500 tester-on-a-board architecture targets the broadest range of DUT technologies in various form factors and packages. Each Tester Board (or “Blade”) contains 288 I/O pins and 32 DPS supplies.
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Memory Burn-in Tester
B6700 Series
B6700 can test as many as 48 burn-in boards in parallel at speeds up to 10 MHz, which helps memory suppliers get their newest products to market faster while also reducing testing costs. An original high performance chamber improves yield by assuring high temperature accuracy while generating high temperature. It also shortens the temperature rise and fall time which leads to shortening the test time.
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RF Burn-In Services
Innovative Circuits Engineering, inc
There are many burn-in services that we offer such as HTOL, RFBL, ELFR, LTOL, etc and our focus on quality and customer service when providing burn-in custom solutions is second to none. We work closely with our customers to make sure we provide them with the best possible burn-in regardless of their lot size or pin count. We can also provide you with other electrical stress tests such as THB and HAST, and we can provide you with comprehensive status reports for your tests as they progress whether they be burn-in, THB, HAST or any other test.
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High Power Burn-In Test
Easily test the reliability of your high power laser devices with the Y2000H burn-in and life-test system. It will quickly identify defective laser devices so you can prevent them reaching your customers. Y2000H's full automation and expandable capacity helps you work through your tests more productively. And its user-friendly software makes testing your devices easier than ever.
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Laser Diode Burn-In Testing
Laser reliability testing consists of a series of tests that laser diodes can be put under in order to ensure their reliability for post-production use. There are different types of tests that can be carried out and there are multiple measurements that can be taken in order to evaluate the reliability of the device. One of these tests is laser diode burn-in.
