Filter Results By:
Products
Applications
Manufacturers
Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
- TEAM SOLUTIONS, INC.
product
IEEE-488 GPIB Device Interface IC (Chip) for the PCI-Bus
GPIB-72120
The i72120 GPIB-Chip is the ideal solution to implement a IEEE488.2 GPIB interface for next generation PCI based instruments. The GPIB-ASIC is designed to meet all of the functional requirements for talker and listener (TL) devices as specified by the IEEE Standards 488.1-1987 and 488.2-1987. Connected between the PCI bus and the GPIB, this GPIB-IC provides high-level management of the GPIB to unburden the processor and to simplify both hardware and software design. The i72120 is fully compatible with the PCI specification and requires only the addition of bus driver/receiver components to implement a talker/listener GPIB interface.
-
product
Chip Inductors AECQ200 Compliant
Bourns products include surface-mount chip inductors, power chokes, chip beads, chip bead arrays, as well as radial-leaded and axial-leaded inductors. These components are used in computer, communication, instrumentation, industrial, and medical applications.
-
product
Radio Module with PCIe Card
SX-PCEAC2
The SX-PCEAC2 is powered by Qualcomm Atheros radio chip, the QCA6174-5, which features 2x2 wave 2 MU-MIMO technology. It is a dual-band 802.11 a/b/g/n/ac module with Bluetooth support which is designed for devices that require wireless connectivity in a small form factor combined with high performance with throughputs reaching up to 867Mbps.
-
product
Automotive Infotainment SoCs
ST’s portfolio of infotainment systems on chips (SOCs) includes a complete offer of automotive-grade devices for a wide range of infotainment systems ranging from turnkey Accordo2 processors for car radio applications and Display Audio systems, featuring smartphone mirroring and support of rear-view cameras, up to powerful Accordo5 multi-core processors with best-in class 3D graphics and video decoding capabilities, to address multi-standard smartphone replication technology as well as Digital Instrument Cluster applications.
-
product
BGA SMT Adapters
Giga-snaP™
Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
-
product
TDR System
TS9001
The system accurately analyzes the wiring quality of various leading-edge semiconductor packages such as Flip Chip BGA, wafer level packages, and 2.5D/3D ICs using terahertz technology. It is a TDR analysis system that has the world’s top-class signal quality.
-
product
COM Express Basic Size Type 7 Module with Intel Atom® C3000 SoC
Express-DN7
The Express-DN7 is a COM Express® COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Atom® C3000 processor (formerly “Denverton-NS”) system-on-chip (SoC). 16 CPU cores with 31W TDP and integrated 10G Ethernet make the Express-DN7 especially suited for customers who need excellent computing performance with low power consumption, such as edge computing applications, in a long product life solution.
-
product
Optical Transimpedance Amplifiers
Analog Devices optical transimpedance amplifiers offer a complete, high performance, single chip solution for converting photodiode current into a differential voltage input. Supporting data rates from 155 Mbps to 11.1 Gbps, our transimpedance amplifiers are ideally suited for data communications and telecommunications applications supporting lay protocols including 1×, 2×, 4×, and 8× Fibre Channel, 10GBASE-LX4, SONET/SDH up to OC-192 with FEC, and 10 Gigabit Ethernet. Our transimpedance amplifiers feature low input referred noise current, high input current, and low power dissipation.
-
product
SoC Verification
TrekSoC
TrekSoC automatically generates self-verifying C test cases to run on the embedded processors in SoCs. This verifies your chips more quickly and more thoroughly than an external testbench, hand-written C tests, or running only production code on the processors. TrekSoC's generated test cases target all aspects of full-SoC verification and work in a variety of different environments.
-
product
Chrysler CCD Vehicle Bus Comms PC Card
SL100
The SL100 uses a standard 16450 UART with baud rate settings that makes it capable of communicating with a Chrysler CCD Vehicle bus. The SL100 uses a protected interface driver chip, as prescribed by the bus specification, to connect with vehicle peripherals in a robust and highly noise immune way. The card automatically configures to become another COM port by using the built-in O.S. drivers that are tried and tested and are optimized to work in the Windows environment.
-
product
Emulation
Synopsys ZeBu® emulation system delivers the performance needed to make verification teams and software developers working on the most advanced chips successful. ZeBu emulation systems are modular, allowing users to deploy the capacity needed in a scalable and easily extensible fashion.
-
product
EUV Lithography
NXE systems
NXE lithography systems are used in high-volume manufacturing of advanced Logic and Memory chips. The first systems to use ASML’s novel 13.5 nm EUV light source, they print microchip features with a resolution of 13 nm, which is unreachable with deep ultraviolet (DUV) lithography. Chipmakers use our NXE systems to print the highly complex foundation layers of their 7 nm, 5 nm and 3 nm nodes. Read about how EUV lithography went from imagination to reality.
-
product
Ground Leads Continuity Tester
Weshine Electric Manufacturing Co., Ltd
1. The new power supply technology is adopted in the grounding down lead conduction tester.2. It has the characteristics of small size, light weight, large output current, good repeatability, strong anti-interference ability and protection function. 3. The whole machine is controlled by single chip microcomputer, which has a high degree of automation. 4. The instrument has high precision and easy operation. The maximum current is 10A.
-
product
Personal Dose Alarm Meter
DP802i
DP802i type X - gamma radiation detector - as a super humanized design and enhanced personal dose monitoring is mainly used for X, gamma rays and hard beta rays of radiation protection monitoring, suitable for nuclear power station, the accelerator, isotope applications, industrial X, gamma NDT, radiation source treatment, medical treatment, cobalt gamma irradiation, radioactive laboratory, nuclear facilities around environmental monitoring field, timely, ensure to my warning safety of staff; The instrument can be also measured dose rate and cumulative dose. It USES reactive new single chip microcomputer, the compensation for the probe, the instrument GM counting pipe has a wide measurement range, better energy response characteristics, and with overload directives and protection function.
-
product
3.4 MP Custom Lens Low Light Camera Module
e-CAM30_CUMI0330_MOD
e-CAM30_CUMI0330_MOD is a high performance, small form factor, 3.4 MP pluggable Low Light Camera Module with S-Mount lens holder. It is based on AR0330 - a 3.4MP CMOS Image sensor from ON Semiconductor®. It has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs the entire Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images, videos and the optional MJPEG compressions.
-
product
MIS Capacitors
The SemiGen 8000 and 8100 series of MIS Capacitors are available in a wide variety of capacitance ranges and sizes. They are made with prime starting material and consist of an Oxide/Nitride layer that provides low dielectric loss and high standoff voltage. These RF microwave chip capacitor products are available in chip form only.
-
product
24-Channel Digital I/O With Digital Integration Features On M.2
M.2-DIO-24A
The M.2-DIO-24A is an M.2 card, and optional cable assembly (D-Sub 37-pin Male connector) designed to be easily panel-mounted in any application environment. It uses the high speed PCI Express bus to transfer digital data to and from the card. The digital I/O is compatible with 8255 PPI chips making it easy to program. This also allows for simple and trouble-free migration from other ACCES PCI and PCI Express digital I/O cards, but also provides for advanced features enabled by the onboard FPGA logic.
-
product
Low Constant Temperature Trough
DRK6691
Shandong Drick Instruments Co., Ltd.
Drk6691 small low constant temperature trough is a special product designed for small Abbe refractometer, supporting the use of. It has many advantages such as constant speed, constant temperature, small volume, low noise and convenient operation and so on , so it is a higher price products. This product adopts the technology of the one chip computer, PID selftuning regulation technology;adopts imported platinum resistance temperature (Pt100), so it has high precision of temperature control and temperature fluctuation is small; adopts the semiconductor refrigeration technology, so that it consists of advantages of fast refrigeration, no noise.
-
product
Integrated Potentiostat and Multiplexer
EmStatMUX8
Based upon the EmStat range, there are two types of multiplexers to suit most types of sensor array work. The MUX8 is the most flexible offering the ability to connect arrays made of up to eight working electrodes in two or three electrode cell types and chips sharing a reference electrode and/or counter electrode. The MUX16 is suitable for sensor arrays or chips with sixteen working electrodes all sharing a RE and/or a CE. Both instruments are suitable for laminated layer corrosion analysis.The potentiostat is controlled and powered by USB and is used with PSTrace allowing for simultaneous sampling of each channel at a rate of 25 ms/channel. Standard packaging includes a shielded cable with connections for a working, a counter and a reference electrode by means of 2 mm banana connectors and mini-crocodile clips, a stripped end, Dsub-37 terminated flat cable and a USB cable. To make connections to chips simpler the Connection Terminal is an optional extra providing clearly marked screw terminals to the electrodes and can be directly joined to the ESMUX via their D-Sub connectors.
-
product
Amine Blush Chip Screen Test Kit
Elcometer 139
The presence of amine blush is indicated by a visual change of colour of the test solution when compared with a control sample. The Elcometer 139 determines whether amine blush is or is not present on the coating’s surface.
-
product
Photonic Device Testing
ficonTEC’s series of photonic device testing machines is focused on automated electrical, optical or mixed-signal electro-optical characterization (test-&-qualify) of chips and dies, opto-electronic assembles and integrated devices. Capability includes PIC design validation and device verification.
-
product
3U OpenVPX High Density Multifunction I/O Board
68CB6
The 68CB6 is a Configurable Open Systems Architecture™ (COSA®) 3U OpenVPX™ board that is preconfigured with 10 different “inboard” I/O, measurement and communication functions. This Combination-function Board (CB) provides a full suite of some of the most common & useful function interfaces supporting many different applications. The 68CB6 features a wide but dedicated selection of functions: Standard Functionality Discrete I/O (DT1); Successive Approximation Register (SAR) ±100 V Analog-to-Digital (AD); Isolated High Voltage Analog-to-Digital (ADF); ±10 V Digital-to-Analog (DA); Thermocouple (TC1) or Resistance Temperature Detector (RT1); Full-bridge Strain Gauge (SG1); Transmission/gear box Chip Detection and Fuzz Burn (CD1); LVDT-to-Digital linear (LD6) displacement (position) measurement, AC Reference Source output (AC2); CAN bus communication (CB8). The 68CB6 offers unparalleled programming flexibility, a wide range of operating characteristics, and a unique design that eliminates the need for external intermediate circuit considerations such as pull-up resistors or mechanical configuration jumpers. Inboard functions are software controlled and memory addressed, accessed in similar COSA® modular fashion to maintain seamless common NAI Software Support Kit & API/library structures.
-
product
Value Added Services
For over three decades, Teledyne RF & Microwave has built a strong heritage delivering advanced value added services to the military, space and industry sectors of aerospace. With test capabilities up to 40 GHz, Teledyne offers chip and wire assembly of products ranging from single die through complex hybrids which can then be submitted to a combination of customer-specified RF and DC testing and environmental screening. We offer a complete portfolio of screening and testing services for device sorting, labeling, lead forming and tinning, and tape-and-reel packaging, as well as LAT services on packaged devices or bare-die, including diodes, transistors, and MMICs.
-
product
IF/RF Receivers
IF and RF Receivers are designed for communications infrastructure applications. Wide input bandwidth and high sample rates allow digitizing close to the antenna. Various receiver architectures, such as zero-IF, IF sampling to direct RF receivers, are supported and available on chip post digital signal processing can be used to offset demands in the FPGA or digital ASIC and ease analog filtering.
-
product
High Performance Embedded Development Kit
TySOM EDK
The TySOM™ Embedded Development Kit is for the embedded designers who need a high-performance RTL simulator/debugger for their embedded applications such as IoT, Automotive, Factory automation, UAV and Robotics. The kit includes Riviera-PRO™ Advanced Verification Platform and a TySOM development/prototyping board. TySOM boards come with either a Zynq 7000 chip (FPGA + Dual ARM® Cortex™-A9) or with a Zynq® UltraScale+™ MPSoC device. These boards include memories, and various communication and multimedia interfaces in addition to FMC connectors for peripheral expansion. Reference designs for application such as IoT, ADAS, 4K UltraHD imaging and Robotics and a complete reference design, which contains the SW (Linux) and all the hardware blocks required to support the peripherals on the board, are provided.
-
product
Ultra-compact Photoelectric Sensor
EX-20 Ver.2
Panasonic Industrial Devices Sales Company of America
Using a single chip optical IC, Panasonic created the powerful EX-20 Ultra-Compact Photoelectric Sensors, which are among the smallest Photoelectric Sensors worldwide and in spite of their miniature size, the Sensors incorporate a sensitivity adjuster. Since a red LED dot light source is used, alignment and confirmation of the sensing position is easy, even if very tiny objects have to be detected.
-
product
EMV Training
Barnes regularly provides EMV chip card implementation training and hands-on chip consultancy for both business and IT personnel. Whether migrating to chip cards for the first time, introducing new personnel to chip technology or implementing a new chip product, it is important that key staff receive a thorough grounding in the technology and the way it impinges on other aspects of the business.
-
product
Peak Track Instrument
90323
The model 90323 Peak Track Instrument is a general-purpose sensor readout device designed to complement our AutoID line of load cells and torque sensors. AutoID is a term that indicates that the calibration information for a sensor is stored on a chip inside the sensor’s connector. AutoID allows true “plug and play” operation without manual calibration procedures of any kind. The unit is also equipped with a 2-line alpha-numeric display and single button operation for simplicity.
-
product
Arduino CAN Shield
IFB-10003-IWP
CAN (Controller Area Network) communication has become ubiquitous in industry. It is used in automotive applications (part of OBD and many other datalinks), on-highway trucks (J1939), industrial machinery and instrumentation, and equipment applications (factory automation). This shield is designed to provide a CAN 2.0 front-end interface for 5V Arduino modules (Uno, Mega, etc). The module uses SPI to communicate to the Arduino, and requires an aditional chip select pin. An optional interrupt line to the MCP2515 and two LEDS are also provided. The chip select and interupt lines are selected via zero ohm resistors and have several configuration options for flexibility stacking additional shields. A set of stackable headers is included with this board, not installed. An optional on-board voltage regulator may be used to supply 7.5V to the Arduino's 'Vin' pin (which is regulated to 5V by the Arduino's on-board LDO). The CAN shield regulator supports a wide input range of 9V to 32V. This makes it possible to cleanly build a stand-alone CAN node (remote sensor) without the need for a separate Arduino power supply!
-
product
High Precision Thick Film Chip Resistors
Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
-
product
SPMI Protocol Analyzer and Exerciser
PGY-SPMI-EX-PD
Prodigy Technovations Pvt. Ltd.
SPMI Protocol Analyzer (PGY-SPMI-EX-PD) is the Protocol Analyzer with multiple features to capture and debug communication between host and design under test. SPMI (System Power Management Interface) is a MIPI (Mobile Industry Processor Interface) standard with 2-wire synchronous serial, bidirectional interface that connects the integrated Power Controller(PC) of a System on- Chip (SoC) processor system with one or more Power Management Integrated Circuits (PMIC) voltage regulation systems.
