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Defect
other than specified, imperfection .
- InterWorking Labs, Inc.
product
Network Emulator
KMAX
The KMAX network emulator helps network engineers test and measure performance in order to identify and remove defects. Network emulators turn well behaved development and test networks into the kind of slow, congested, and less-than-reliable services encountered on the internet. In addition, unlike the real internet, network emulators allow the operator to control these conditions so that products and apps can be subjected to controlled and repeatable tests, by routing selected packets through a series of impairment nodes.
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kSA Emissometer
The kSA Emissometer is designed to quickly and easily generate high-resolution diffuse and specular reflectance and total emissivity maps of MOCVD carriers. Carrier emissivity variation means temperature non-uniformity, which can lead to reduced device yield and possibly complete growth run failure. With the kSA Emissometer, emissivity changes can be tracked to determine carrier end-of-life, without wasting growth runs. The kSA Emissometer also detects unwanted residual deposits after baking, and easily identifies carrier surface defects, scratches, microcracks and pits that are not visible to the eye.
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Particle Impact Detection System 10
BW-LPD-DAQ4000HD
This system is capable of vibration testing up to 10 pounds and detecting defects that produce noise, such as loose screws, particles, etc. Right from the start of PIND testing, B&W patented the first MIL-STD compliant system outperforming the competition by over 30% better detection rate as tested by the NBS (now National Institute of Science and Technology) in a well known 1978 study (NBSIR 78-1590 NASA).
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PXI Fault Insertion Insertion Switch Modules
Our PXI Fault Insertion Insertion Switch Modules feature a breakout arrangement that allows faults to be attached to the sensor lines, this includes the breaking of a connection or the adding of defect – all of which can simulate connectivity problems in the system.
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3D CT AXI
PCB manufacturers can enjoy comprehensive, high-speed inspection with Omron’s revolutionary technology that reliably captures defects in hidden areas.
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Slip Line Detection System
YIS 200
The YIS and SF Series metrology systems are designed for optical detection of wafer defects such as crystaldislocations, slip and other defects. The YIS-300HM (for 300 mm wafers) and YIS-200HM (for 200 mm wafers) utilizeMakyoh optics technology (Magic Mirror) and integrated robotic wafer handler provided by Hologenix.
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Ultrasonic Imaging System
USPC 3010
Ingenieurbüro Dr. Hillger Ultrasonic-Techniques
Detects internal defects in new materials and metals. The wide frequency range up to 35 MHz enables highestresolution. A-, C-, and D-scans can be recorded. The imaging in B-scans is an option.
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MASK DR-SEM
Our defect review SEM tools perform detailed reviews of minute defects on photomasks.
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Inspection System
X-eye 7000B
Appropriate for the inspection of medium•large size components and detection of surface structure and defects (inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's significantly reduced and long-term use possible with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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Reject Station for X-Ray Image Analyser
IV-110I
IV-11OI is a reject station for X-Ray Image Analyser known for having an X-Ray Image Wire Defect Detection and a compact and space-saving dimension.
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Vision System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron®, Intel® Q170, 4 PoE, 4 USB 3.0, And Real-time Vision I/O
IPS962-512-PoE
The IPC962-512-PoE meets the increasing requirements for maximum quality and flexibility in modern production plants. It features flexible expansion capacity, camera communication interfaces, real-time vision-specific I/O with microsecond-scale and LED lighting control. This machine vision controller is powered by the LGA1151 socket 7th/6th generation Intel® Core™ (codename: Kaby Lake/Skylake) and Celeron® processors (up to 65W) with the Intel® Q170 chipset. The IPS962-512-PoE comes with a full range of isolated I/O interfaces and real-time controls essential to machine vision applications, including trigger input, LED lighting controller, camera trigger, as well as an encoder input for conveyor tracking. The real-time vision system PS962-512-PoE enables a fast and high accurate inspection to ensure that the desired quality is achieved with no manufacturing defects. It supports four IEEE802.3at PoE LAN ports and four USB 3.0 ports for connection with industrial cameras. Operating over a wide temperature range from -10°C to +55°C, the IPS962-512-PoE provides reliable and stable performance within severe environments. Its easy setup and compact design are ideal for space constrained environments. Moreover, one PCIe x16 and one PCIe x4 expansion slots allow quick installation of I/O cards and graphics cards. Two easy-swappable 2.5" HDDs are available for extensive storage needs.
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Test System Elowerk
eloZ1
The eloZ1 Manufacturing Defects Analyzer is an in-circuit tester of the latest generation. It reliably finds connection errors and assembly errors in electronic assemblies. The test electronics can be integrated both in table systems and in inline systems.
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Software
Interface Analysis
Surface-mount components warp during the reflow process, and the area where they attach also changes shape during assembly. This interface between components is where solder, paste, and gaps created due to thermal expansion combine to create 100% good products, or defects such as Head-in-Pillow, Shorts, and Opens. Fully understanding that critical interface between surfaces is more important than ever.
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Counterfeit Defect Coverage Tool
The SAE Counterfeit Defect Coverage Tool is a dynamic, web-based application that supplements SAE Standard AS6171 authored by the SAE G-19A Test Laboratory Standards Development Committee. It provides potential test sequences for the identification of counterfeit electrical, electronic, and electromechanical (EEE) parts along a range of risk levels and EEE part types. Allowing users to compare alternative test sequences as a function of resources needed to implement those tests, the SAE CDC Tool is appropriate for those ordering counterfeit detection tests as well as those performing the tests.
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Ultrasonic Concrete Testing
This category comprises the range of instruments that use sound or stress waves in order to determine the properties of concrete and other materials non-destructively. The first and most widely used System is our V-Meter, which utilizes the ultrasonic pulse velocity method for evaluating construction materials in the field. Transducers are available for a variety of frequencies from 24 KHz to 500 KHz. This unit has also been modified to suit the special needs of ceramics users and can be found as the Ultrapulse. The PIES, our revolutionary Portable Impact-Echo System, is an advanced instrument for non-destructive detection of flaws and defects in a variety of civil infrastructures ranging from bridges, parking structures and buildings to dams, piles, tunnels, tanks and marine structures.
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EasySegment
Unsupervised mode: train only with “good” images to detect and segment anomalies and defects in new imagesSupervised mode: learn a model of the defects for better segmentation and detection precisionWorks with any image resolutionSupports data augmentation and masksCompatible with CPU and GPU processingIncludes the free Deep Learning Studio application for dataset creation, training and evaluationOnly available as part of the Deep Learning Bundle
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Sewer Laterals Scanner
ES-38
The ES-38 is designed for scanning laterals from 3 to 8 inches in diameter. Using Electro Scan's proprietary technology, variations of electricity flowing through the pipe wall, associated with distance measurements, are automatically transmitted to Electro Scan's Smartphone application to record and display defect locations and their relative size.
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Ultrasonic Flaw Detector
MFD660C
MFD660C intelligent digital ultrasonic flaw detector, Mitech concentrated years meticulously developed premium product, has a lot of advantages like unique design, sophisticated manufacturing, convenient operation, powerful function. It had received customers' favored since its inception. It can test, orient, evaluate and diagnose various flaws such as crack, lard, air hole in workpiece’s interior swiftly and accurately without any destruction. With full digital 640X480 TFT LCD display, it can select the operating interface style and the LCD brightness according to environment. With humanizing interface design, the waveform show delicately. It can find the defects clearly in full screen. Single hand capable for holding operation, the curve making, probe calibration and other conventional operation can be completed automatically. Core processor CPU with 400M main frequency, it can complete the complex run quickly and realize intelligent defect analysis. Low power design with large capacity and high performance lithium ion battery module， it can work more than 10 hours continuously. Full English master-slave menu, emphasizing on user experience, collecting shortcut keys, digital shuttle rotary wheel, cross menu three operating ways in one body, customers with different habits can operate it freely. It supports many languages. Its waterproof, oil proof, dustproof function can achieve IP65 protection level. It is the necessary professional precision instrument for defect detection, quality control, on-line safety monitoring and life evaluation in fields of oil, chemical, metallurgy, shipbuilding, aviation, railways and so on.
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200mm and 300mm Defect Detection and Review Systems
DDR200 and DDR300
The McBain DDR200 and DDR300 for 200mm and 300mm wafer defect detection and review are unmatched in value and features in this special application and price category. The systems offer significant and unique advantages for both production and engineering use, and provide an ideal solution when both defect detection and dimensional metrology are required. They can be used as dedicated production tools or as versatile process development tools.
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Companion Tool to VS for Test Time & Pin reduction
UltraScan
UltraScan is SynTest's solution to combat increase in test time. In 130 nm or smaller ? nanometer geometries, many defects become delay defects and it becomes necessary to use delay tests to detect the transition faults and path delay faults. Often bridging tests are also required.
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Pinhole Detection Devices
ElektroPhysik Dr. Steingroever GmbH & Co. KG
The coating control by means of pore testing makes use of electrical voltage in order to uncover microscopically small defects (> 20 μm) in the coating of a surface. If even a small defect can be detected during pore testing of surface coatings, urgent action is required. Minimal flaws in the coating are sufficient to cause great damage.
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Solar EL Defect Detector
Jiangsu Keyland Laser Technology Co., Ltd.
Features: - Reveals invisible defects- Improves line yield prior to lamination- Improves quality and reliability of final product- Exceptional optical resolution in its class- Flexible system configuration for framed or unframed modules testing
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High-precision Surface Inspection for Wind Turbine Blades
waveCHECK™
8tree's waveCHECK is a handheld-portable 3D-inspection tool for inspecting wind turbine blades in manufacturing and operation. Its efficient detection of surface defects and instant visual feedback revolutionize surface inspection.It can detect wrinkles, steps, gaps, rain erosion and any other surface damage.
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Defect Inspection and Review
KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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Metrology Solutions for Semiconductors
Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker’s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition. In applications ranging from C-S thin films materials characterization to wafer substrate analysis and defect detection, Bruker’s systems provide simulation analysis and fit. HRXRD, XRR, WA-XRD, and XRDI measurement types are fully supported, enabling researchers, production engineers, and process developers unparalleled capabilities. Whether you are a semi and C-S fabricator, R&D center or academy, or an industry materials research facility, Bruker has a specifically designed solution for your metrology needs.
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WireChop
A cost-effective, proven defect chopper system that works with both bench presses and automatic machines
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Panaya Release Dynamix
Release Dynamix
Panaya Release Dynamix (RDx) enables organizations to drive innovations by enabling the continuous delivery of business-driven changes with speed and simplicity. Traceability – Users can map tests and defects to business change request and development requirements, increasing quality and business assurance. Agility – Change delivery managers can enable continuous delivery through visibility into requirements, user stories and tasks. Compliance - Organizations can employ a requirement approval workflow to comply with internal as well as regulated change introduction processes while continually managing the change lifecycle process.
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CT Ratio/Burden Tester
1047
TESCO’s new CT Ratio/Burden Tester (Catalog No. 1047) is a lightweight, portable and highly accurate in-service test set to assist in finding lost revenue by testing the accuracy of your meter circuits. The Tester can help determine if there are installations errors, loose connections, incorrect ratios, resistance buildup, open CT’s, or manufacturers defects. The CT Ratio/Burden Tester measures and displays the primary and secondary current of the CT under test, and the ratio of the currents. All test data is stored in the internal memory and easily uploaded to a PC.
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Leadframe Inspection Machine
IV-L200
The IV-L200 is a leadframe inspection machine ideal for measuring leadframe dimension and pitch. Aside from identifying leadframe warpage, it is also used to detect bent or skewed leads as well as surface defects such as scratch, ink, and contamination, among others.
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Semiconductor Inspection (SEMI)
A process for detecting any particles or defects in a wafer.
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Automated System for Visual Quality Control of Printing and Marking on Plates
The automated visual control system (ASVK) is designed to detect defects in the printing of images and markings applied to the blanks of extruded expanded polystyrene during the production of plates.
