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SMARC® 2.1 Short Size Module With Intel® Core™ I3 Processors, Intel® Processors N Series And Intel® 7th Gen Atom® X7000E Processors
LEC-ALN
The ADLINK LEC-ALN is a SMARC module that supports up to 8 cores Intel® Core™ i3 (i3-N305, i3-N300) Processors, Intel® Processors N Series (N97, N50) and Intel® Atom® x7000E (x7425E, x7213E, x7211E) Processors (formerly Alder Lake-N) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ALN modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Qseven V1.2 SoM Evaluation Kit With I.MX287 454 MHz (Industrial) SoC, 128MB Memory, 4GB EMMC, Gigabit Ethernet, Audio, CAN And BSP
Q7M100-100-EVK
*Ultra low power consumption ARM9*High flexibility Qseven v1.2 compliant design*5 UART*2 CAN*24-bit TTL LCD*10/100 Mbps Ethernet*Linux 2.6.35
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OSM Size-L Module With NXP® I.MX8M Plus Series
OSM-IMX8MP
The OSM-IMX8MP is an OSM R1.1 Size-L module featuring NXP® i.MX 8M Pluss series processor with 4-core Arm Cortex-A53 and M7, up to 8GB LPDDR4L memory and up to 128GB eMMC storage. With its in-SoC 2.3 TOPS NPU and Vivante GC7000UL graphics, the module is made for edge solutions needing on-device AI processing at ultra-low power.
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Qseven Module With Intel® Pentium® Processor N4200 & Celeron® Processor N3350
Q7M311
The Q7M311 has adopted the 14nm Intel® Pentium® N4200 and Celeron® N3350 quad-core/dual-core processors (codename: Apollo Lake). The extremely small embedded module supports 4GB (or optionally up to 8GB) DDR3L memory onboard and 32GB eMMC flash memory (optional). With a seismic design and for industrial-grade temperatures, both the CPU and the DDR3L RAM are soldered to deliver reliable and excellent computing performance. With rich features embedded in all the components built in a small form factor, the industrial-grade computer-on-module is aimed for industrial IoT applications, including industrial control, medical imaging, digital signage, gaming machines, military, and networking.
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SMARC Short Size Module, Intel® Atom® X7000 Series (Amston Lake) Processors
LEC-ASL
The ADLINK LEC-ASL is a SMARC module that supports 2/4/8 cores Intel® Atom® x7000RE (x7211RE, x7213RE, x7433RE, x7835RE) and x7000C (x7203C, x7405C, x7809C) Processors (formerly Amston Lake) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ASL modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that run 24/7.
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SD Host Tester / SD / EMMC Analyzer / SD Card Tester
SGDK350A (SD card / eMMC tester)
This product is compatible with SD Memory Card Physical Layer Specification Version 3.01. Supports UHS-I interfaces (SDR12,25,50,104,DDR50). There is a SpeedClass measurement mode that measures SpeedClass that supports SDXC, and a simple performance measurement mode that performs sequential / random access to any address. In addition, the SD card access library (for Visual Studio) is open to the public, and any command can be executed on the SD card in any pattern.
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SOM Module
TEO820-ZU4EV
Sundance Multiprocessor Technology Ltd.
Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784EZU4, 784 Pin Packages4 x 5 cm form factorRugged for shock and high vibration2 x 512 MByte 32-Bit width DDR4 SDRAM2 x 32 MByte (2 x 256 MBit) SPI Boot Flash dual parallel4 GByte eMMC Memory (up to 64 GByte)
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SMARC Short Size Module with NXP i.MX 6 Multicore Arm® Cortex®-A9
LEC-iMX6R2
- NXP SoC i.MX6 ARM Cortex A9 Solo, DualLite, Dual or Quad processor- Integrated 2D/3D graphics processors, 3D 1080p video processing, power management- Onboard DDR3L-1600 system memory from 512 MB to 2 GB- Supports up to 64 GB eMMC, 1x SD/MMC, 1x SATA 3Gb/s- Extreme Rugged operating temperature: -40°C to +85°C (optional)- 15 year product availability
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19” Rackmount Data Collection System
DCS-211
- Intel Atom® x5-E3930 processor- Up to 8x DI and 6x DO with two 2A relays- 3x M12 GbE, 1x RJ-45 GbE, 2x isolated RS232/422/485, 2x USB and one lockable HDMI port- Up to 3x PCI Express mini slots with one USIM card slot each- Storage: up to 64GB eMMC 5.0, 1x 2.5” SATA drive bay
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Zynq Ultrascale+ MPSoC (ZU19/17/11EG) 3U-VPX Plug-in Module
iW-RainboW-G35V®
AMD Xilinx’s ZU19/17/11EG Zynq Ultrascale+ MPSoC64bit, 8GB PS DDR4 RAM with ECC (Upgradable)Dual 64 bit, 8GB PL DDR4 RAM (Upgradable)8GB eMMC Flash (Upgradable)3U VPX Connectors based on ANSI/VITA 46.30 (P0+P1A & P1B+P2A)8 Optical transceivers through MT Ferrule Connector (P2B) based on VITA66.4
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SD Card
SD Card v.3.0 / eMMC v.4.51 IP Family
Designed for embedded applications that require high performance, small form factor, and high storage capacity, eMMC provides the support for embedded mass storage memory on embedded host systems. The eMMC protocol simplifies the access to NAND flash memories (such as MLC) to the host by hiding the functional differences among suppliers. Compliant to the latest JEDEC eMMC specifications, Arasan’s eMMC IP supports power-on-booting without the upper level software driver. The explicit sleep mode allows the host to instruct the controller to directly enter the sleep mode. The interface supports interface voltage of either 1.8V or 3.3V.
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SD Host Tester / SD / EMMC Analyzer / SD Card Tester
SGDK400 (Analyzer for UHS-II)
SGDK400 is a UHS-II dedicated analyzer.
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Robust Din-rail Fanless Embedded System With RISC-based (iMX-287) Processor 4 COM, 2 CAN Bus And DIO
rBOX610
The rBOX610 din-rail fanless embedded system utilizes the low power RISC-based module (iMX-287) processor and is designed to withstand temperatures ranging from -40°C to +70°C for using in extreme operating environment and industrial automation applications. The rBOX610 box PC features 4 RS-232/422/485 serial ports, dual LANs, 4 digital input channels,4 digital output channels, 2 CAN bus and 1 eMMC onboard 4 GB & 1 x SDHC socket for storage expansion (easy to access) in a compact, IP40 protected, industrial-strength robust case. Two power paths input minimize the risk of data loss in the event of a single power failure. Its vertical din-rail form factor makes it easy to install the system in a small cabinet. Due to the RISC-based architecture, rBOX610 will not generate a lot of heat while being operated. The ready-to-run rBOX610 is specially designed for remote control/monitoring management applications like unmanned control room, industrial machine, automatic parking lot, traffic cabinet and more.
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SD Host Tester / SD / EMMC Analyzer / SD Card Tester
SGDK320A (SD Host Tester)
SGDK320A (SD Host Tester) is a product that has the functions of SD emulator (SD Emulator), host tester (Host Tester), SD analyzer (SD Analyzer), and eMMC analyzer (eMMC Analyzer). Supports SD Memory Card Physical Layer Specification Version 3.01. It covers the test contents of Test Specification Ver3.00 and Supplement Note. Supports SDR104 and eMMC ver4.41 (analyzer).
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Universal Automated Programming System
4900
The 4900 is powered by the newest BPM 9th generation technology, which delivers the fastest programming speeds in the industry for MCU’s, eMMC HS400, NAND, NOR and Serial Flash devices. BPM 9th generation technology produces 200 MHz signals, allowing each byte of data to transfer in up to 2.5 ns. Up to 9 times faster than competing programmers. 3D Vision option inspects BGA, CSP, QFP, TSOP, SOIC and J-Lead devices for coplanarity, bent lead, pitch, width, diameter, standoff and XY errors.
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SOM Module
TEO820-ZU3EG
Sundance Multiprocessor Technology Ltd.
Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784EZU3EG (optional ZU5EV) 784 Pin Packages4 x 5 cm form factorRugged for shock and high vibration2 x 512 MByte 32-Bit width DDR4 SDRAM2 x 32 MByte (2 x 256 MBit) SPI Boot Flash dual parallel4 GByte eMMC Memory (up to 64 GByte)B2B Connectors: 2 x 100 Pin and 1 x 60 Pin
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SD Host Tester / SD / EMMC Analyzer / SD Card Tester
SGDK330B (SD / eMMC analyzer)
SGDK330B (SD / eMMC Analyzer) is a product that has the functions of SD Analyzer (SD Analyzer) and eMMC Analyzer (eMMC Analyzer).
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Robust RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, COM, LAN, DIO 2-in/2-out (Source Type) And 2 PCIe Mini Card Slots
IRU131-SO
*RISC-based (i.MX 6UltraLite) processor 528 MHz*512MB DDR3 SDRAM onboard*8GB eMMC flash onboard*2 PCI Express Mini Card slots (Wi-Fi, 3G/4G or LoRa)*1 isolated COM port*1 isolated DIO 2-in/2-out (source type)*Power input range of 9V to 48V DC with terminal block*Embedded Linux operating system (Yocto)*Wide operating temperature range from -40°C to +70°C*Supports OPC UA
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Automated Programmer Superpro Sb05
※ Four Pick & Place nozzles, Eight socket pressing actuators and 2 tape feeders※ High throughput up to 2400UPH※ Embeded with eight ultra-high speed programmers SuperPro / 7500, each with up to 4 sockets, totally 32 sockets. Throughput 60 times higher than SuperPro / SB01 for eMMC devices※ Supports over 80,000 devices from over 300 IC manufacturers※ Supports tray, tape and tube input and output. Supports laser and ink marking※ Short change-over time※ Intelligent s/w cuts learning curve and setup time, makes task management an easy job※ Compact sizeHigh throughput：4 nozzles, 8 independent socket pressing actuators and 2 tape feeders. Up to 2400 UPH for devices with programming time less than 50 sec. Throughput 0.6 to 60 times higher than SuperPro/SB01, especially higher for large capacity devices like eMMC, NAND /NOR FLASH,SPI FLASH. Suitable for both small and large capacity devices. Prog. Time (S) 50 60 120 180 240 300 UPH (unit per hours) 1600 1600 840 560 420 336 Accurate positioning：Equipped with high performance servo system, precise CCD cameras and vision algorithm for device alignment and sockets / pick & place spots positioning.High performance programmers： 8 ultra-high speed universal gang programmers SuperPro/7500 resident. Each with up to 4 sockets, totally up to 32 sockets in the system. Supports up to 100,000 devices from over 300 IC manufacturers and growing.Varied I/O devices：Supports tray, tape and tube input and output. Supports laser and ink marking. Supports packing conversion and can work as a packing conversion machine alone.Short change-over time：I/O devices and socket adaptor are easy to be changed when programming task need to be changed. Socket positioning can be performed automatically. Projects can be loaded automatically with barcode scanning.Powerful and intelligent software：Setup data saved for next operation, log file and statistic reports for quality and yield traceability, flexible sockets prohibition strategy promises high yield rate for unattended operation, graphical user interface cuts learning curve, prevents chip over-lapping by socket checking before chip placing.Remote Control：Remote project loading, quality monitoring, volume control, file security.
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SMARC V2.0 SoM Evaluation Kit With I.MX8M Quad/Dual 1.5 GHz/1.3 GHz (Industrial) SoC, 4GB Memory, 64GB EMMC, CAN, MIPI CSI/DSI, And HDMI 2.0
SCM180-180-EVK
*Ultra-Low Power i.MX8M Dual/Quad A53 Core*Single M4 Core*HDMI 2.0a up to 4K*Dual Channel LVDS*MIPI CSI*10/100/1000 Mbps Ethernet*USB3.0, USB OTG*PCIe 2.0*CAN 2.0B*Audio
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Rugged IP67-rated Fanless Edge System With NVIDIA® Jetson™ TX2, HDMI, GbE LAN, 1-CH PoE, USB 2.0 And 100 To 240 VAC Power Input
eBOX800-900-FL
The Artificial Intelligence (AI) embedded system, eBOX800-900-FL, adopts a full IP67-rated extruded aluminum and heavy-duty steel case for dust protection and water resistance. Moreover, the AI embedded system comes with a wide operating temperature range of -30°C to 60°C (-22°F to +140°F) and a vibration endurance for up to 3Grms. The embedded system is powered by the NVIDIA Jetson™ TX2 module which has a powerful 64-bit ARM A57 processor and 256-core NVIDIA® Pascal GPU. It features M12 type I/O connectors and four N-jack waterproof antenna openings for operational stability in rugged environments. The eBOX800-900-FL is ideal for AI edge computing and deep learning applications, such as smart city, smart manufacturing, smart transportation, and much more. The eBOX800-900-FL has 8GB of LPDDR4 memory and 32GB eMMC onboard. It comes with a wide range of 100 to 240 VAC power input with 10kV surge protection. The rugged edge computer also features one M.2 SSD PCIe 2.0 x4 socket which supports high-performance NVM Express interface for extensive storage needs. Furthermore, the embedded box PC is equipped with a PoE port to support the applications that require the use of IP cameras or any PoE device, i.e., traffic flow monitoring, license plate recognition, vehicle recognition, machine vision.
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Qseven V1.2 SoM With I.MX287 454 MHz (Industrial) SoC, 128MB Memory, 4GB EMMC, Gigabit Ethernet, Audio And CAN
Q7M100
*Ultra low power consumption ARM9*High flexibility Qseven v1.2 compliant design*2 CANBus 2.0B compliant ports*24-bit TTL LCD*Dual 10/100 Base-T Ethernet*Audio
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EMMC
Device driver for controlling MultimediaCard using MultimediaCard Interface (MMCIF) built-in the MCU
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SMARC V1.0 SoM With IMX6 Quad/DualLite 800 MHz (Industrial) SoC, 1GB RAM, 4GB EMMC, GbE LAN, Audio, CAN, MIPI And PCAM
SCM120
*SMARC 1.0 (82 x 50 mm)*Ultra low power consumption Cortex™-A9*2 CAN 2.0B*24-bit TTL signal*LVDS/HDMI 1080P*10/100/1000 Mbps Ethernet*Linux3.0.35/Android 4.3*Audio
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Robust RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, DIO (2-in/2-out), 4 AI Channels (16-bit, 250 KS/s, 0 - 20mA, ±20mA) And 2 PCIe Mini Card Slots
IRU152-I
*RISC-based (i.MX 6UltraLite) processor 528 MHz*512MB DDR3 SDRAM onboard*8GB eMMC flash onboard*2 PCI Express Mini Card slots (Wi-Fi, 3G/4G or LoRa)*4 isolated analog input channels (16-bit, 250 kS/s, 0 - *20mA, ±20mA)*1 isolated COM port*1 isolated DIO (2-in/2-out)*Embedded Linux operating system (Yocto)*Wide operating temperature range from -40°C to +70°C*Supports LabVIEW versions later than 2016*Supports OPC UA
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Digital Signage Player With Intel® Pentium® Processor N4200 & Celeron® Processor N3350, DisplayPort++, HDMI, 2 GbE LAN And 4 USB
DSP300-318
The DSP300-318 is powered by the onboard Intel® Pentium® processor N4200 and Celeron® processor N3350 (code name: Apollo Lake). It can deliver dazzling visual images and video advertising in 4K resolution. Measuring only 20 mm in thickness, the ultra slim DSP300-318 is sleek enough to fit in a small area behind signage displays and its fanless and cable free design enables easy installation without any environment limitation. The super slim DSP300-318 is designed to be fanless and cableless, which ensures solid reliability and easy maintenance. It supports HDMI and Dual-Mode DisplayPort (DP++) outputs with support for dual displays. The system also has one M.2 Key E 2230 for Wi-Fi and Bluetooth modules, one M.2 Key B 3042 for 4G LTE and one SIM card slots for 3.5G radio connectivity. Additionally, one M.2 Key M 2280 and one optional 64GB eMMC 5.0 are available for storage. The Intel® Apollo Lake-based DSP300-318 offers a cost-effective, compact yet powerful computing platform that allows plenty of digital signage solutions for advertising, brand promotion and digital menu board applications.
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SMARC V2.0 SoM With I.MX8M Quad/Dual 1.5 GHz/1.3 GHz (Industrial) SoC, 4GB RAM, 64GB EMMC, CAN, MIPI CSI/DSI And HDMI 2.0
SCM180
The SCM180 is a SMARC v2.0 system on module with a choice of quad- or dual-core Arm® Cortex®-A53 processors. The ultra low power, high performance, RISC-based module measures only 82 x 50 mm and utilizes the powerful i.MX 8M processor. Its scalability, optimized pinout schematic and low profile design offers high level of versatility to help system integrators drive their important projects forward. The SCM180 is unique among other SMARC modules of its kind because it features Trusted Platform Module (TPM) for optimum security. With a discrete, dedicated microcontroller designed to support hardware encryption and decryption, the SCM180 delivers enhanced security for an added layer of protection. It also offers a choice of operating temperature ranges and can operate reliably in harsh environments. The SCM180 is suitable for a wide range of smart, portable/mobile-integrated IoT applications including robotics, automotive, factory automation, smart agriculture, casino gaming, medical, retail, surveillance and more. With its NXP artificial intelligence core technologies-enabled capabilities, the SMARC module can be programmed to support smart automation and machine-learning application requirements.
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Robust RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, 1 COM, 1 LAN, DIO (4-in/4-out) And Optional CANbus
Agent200-FL-DC
*RISC-based (i.MX 6UltraLite) processor 528 MHz*256MB DDR3 SDRAM onboard*4GB eMMC flash onboard*2 PCI Express Mini Card slots (Wi-Fi or 3G/4G)*4 digital inputs and 4 digital outputs*Power input range of 9V to 48V DC with terminal block*Embedded Linux (Yocto) operating system*Fanless and compact design*Wide operating temperature range from -40°C to +70°C
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eMMC
These sockets are specifically designed for standard 153 & 169 Ball eMMC devices. Custom probing sockets also available.
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SOM Module
TEO820-ZU2CG
Sundance Multiprocessor Technology Ltd.
Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784EZU2, 784 Pin Packages4 x 5 cm form factorRugged for shock and high vibration2 x 512 MByte 32-Bit width DDR4 SDRAM2 x 32 MByte (2 x 256 MBit) SPI Boot Flash dual parallel4 GByte eMMC Memory (up to 64 GByte)B2B Connectors: 2 x 100 Pin and 1 x 60 Pin
