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Failure Analysis
examination of faults, determine root cause and recommend corrective actions.
See Also: Crush, Performance Testing, Investigation
- InterWorking Labs, Inc.
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SilverCreek SNMP Tests
Set up in less than five minutes - Windows or LinuxCustomize tests via Wizards, Script Generators, and moreAutomate operation with unambiguous test resultsIntegrate with other test harnesses and test toolsIncludes conformance, compliance, vulnerability, robustness, stress, and performance testingInvestigate failures and quickly resolve them with powerful diagnostic and analysis tools
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Battery Test Equipment
Improper functioning of battery systems installed in utilities, power plants, telecommunication systems, industrial applications and etc., can cause severe failures of the supported equipment and loss of critical information. Therefore, the battery test verifies their actual SOC (State of Charge) or SOH (State of Health) and prevents unwanted scenarios which could result in a significant budget loss as well as endanger of human lives.DV Power battery test equipment is able to perform the following battery measurements, using BLU and BVR devices:- Voltage (String and Cell)- Capacity- Temperature- Density of electrolyteAll of the above-mentioned measurements are performed with the highest accuracy. The advanced DV-B Win PC software enables collecting both numerical and graphical results. These features provide an easier and more efficient analysis. After the test, DV Win software generates a test report with a single click. A user can easily customize the report and save it in different formats, such as CLS, PDF, Word, or RTF.
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Failure Analysis
A partial list of our state of the art test equipment, applicable to these testing disciplines, will include the following: Two Scanning Electron Microscopes with EDS (SEM/EDS) Three Differential Scanning Calorimeters (DSC) Three Thermogravimetric Analyzers (TGA) Three Thermo Mechanical Analyzers (TMA) One Dynamic Mechanical Analyzer (DMA) Two Real-Time Fluoroscopic X-ray Systems, including a Microfocus System One Fourier Transform Infrared Microscope (FTIR) (capable of identifying a single particle of an unknown material) Two Ion Chromatographs (IC) (capable of identifying ionic impurities in ppm)
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Network Surveillance System
The network backbone contains a wealth of information that can be monitored and collected to support diagnostic, troubleshooting, and fraud prevention activities. Surveillance of network characteristics is becoming more important than ever before. Few important aspects of network surveillance include, Performance Monitoring, Security, Fraud Prevention, Physical Layer monitoring, Billing Verification, Remote Protocol Analysis, Failure Prediction, Traffic Engineering, Call Quality Monitoring and Troubleshooting.
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Cross-Section Analysis Laboratory
PCBs are constructed of a variety of materials such as glass, ceramic, copper, solder and Teflon. Trialon has the equipment and experienced staff to perform this difficult analysis. Our state-of-the-art materials analysis lab located in Auburn Hills, MI is managed by a Ph.D with over 20 years of hands-on experience in root cause failure analysis of design, material and process for current and future products.
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Acoustic Microscope
AMI D9650
Specifically designed to serve as a general purpose tool for failure analysis, process development, material characterization and low volume production inspection, the capabilities of the D9650 are truly unmatched. Representing the latest in C-SAM acoustic micro imaging, the D9650 delivers the unrivaled accuracy and robustness that you would expect from Nordson Test & Inspection instruments, plus improved electronics and software that raises the performance level for laboratory acoustic microscopes.
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MPI Automated Probe Systems
MPI Advanced Semiconductor Test
MPI’s 200 mm and 300 mm automated probe systems are dedicated and designed to address current and future requirements for all facets of Device Characterization for Modeling and Technology/Process Development, Failure Analysis, Design Verification, IC engineering, Wafer Level Reliability as well as special requirements for MEMS, High Power, RF and mmW device testing.
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Thermal Image Analysis Software
Thermalyze
Thermalyze software provides a stable platform from which to perform sophisticated temperature analysis and failure analysis testing. Tools such as Emissivity Tables allow you to perform true temperature mapping on the surface with varying emissivity. Lock-in thermography tests enable you to detect heating below 0.001°C.
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Electrical Testing
Innovative Testing Solutions, Inc.
Our specialty is Direct Current automotive components. We perform product validation and design verification testing on both electrical components and systems. Also, we perform warranty investigation testing and failure analysis. We have voltage capabilities to 300 volts and current capabilities to 1000 amperes. Both two-wire and four-wire resistance measurements are supported from NanoOhms to GigaOhms.
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Failure Analysis Services
Introducing our Failure Analysis services partner, close neighbour and collaborator NanoScope Services. Working together with NanoScope we offer the following portfolio of advanced FA services.
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Analytical Techniques
Anderson Materials Evaluation, Inc.
Our numerous analytical techniques, we tackle a wide range of materials challenges and commonly combines several analytical techniques to fully address complex and multi-dimensional materials issues. Our materials analysis laboratory provides XPS surface analysis, thermal analysis (TGA, DSC, TMA), FTIR infrared spectroscopy, UV-Vis spectrophotometry and reflectivity measurements, gas chromatography – mass spectroscopy (GC-MS), SEM/EDX, optical microscopy, mechanical testing, electrochemistry and corrosion analyses, residual gas mass spectroscopy, contact angle measurements, surface contamination measurements, adhesive bonding failure analysis, facility testing for silicone contamination, mechanical testing, metallography and fractography, density and porosity measurements, volatile organic component testing, friction, and other analytical capabilities. We continue to upgrade and expand our arsenal of analytical techniques and custom analytical methods to support our customers’ needs.
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Destructive Physical Analysis & Failure Analysis
DPACI's component analysis laboratory performs major analytical functions, such as destructive physical analysis, failure analysis, counterfeit analysis, and material analysis on components & devices. Our destructive physical analysis techniques are performed in accordance with standards and methods used in most military and space program requirements. Solutions for difficult production problems are resolved through our failure analysis procedures.
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Power System Recorder with CDR , PMU and IEC 61850 station bus protocol
TESLA 4000
ERLPhase Power Technologies Ltd
The new TESLA 4000 is an intelligent, state of the art, user-friendly multi-timeframe dynamic power system recorder with advanced Phasor Measurement Unit (PMU) and Continuous Disturbance Recording (CDR) capabilities. Wide area swing recording accomodates system performance analysis in minutes Meets NERC continuous disturbance recording standards with non-volatile on board flash memory No mechanical moving parts – flash drive eliminates most common mode of failure in recorders. Each flash drive holds 1000 records. IEEE C37.118-2005 SynchroPhasor Standard
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Electronics Failure Analysis System
Sentris
Due to the continued decrease in integrated circuit feature size and supply voltages, detecting and locating the miniscule amount of heat generated by failure sites has become increasingly difficult. Sentris pinpoints low-level infrared thermal emissions from IC faults such as short circuits and leakage current.
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Condition Monitoring System
Cut costs and boost productivity with a condition-monitoring tool designed for ease of use and scalability. The Dynapar OnSite™ system is a powerful predictive maintenance system targeted at preventing failures before they occur. It can slash unscheduled downtime, improve efficiency of route-based vibration analysis, and provide real-time analytics and trending to warn of possible machine failures.
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PWB Interconnect Stress Test
PWB Interconnect Solutions Inc.
Services to test the reliability of Printed Circuit Boards. PCBs).Coupon Inspection and Electrical Prescreen. Coupon Testing. Failure Location via I/R Photo Imagery. Failure Analysis.
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Resistive AC Load Bank
AC load bank testing offers you whole solutions of predictive failure analysis for UPS(uninterrupted power supply), generator, transformers, PV system, inverter etc, to validate the condition and output of such power systems comprehensively. Integrated AC & DC load bank could be made in one unit or separately with different load voltages as per your need for different applications.
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Battery Pack/Module Test Solution
Regenerative battery energy dischargeEnergy savingEnvironment protectionLow heat generateChannels paralleled for higher currentsCharge / discharge mode (CC, CV, CP) Constant current Constant voltage Constant powerDriving cycle simulationHigh precision measurement accuracyFast current conversionSmooth current without over shootTesting data analysis functionData recovery protection (after power failure)Independent protection of multi-channelBMS data recordingThermal chamber control integration
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Digital Microscope
VHX-6000 Series
Next-generation optical microscope with a large depth-of-field and advanced measurement capabilities for inspection and failure analysis.
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Electrical Property Measurement
Materials Analysis Technology Inc.
This technology is used to identify the electrical characteristics, such as resistance, capacitance and inductance, of semiconductor devices. Characteristics measured from fail and normal chips could provide important clues for further failure analysis.
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Failure Analysis And Magnetic Imaging Services
Micro Magnetics offers failure analysis services on a contractual basis. We maintain two current density metrology systems at our headquarters in Fall River and can produce maps of current flow in a wide variety of ICs and packages, usually with initial results delivered within 48 hours. Our engineers will work closely with you to understand and interpret the results in order to determine the root cause of the failure.
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FEA Software
Helius PFA
Helius PFA software provides powerful tools for enhanced FEA (finite element analysis) of composite structures, including progressive failure analysis.
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Failure Analysis
Failure Analysis (FA) plays a crucial role in the production of semiconductors. It provides process and design feedback to determine the root cause of any failures. Time-to-data for the FA Engineer is a critical measurement and SemiProbe’s Probe System for Life ® (PS4L) is ideally suited to excel in this application. All key components are interchangeable, making it easy to switch between individual die, wafers, and packaged parts.
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Diagnostic Test System™
The original Teseda system for bench-top stimulus, test pattern debug, validation, device failure mode stimulation in-situ with other Failure Analysis lab equipment such as an EMMI, etc.
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Torsional Vibration Analysis System
Torsional vibration analysis is the analysis of the torsional dynamic behavior of a rotating shaft system as a result of forced vibration. Excessive torsional vibration leads to very expensive failures such as damaged shafting, couplings, gears, auxiliary equipment, and more. Repair costs to such equipment can be very expensive. Preventing torsional failures requires adequate analysis over the equipment’s intended range of operating conditions. Jumho Electric torsional vibration analysis system acquires rotary speed signals, calculate the angular velocity fluctuation rate, and therefore obtain various waveforms, angular velocity and acceleration.
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Root Cause Failure Analysis
Maintenance Reliability Group, LLC
Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of grease from failed component and visual inspection for Root Cause Analysis.Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of grease from failed component and visual inspection for Root Cause Analysis.
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Scanning Acoustic Microscope
Pulse2
This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.
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Test System
ETS788
The 55/110 MHz ETS788 system boasts the same small footprint and cool quiet CMOS architecture as our ETS780 but with the new high-performance precision components of our Griffin series. This powerful member of the HiLevel family takes advantage of all of the tried and true features that have served users so successfully to date. Learn why the ETS788 is the perfect cost-effective solution for higher performance in Design Verification, Production and Failure Analysis.
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Failure Analysis – Materials
Failure analysis – materials is the investigation into the background or history of a sample, or an event, to determine why a particular failure occurred. A product failure may include premature breakage, discoloration or even an unexpected odor. It is useful to know if this failure is a new, unique occurrence or if it has been an ongoing issue. The investigation can involve analyzing the sample as it currently exists and extrapolating from that data what may have caused the failure. A sample of the “good” vs. “bad” product may also be useful for comparison purposes.
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Component Test and Analysis Laboratories
The Component Test and Analysis team specializes in electronic and mechanical components such as hybrids, connectors, cables, harnesses, passive or discrete components, and digital or linear devices. The test lab has extensive experience in developing test software to electrically and environmentally characterize virtually any integrated circuit, including analog, digital, mixed signal, converters, FPGA and ASICs, as well as experience in developing actual radiation environments for parts testing. The component analysis team offers the analytical expertise and advanced instrumentation to identify root cause explanation for a wide range of component-level failures, as well as the resources to evaluate for possible quality and reliability issues through non-destructive and destructive techniques. With access to a detailed database, the Component Test and Analysis team offers a 25-year history of test and analysis data — a valuable resource for addressing new customer requirements.
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Automated DC Parametric Curve Tracer
MultiTrace
MultiTrace curve tracer is a mid-sized benchtop model supporting pin counts from 216-625 pins and includes the PGA-625 fixture as a standard interface. MultiTrace supports a wide range of test applications: Failure analysis, Reliability testing, Counterfeit device analysis, Nondestructive electrical counterfeit test, Opens, shorts leakage testing (OSL), Post decap electrical inspection, Optical fault localization, ESD testing, Latch-up testing, Supply current measurements, and more!
