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Finite Element Analysis
FEA
The Finite Element Analysis (FEA) component of SimScale enables you to virtually test and predict the behavior of structures and solve complex structural engineering problems subjected to static and dynamic loading conditions. Our online simulation solution uses scalable numerical methods that can calculate mathematical expressions otherwise very challenging due to complex loading, geometries or material properties.
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Finite Element Analysis
Response Dynamics Vibration Engineering, Inc.
An understanding of structural dynamics is very important to sound Finite Element Analysis (FEA). We have been performing FEA analysis for over 30 years and in most cases we have used experimental data to guide our modeling. While our engineers have had undergraduate and graduate courses in FEA, it is the years of modeling and analysis of existing structures that has taught us the most by forcing a thoughtful analysis of the key structural dynamics and then going though the process of making adjustments to boundary conditions, expanding the dynamics of the model in places, and making simplifications and approximations where possible.
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Finite Element Analysis (FEA) Solution
Femap
Siemens Digital Industries Software
Femap is an advanced engineering simulation software program that creates finite element analysis models of complex engineering products and systems, and displays solution results. Femap can virtually model components, assemblies or systems and determine the behavioral response for a given operating environment.
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Finite Element Method Magnetics Simulation Software
FEMM
Finite Element Method Magnetics
FEMM is a suite of programs for solving low frequency electro magnetic problems on two-dimensional planar and axisymmetric domains. The program currently addresses linear/nonlinear magneto-static problems, linear/nonlinear time harmonic magnetic problems, linear electrostatic problems, and steady-state heat flow problems.
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High Accuracy Metrology System
MCT225 HA
This new 'absolute-accuracy' Metrology-CT (MCT) system guarantees that all internal and external geometry is measured efficiently with the highest accuracy. A proprietary liquid cooled microfocus transmission source, a finite element optimized support frame for maximum stiffness, and air-cooled cabinet provide long-term stability.
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Modal Exciters & Amplifiers
Experimental modal analysis, or modal testing, is a process for physically obtaining a math model of a structure’s dynamic properties. Modal tests identify a structure’s modal properties: natural frequencies, mode shapes, mass, stiffness and damping. Modal test results help troubleshoot resonant excitation from operating forces, validate and verify finite element models, predict the benefits of structural modifications, support design verification, and understand structural responses due to complex loading conditions.
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Composite Material Behavior Software
Helius Composite
Helius Composite software offers detailed information on composite material behavior without finite element analysis (FEA). Use Helius Composite to integrate materials into your designs.
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Correlation Analysis
EDM Modal Correlation Analysis allows the user to correlate two modal models; EMA and/or FEA models. Comparing the experimental data with that acquired through finite element analysis helps in validating the test results. Users can import the geometry model and mode shape data from FEA or EMA software. A modal mapping procedure is executed to match the EMA and FEA models. After this matching procedure, the new mode shape information from FEA is interpolated and the FEA modal parameters are displayed alongside with EMA results. Finally, to observe the correlation between the results from the two methods, a Cross-MAC matrix is calculated and shown.
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Electrical Grounding Analysis
GroundMat
SKM GroundMat is a program for substation ground grid design and analysis. It is designed to help optimize grid design or reinforce existing grids of any shape. It uses a general-purpose finite element algorithm for potential analysis and graphical facilities to validate ground system efficiency
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Engineering Services
In addition to the highest quality test programming, maximizing board coverage, and efficient board testing, TTCI offers a full array of other engineering services, including CCA (Circuit Card Assembly) Testing, Design for Test, ASTER TestWay electrical design for test analyzer, Feasa LED analyzer, SMH Technologies FlashRunner in-system programmer, finite element analysus, installation, reverse engineering of Gerber to CAD, Training, Test System PC, Hardware, and Software Upgrades, and more.
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FEA and Strain Gauge Testing
Circuit Check began Strain Gauge Testing in 1999 when BGA/SMT technology started replacing PTH components, reducing strain levels was a reactive post fixture fabrication process. We quickly recognized that the “reactionary” process was neither efficient nor were we capable on knowing the lowest achievable strain levels. Our engineering team came up with visual tools utilized during design to easily identify areas of excessive probe force, though still not enough data was generated to identify the lowest possible strain. Finite Element Analysis software models the PCBA and test fixture and applies the pressures from test probes and board supports and indicates the micro strain level applied to the PCBA. Using the FEA software during our design process allows our engineers to modify fixture designs to attain the lowest possible micro strain before fabrication begins.
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FEA Software
Helius PFA
Helius PFA software provides powerful tools for enhanced FEA (finite element analysis) of composite structures, including progressive failure analysis.
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Field Simulation Software
QuickField™
QuickField™ is a very efficient Finite Element Analysis package for electromagnetic, thermal, and stress design simulation with coupled multi-field analysis.
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Structural Testing
Structural testing is used to verify the static strength, or fatigue strength, of a component by applying measured loads. Testing can be done to failure, to contractual requirements, or to validate finite element model predictions.
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Structures
Ansys offers structural analysis software solutions that enable engineers of all levels and backgrounds to solve complex structural engineering problems faster and more efficiently. With our suite of tools, engineers can perform finite element analyses (FEA), customize and automate solutions for structural mechanics challenges and analyze multiple design scenarios. By using our software early in the design cycle, businesses can save costs, reduce the number of design cycles and bring products to market faster.
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Testing System
OpTest™ MTF
The Optikos OpTest™ MTF Testing Equipment is the most flexible and complete system for characterizing the optical performance of optical elements, lens assemblies and optical imaging systems in Infinite Conjugate, Finite Conjugate and Afocal configurations spanning the UV, Visible, NIR, SWIR, MWIR and LWIR spectral regions . OpTest™ software drives Optikos hardware, is easy to use and controls all motion control, image acquisition, configuration set-up and data reporting.
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Thermal Testing And Analysis
Response Dynamics Vibration Engineering, Inc.
We have consulted on thermal issues ranging from conduction issues in TECs, thermal radiation modeling, and countless air cooled system issues relating to system performance, vibration, and acoustics noise. We use a wide array of thermocouple instrumentation, thermal imaging, flow measurements, as well as finite element analysis and analytic modeling to measure, design, and debug thermal and related issues. We often work on customer products in our Response Dynamics lab where we characterize the system, engineer solution options, and prototype solutions. We then work with the customer to work the winning solution into their quality control and manufacturing process.
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TRA-300 LED Thermal Resistance Structure Analyzer
Hangzhou Everfine Photo-E-Info Co., LTD
The TRA-300 accurately measures the thermal resistance, junction temperature, optical power, voltage, current and other parameters of LED packaging products.The heating and cooling curves of LED can also be obtained, and the integral and differential thermal structure functions can be obtained by establishing the finite element model.Through the structural function analysis of the TRA-300 special software, the fine thermal resistance structure of the LED (from the chip to the thermal resistance value of each package structure) can be obtained, so as to objectively evaluate the heat dissipation quality and thermal management level of the LED package products, and provide the best verification for the heat dissipation design of the LED.
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Detrenching Grapnel
The Detrenching Grapnel is manufactured from high tensile steel, suitable for withstanding the harsh offshore environments. The structure and material of the grapnel is tested using finite element analysis which is performed during the design phase. This simulates the various stresses and strains acting on the grapnel in a variety of differentseabed conditions and allowed for optimisation of the design.
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Clamping Elements
Clamping elements from the LOCKED series provide a high level of safety. These ACE products clamp and decelerate loads and are suitable for perfectly controlled holding, both linear and rotary, in all processes.
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Multi Element Benchtops
XOS offers multi-element XRF benchtop analyzers for industries like petroleum and consumer products safety. Imagine a smarter analysis solution free of compromise: easy sample prep and operation, rapid testing, compliance flexibility, and industry-leading precision. Powered by HDXRF, these analyzers deliver direct measurement without the need for consumable gasses or sample conversion.
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Battery Element Testers
1652/1653
All STS Battery Element Testers provide a unique method for the detection of assembly level insulation defects in lead-acid batteries, including missing and damaged separators. Detection of such faults prior to filling and charging the battery minimizes costly reclamation. Traditional AC dielectric tests can detect such faults, but may produce damaging heat in moist cell applications.
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Force Sensor Elements
The STL Force Sensing Tension Links are a series of unique force sensors. The Tension Links utilize the internal strain gage process sucessfully and are used in bolts, load pins and flat load cells. The sensing element consists of a strain gage bridge circuit internally installed in a small hole along the longitudinal axis. This unique arrangement provides a most effective means for the protective sealing of the internal electronics while minimizing the adverse effects of extraneous torsion and bending loads.
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Force Sensor Elements
TE Connectivity (TE) enables OEMs to measure force using MEMS-based technology load cells. The same proprietary piezoresistive silicon strain gage technology used to measure pressure can also be configured into a reliable, low-cost package to measure force.
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RF Wattmeters and Elements
Bird has a long history of providing highly accurate RF power measurement. We created the market more than 60 years ago with the Model 43 wattmeter and now offer dozens of models.
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Pressure Cooling Elements
Rugged cooling elements with corrosion resistance that allow your pressure measurement devices to operate accurately at high pressure and temperature conditions.
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Network Element Management System
VCH-901
The control system (CS) VCH-901 is designed to control and monitor network elements (NE) that act as sources of clock signals on a digital communication network. These SCs include primary reference oscillators (PEG) VCH-001, secondary master oscillators (VZG) VCH-002 (Time-H), SSU55400А (HP), SSU2000E (Simetricom), SSU5548В and SSU5548С (Oscilloquartz), local master oscillator ( MZG) M100 (LONIIS), synchronization signal distribution equipment ARSS (ALTO).
