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- Advanced Telemetrics International
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Inductively Powered Telemetry Systems
Advanced Telemetrics International
ATi Inductively Powered Telemetry Systems are typically used to transmit data from rotating shafts or machinery to a stationary receiver.
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Chemical Analysis and Corrosion Testing
Performing chemical analysis of metal alloys including both ferrous and non-ferrous alloys.Chemical analysis involves determining the chemical constituents of metals and related materials.An industry leader and co-operating laboratory for qualifying Calibration Standards for Chemical Analysis.Our chemical laboratory processes include Spectroscopy – Optical Emission Inductively Coupled Plasma, gas analysers, wet chemical, Intercrystalline/ Intergranular Corrosion (including G28, G48 etc).
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ICP Plasma System
The AXIC IsoLok® Inductively Coupled Plasma (ICP) Load-Locked Processing System from AXIC, Inc. defines a new concept in Deep Reactive Ion Etch (DRIE) and low temperature-low damage Plasma Enhanced Chemical Vapor Deposition (ICP-PECVD) plasma processing. The system is based on a modular design starting with a universal chamber and cabinet unit with ICP etch or deposition bottom electrodes available for easy installation into the chamber unit combined with a load-lock. We are confident you will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma product in the market.
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ICP-OES Analyzer
ARCOS
SPECTRO Analytical Instruments GmbH
For the most demanding elemental analyses in industry and research. ARCOS analyzer represents a new pinnacle of productivity and performance for inductively coupled plasma optical emission spectrometers. SPECTRO ARCOS excels in industrial and academic applications for the most advanced elemental analysis of metals, chemicals, petrochemicals, and other materials.
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Inductively Coupled Plasma Optical Emission Spectroscopy / ICP-OES Systems
Industry-leading performance, speed and ease of use – no compromises
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Multichamber Plasma CVD & RIE Processing Systems
Model MPS-2000
Accurate linear wafer transporter with low particulate generation. Automated options with programmable controls. Safety interlocked with local and global interfaces. Base pressures to 10-8 torr. Optional clean room load lock entry port. Option for inductively coupled plasma processing is available. Complete and ready to operate.
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Inductively Coupled Plasma Spectroscopy (ICP-OES/MS), ICP Analysis Services
ICP-OES measures the light emitted at element-specific characteristic wavelengths from thermally excited analyte ions . This light emitted is separated and measured in a spectrometer, yielding an intensity measurement that can be converted to an elemental concentration by comparison with calibration standards. ICP-MS (ICP-Mass Spec) measures the masses of the element ions generated by the high temperature argon plasma. The ions created in the plasma are separated by their mass to charge ratios, enabling the identifcation and quantitation of unknown materials. ICP-MS offers extremely high sensitivity (i.e. low detection limits) for a wide range of elements
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Inductively Coupled Plasma Emission Spectroscopy
Inductively Coupled Plasma Emission Spectroscopy
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Inductively Coupled Plasma
Inductively Coupled Plasma Techniques can be very powerful tools for detecting and analyzing trace and ultra-trace elements. Over the past years, ICP-MS has become the technique of choice in many analytical laboratories for providing the accurate and precise measurements needed for today’s demanding applications and for providing required lower limits of detection.
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Inductively Coupled Plasma Spectrometry
Is an analytical technique that can be used to measure elements at trace levels in biological fluids.
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Inductively Coupled Plasma Mass Spectrometry / ICP-MS Systems
Agilent ICP-MS systems utilize innovative technology to deliver excellent sensitivity, accuracy, ease of use and productivity. Our 7800 and 7900 quadrupole ICP-MS systems offer the highest matrix tolerance, widest dynamic range and most effective interference removal for trace elements across most typical applications. The 8900 Triple Quadrupole ICP-MS (ICP-QQQ) adds MS/MS operation, providing precise control of reaction cell processes to ensure the most consistent and accurate results, resolving interferences that are beyond the capability of quadrupole and sector-field high resolution ICP-MS.
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Inductively Coupled Plasma Mass Spectrometer
ICPMS-2030
With its newly developed collision cell and optimized internal structure, the ICPMS-2030 provides superior sensitivity. At the same time, thanks to the adoption of its proprietary mini-torch unit and provision of an Eco mode, the quantity of argon gas needed for analyses has been greatly reduced to the industry's lowest levels. As a result, low running costs are assured. The Development Assistant function of the software automatically sets the optimal analysis conditions for quantitative analysis. Then, after measurements are complete, the Diagnosis Assistant function automatically checks the validity of the necessary data. While reducing the burden on the user, the efficiency of analyses is enhanced and the reliability of the data can be increased. It complies with FDA 21 CFR Part 11.
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Desolvating Nebulizer
Aridus3
The CETAC Aridus3 Desolvating Nebulizer System is a specialized liquid sample introduction accessory for inductively coupled plasma mass spectrometry (ICP‑MS). The Aridus3 can enhance analyte sensitivity up to 10 times or more and can greatly reduce solvent-based interferences such as oxides and hydrides.The Aridus3 couples a low-flow (50, 100, or 200 µL/min) PFA nebulizer and a heated PFA spray chamber with an inert fluoropolymer membrane. This combination provides enhanced analyte sensitivity while reducing solvent based interferences such as oxides and hydrides. The Aridus3 is particularly advantageous for small volume and highly corrosive samples such as those generated in the earth sciences and the semiconductor industry.
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Coupled Cavity TWTs
Communications & Power Industries
• Frequencies from 2.7 to 37.5 GHz• Peak levels: 500 W to 180 kW• Cooling type: air, liquid, conduction• Depressed or grounded collectors• CW (Continuous Wave) and Pulsed
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Microwave Plasma Subsystems
AX2600 And AX2700
The AX2600 and AX2700 Microwave Plasma Delivery Subsystems are complete and highly reliable solutions for the cost-effective generation and safe delivery of atomic species to the wafer. Available in 3 kW, these highly reliable, field-proven plasma delivery subsystems deliver highly concentrated atomic species. Suitable for multiple chemistries, the high speed and precision of this plasma system’s automatic tuning guarantees immediate ignition and fast transition from plasma conditions for high productivity. Robust closed-loop control ensures high accuracy, precision, and optimal repeatability of the process from wafer to wafer and system to system.
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Plasma Processing Systems
PlasmaSTAR
The PlasmaSTAR® Series of Plasma Processing Systems from Axic, Inc. defines a new concept in barrel plasma processing. The systems are based on a modular design concept. Starting with a universal base unit, multiple electrode modules are available for easy insertion into the base unit. You will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma.
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Remote Plasma Sources
Equip your manufacturing and abatement processes with high functionality and exceptional reliability. Customize your chemistry. Expand your operating range. Deliver higher process rates. Advanced Energy’s remote plasma sources offer sophisticated options in streamlined designs.
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Plasma Profiling TOFMS
PP-TOFMS
Plasma Profiling TOFMS addresses the needs of materials scientists across a wide range of application areas. PP-TOFMS provides fast elemental depth distribution of any inorganic material. The speed and ease of use of PP-TOFMS permit to reduce optimization time of growth processes as many research scientists strive to reduce the time from discovery to applications of new materials.The simultaneous full coverage of TOFMS available for each point of depth permits the detection of non suspected contamination. This is key for failure analysis and optimization of thin film processes that tend to no longer be based on ultra-high grade methods (i.e. ink jet printing…).
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Remote Plasma Source
Xstream
The highly efficient Xstream® RPS dissociates large volumes of NF3 and quickly cleans chambers, improving your overall tool performance. Its plasma chamber showcases high-purity aluminum alloy and patented cooling capabilities. Built to last for years without repair or expensive chamber coatings, the Xstream RPS is the smart choice for dependability and efficient performance.
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Time-domain Field-Device-Circuit coupled simulator
EM-SUPREME®
Time-domain Field-Device-Circuit coupled simulator for modeling of passive structures, active components, and complete RF & millimeter-wave modules. EM-Supreme is used for EM modeling of power amplifiers, switches, filters, active antennas, and complete RF modules such as antenna-switch, switch-filter, switch-filter-amplifier, and front-end modules with no approximations.
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Plasma Emission Controller
RU-1000
The optical technology developed by HORIBA and the gas control technology offered by HORIBA STEC have been combined to make further advances in plasma control technology. The plasma emission controller RU-100 offers; faster deposition by controlling the transition region, optimized distribution in a large-area, high-capacity chamber, plasma stabilization in a long sputtering process (stable deposition), and mixture optimization of compounds for reactive sputtering.
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Charge Coupled Device (CCD) Standard Image Sensors
Teledyne e2v is the leading supplier of scientific grade Charge Coupled Device (CCD) image sensors for the most challenging low light imaging and spectroscopy applications.
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DC Coupled Differential Switching System
BS1553F(X)
Universal Switching Corporation
The BS1553F(X) is a modular passive DC coupled differential switching system. It is designed as an automated "patch panel" for interconnecting numerous MIL-STD-1553 devices, cables and hardware, or for routing other differential signals such as '422 clock/data or kelvin ATE measurements. The I/O capacity is scalable from a small 8x8, up to 64x64 in one 5RU unit.
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Interferometers and Reflectometers for Plasma Diagnostics up to 170 GHz
Elva-1 supplies different solutions for measurement density and temperature profiles of plasma. Our systems are installed practically on all TOKAMAKs over the World.
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Particle-in-Cell Plasma, Electromagnetic & Electrostatic Simulation Software
VSim
The VSim electromagnetic, particle, and plasma high performance application is a flexible, multiplatform, Particle-in-Cell (PIC) simulation tool for running computationally intensive modeling problems. VSim enables you to switch easily between 1, 2, or 3 dimensions and then watch your model run lightning-fast. Using algorithms designed for the exacting demands of high performance computing systems, VSim can run simulations on your laptop or supercomputing cluster.
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Chemical Downstream Plasma Source
The AX7610 is a microwave plasma source for remote plasma applications. With replaceable quartz or sapphire plasma tubes, the AX7610 downstream source offers configuration flexibility to meet the most demanding application process parameters. The quartz tube version is ideally suited for production of atomic oxygen, nitrogen or argon. The sapphire tube version is compatible with much more severe CF4 CHF3 and NF3 chemistries.
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Plasma Emission Detectors for Gas Chromatographs
Our patented Plasma Emission Detector is available for integration into any gas chromatography system or installation. It has been designed for ‘plug and play’ installation and to allow for analysis of impurities from PPB to % levels using either capillary or packed columns.
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High Density Plasma Etching System for 200mm substrates
Model DRIE-1200-LL-ICP
Single process chamber for high rate plasma etching of 200mm wafers. Loadlocked. Stainless steel construction. Capabilities of smaller, multiple wafer throughput. Substrate materials include (but are not limited to) silicon, silicon oxynitrides, SiC, SiGe, Aluminum, and III-V compounds including GaAs, GaN, GaP, and InP. Stable plasma generation capabilities to below 1 mTorr. Five, Six, or Eight gas mass flow controllers are standard. Expanded or reduced numbers are available upon request.
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Thin Films, Plasma and Surface Engineering
A residual gas analyser for vacuum process analysis. Measures the vacuum process gas composition, contamination and leak detection.
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High Power Microwave Plasma Source
The High Power Microwave Plasma Source can be combined with a 6kW microwave generator for a high concentration of radicals providing a high productivity manufacturing solution. The High Power Microwave Plasma source is capable of igniting in multiple process gases, over a wide operating range with performance benefits in current and emerging applications such as, high throughput photoresist removal, advanced surface cleaning and conditioning, as well as, advanced deposition applications at the atomic level.
