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Printed Circuit Assembly
Printed Circuit Board Assembly
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Design, Manufacture & Test of Complex RF/Microwave Printed Circuit Boards (PCBs)
Teledyne Labtech specialises in the design, manufacture and test of complex RF/Microwave printed circuit boards (PCBs). - Technology driven – we innovate- Turnkey - one stop for manufacture, assembly & test- Focused – technical design support for RF/microwave and large format PCBs
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PCB Design and Assembly
Innovative Circuits Engineering, inc
Turnkey services for Printed Circuit Boards: Design, Fabrication, Assembly and Testing
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In-Circuit Test System
TestStation LX
TestStation LX is a cost-effective in-circuit test solution providing high-volume electronics manufacturers with reliable, high-quality test for the latest printed circuit board assembly technologies.
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PCB Manufacturing
Printed circuit board assembly is the process of soldering or assembly of electronic components to a printed circuit board or PCB. Star Engineering is a full-service manufacturer of printed circuit board assemblies, providing complete solutions for all types of requirements. Being a skilled custom cable assembly manufacturer, our services include designing, testing, prototyping and manufacturing followed by complete support. We provide both surface mount (SMT assemblies) and through hole PCB apart from any custom requirements of your processes.
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Pine Electronics
Specializing in low-mid volume electronic manufacturing services, Pine Electronics, Inc. offers a wide range of printed circuit board assembly (PCB assembly), cable and box build assembly solutions. Our equipment, engineering and technical talent serves both multi-national and regional customers throughout the United States. Known for full-service PCB assembly work, Pine Electronics, Inc. is highly integrated and responsive. Each customer has a designated representative for all commercial and technical questions. This personalized service model enhances communication, expedites project development, and represents Pine’s commitment to customer service.
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PMC
A PCI Mezzanine Card or PMC is a printed circuit board assembly manufactured to the IEEE P1386.1 standard. This standard combines the electrical characteristics of the PCI bus with the mechanical dimensions of the Common Mezzanine Card or CMC format (IEEE 1386 standard).
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Electronic Contract Manufacturing
Specializing in low-mid volume electronic manufacturing services, Pine Electronics, Inc. offers a wide range of printed circuit board assembly (PCB assembly), cable and box build assembly solutions. Our equipment, engineering and technical talent serves both multi-national and regional customers throughout the United States. Known for full-service PCB assembly work, Pine Electronics, Inc. is highly integrated and responsive. Each customer has a designated representative for all commercial and technical questions. This personalized service model enhances communication, expedites project development, and represents Pine’s commitment to customer service.
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Elite™ 13.56 MHz RF Plasma Generators
The elite™ Series of RF plasma generators provides state-of-the art technology in a compact air-cooled package. The elite is designed with high speed closed loop control, a class E RF deck and a switching modulator for superior output performance. The elite design utilizes a single printed circuit board assembly for the full rack product virtually eliminating all internal wires and connectors and thereby providing the highest reliability available.
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Failure and Technology Analysis
Failure analyses in order to clarify the failure cause soonest possible.From single device to the whole system - and from highly complex IC up to printed circuit board (PCB), mounting & interconnection technology and printed board assembly (PBA).
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Fastest In-Circuit Test Platform
TestStation
Teradyne’s TestStation in-circuit test systems provide electronics manufacturers with reliable high-quality, high-volume testing for the latest printed circuit board assembly (PCBA) technologies that are used in automotive, industrial, computing, consumer, communications, and defense end-products.
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Flying Probe Test Programming & Testing Services
Zero Defects International LLC
ZDI utilizes a Seica flying probe tester in order to provide test program development and testing services to customers in Silicon Valley and throughout North America. This is a very cost-effective solution for printed circuit assembly manufacturers who do not have in-house equipment of their own but have customers who require test services.
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Software
D2B
The unique capabilities of Teradyne's D2B software enable EMS and OEM manufacturers and partners to interconnect their global enterprises to optimize printed circuit board assembly test and inspection efficiencies early in the manufacturing / build cycle. D2B is a powerful suite of solutions that provides a standards-based architecture that supports GenCAM and ODB++ file formats enabling electronic manufacturers to outperform their competition, maximize profitability, and get to market first.
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Surface Potential Measuring Instrument
In the electronic equipment assembly process, there are many items that are charged on the order of kV, such as resin molded products and films. This digital electrostatic potential measuring instrument is suitable for processes with relatively high electrostatic control voltage.The measurement range switching function makes it possible to measure from low potential measurement of electronic devices to high potential measurement of resin molded products, film / printed circuit board manufacturing, etc.
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Thermal Load Boards
Thermal Engineering Associates, Inc.
A Thermal Load Board (TLB) is used to simulate an application printed circuit assembly (PCA) either before all the heat-producing components are available for mounting on the application PCA or if the heat-producing components require complex electronic circuitry to create heat within the components. The TLB is typically designed to be as mechanically and thermally equivalent to the application PCA and usually offers a way to vary the power dissipation of the elements that simulate the heat-producing components.
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Manufacturing Defects Analyzer
eloZ1-400
The eloZ1 Manufacturing Defects Analyzer is an in-circuit tester of the very latest generation, reliably detecting connection and assembly faults on printed circuit board assemblies. The eloZ1-400 is the compact version of the eloZ1. It is particularly suitable if there is only limited space to fit test appliances. The eloZ1-400 can also be used as a mobile test system.
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Manufacturing Defects Analyzer
eloZ1-1600
The eloZ1 Manufacturing Defects Analyzer is an in-circuit tester of the very latest generation, reliably detecting connection and assembly faults on printed circuit board assemblies. The eloZ1 can be integrated into table systems as well as into inline-systems.
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MECHANICAL TEST FIXTURE KITS
TX-MT-100 SERES
Test-X MT-100 Series mechanical kits are an inexpensive solution for testing smaller printed circuit boards and other devices.The MT-100 Series features a 1/2" thick FR4 probe plate and a 3/8" thick Lexan top plate. Precision alignment is assured through tooling holes in both the probe and top plates. Units are available with a 2-1/2" pan or an upper head assembly
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Utility Card: Flash Programming Applications
This new feature enables the Keysight Medalist i3070 ICT to perform higher speed flash programming at the ICT station in the printed circuit board assembly manufacturing line. You can combine programming and testing into a single phase, to save time and money. This in-system programming (ISP) flash solution is tester-based and does not rely on fixtures, thus enabling greater flexibility and ease of debugging.
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Reflow Soldering Machines
Shenzhen Leadsmt Technology Co.,Ltd
Used to attach surface-mount components to printed circuit boards (PCBs). It involves applying solder paste to specific locations on a PCB, placing the components on the paste, and then heating the assembly in a reflow oven.
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2-Module ICT System, I317x Series 6
E9902G
Keysight's family of i3070 Series 6 In-Circuit Test (ICT) systems are built on a proven technology foundation, and they improve test efficiency with time-tested software, hardware, and programmability. I3070 Series 6 ICT tester supports a wide range of printed circuit board assembly (PCBA) sizes for applications including IoT and 5G, as well as automotive and energy. The i3070 features a unique design that delivers the shortest signal path between measurement circuitry and devices under test to minimize undesired effects from parasitic capacitance, improve immunity to crosstalk, and eliminate stray signal coupling effects, delivering consistent and repeatable measurements. The Series 6 is fully backward compatible with previous systems and makes highly repeatable measurements.
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Double Sided PCB
Double Sided PCBs (also known as Double-Sided Plated Thru or DSPT) circuits were the gateway to higher technology applications. The advent of the plated thru hole was quickly adapted and allowed electronic designs to expand in capability and shrink in physical size. Today the double sided printed circuit board technology remains the workhorse of the assembly industry. There are near limitless applications for old and new designs. Fine line surface mount, ultra high copper build, high and low temperature, Solder coated, Silver, and Gold finishes are just a few examples of DSPT applications.
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Printed Circuit Board
RISER-PPM-1
WINSYSTEMS’ RISER-PPM-1 boards are designed to provide extra space in a PC/104-Plusstack. They are printed circuit boards (PCBs) with PCI-104 mounting holes and bus connectors. They allow a board with either tall components or heat sinks to be placed in a stack of boards in a location other than only at the top. The additional separation is 0.60 inches using standard PC/104-type spacers.
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Printed Circuit Board
RISER-PCM-1
WINSYSTEMS’ RISER-PCM-1 boards are designed to provide extra space in a PC/104 stack. They are printed circuit boards (PCBs) with PC/104 mounting holes and bus connectors. They allow a board with either tall components or heat sinks to be placed in a stack of boards in a location other than only at the top. The additional separation is 0.60 inches using standard PC/104-type spacers.
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MS-M 26-Pin RF Cable Assembly 0.5m
40-979-526-0.5m-FU
The MS-M RF 26-Pin cable assembly is constructed from RG178 Silver Plated Copper Clad Steel Wire with PVC insulation and an attenuation of 1.08dB/m at 400MHz. Screwlocks are provided to secure the MS-M connector to the associated product.
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MS-M 26-Pin RF Cable Assembly, Female to Unterminated, 0.5m, RG178 Cable
40-979A-526-0.5m-FU
This 0.5m long MS-M RF 26-Pin cable assembly is constructed from RG178 Silver Plated Copper Clad Steel Wire with FEP insulation and an attenuation of 102dB/100m at 500MHz. Screwlocks are provided to secure the MS-M connector to the associated product.
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MS-M 26-Pin RF Cable Assembly, Female to Unterminated, 0.5m, RG316 Cable
40-979A-526-3-0.5m-FU
This 0.5m long MS-M RF 26-Pin cable assembly is constructed from RG316 Silver Plated Copper Clad Steel Wire with PVC insulation and an attenuation of 68dB/100m at 500MHz. Screwlocks are provided to secure the MS-M connector to the mating connector.
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MS-M 26-Pin RF Cable Assembly, Female to Unterminated, 1m, RG316 Cable
40-979A-526-3-1m-FU
This 1m long MS-M RF 26-Pin cable assembly is constructed from RG316 Silver Plated Copper Clad Steel Wire with PVC insulation and an attenuation of 68dB/100m at 500MHz. Screwlocks are provided to secure the MS-M connector to the mating connector.
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MS-M 26-Pin RF Cable Assembly, Female to Unterminated, 2m, RG316 Cable
40-979A-526-3-2m-FU
This 2m long MS-M RF 26-Pin cable assembly is constructed from RG316 Silver Plated Copper Clad Steel Wire with PVC insulation and an attenuation of 68dB/100m at 500MHz. Screwlocks are provided to secure the MS-M connector to the mating connector.
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MS-M 3-Pin RF Cable Assembly 0.5m
40-979-503-0.5m-FU
The MS-M RF 3-Pin cable assembly is constructed from RG178 Silver Plated Copper Clad Steel Wire with PVC insulation and an attenuation of 1.08dB/m at 400MHz. Screwlocks are provided to secure the MS-M connector to the associated product.
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MS-M 3-Pin RF Cable Assembly, Female to Unterminated, 0.5m, RG178 Cable
40-979A-503-0.5m-FU
This 0.5m long MS-M RF 3-Pin cable assembly is constructed from RG178 Silver Plated Copper Clad Steel Wire with FEP insulation and an attenuation of 102dB/100m at 500MHz. Screwlocks are provided to secure the MS-M connector to the associated product.
