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Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
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Resistivity Standard
Resistivity Standards are bare silicon wafers available in 3 in, 8 in and 12 in sizes. The silicon is p-type (Boron) doped to nominal resistivity values, from 0.002 ohm.cm to 75 ohm.cm as available on the 3" model.
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Inline Wafer Testing
IL-800
Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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Wafer Sorter and Inspection
SolarWIS Platform
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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4-Probe Resistivity and Resistance Tester
HS-MPRT-5
t used for measuring resistivity of silicon rods and wafers, and sheet resistance of diffused layers, epitaxial layers, LTO conductive films and conductive rubbers, etc.
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Super Silicon Resistivity and Type Tester
HS-3FC II
Super Silicon Resistivity and Type Tester is specially designed for silicon sorting，it can quickly test the silicon type, heavy-doped, resistivity and current, and can be widely used in all kinds of silicon sorting, like granular polysilicon material, break semiconduct silicon wafer, chunk material, top and tail material and so on. Furthermore, it integrates two probes, three probes and four probes. With the three probes, it could show type and heavy type simultaneously, strongly improved the sorting efficiency.
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Silicon Resistivity, PN type & Alarm Tester
HS-PSRT
It use Four Probe to test the resistivity and P/N type of wafers、ingots and all type of silicon materials.It can be used by Solar and Semiconductor industry.
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Surface & Volume Low Resistivity Meter for Conductive Materials
Loresta GP
The Loresta GX Meter is an intelligent, multi purpose low resistivity meter equipped with software that calculates resistivity correction factors. A variety of 4 pin probes are available for use with the Loresta GX. The instrument is typically used in Product Engineering, R&D, and Quality Control. Applications include measurement of conductive paint, conductive plastics, conductive rubber, conductive film, silicon wafers, antistatic materials, EMI shield materials, conductive fiber, conductive ceramics, etc.
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Non-contact Measurement Wafer Sorting System (Belt Drive Tranceportation)
NC-6800
*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Number of cassette station can be changed by customers request*Eddy current method for resistivity, Electric capacitance method for wafer thickness*Temperature correction for silicon wafer function
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Non-contact Measurement Wafer Sorting System (Robot Hand Tranceportation)
NC-3000R
*High accuracy measurement system for large diameter wafer*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Compact design of Two-stage by measuring area and transfer area*Number of cassette station can be changed by customers request Option : Add wafer flattness measurement system(FLA-200)
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Hand Held Probe Type Eddy Current Sheet Resistance/resistivity Measurement Instrument
EC-80P (Portable)
*Auto-measurement start by probe head contacting to sample*3 measurement modes for wafer resistivity, bulk resistivity and sheet resistance*Easy set up to measurement condition by JOG dial*5 types of model for each measuring range*Resistivity probe can be changed by sample’s resistivity range
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Minority Carrier Lifetime Tester
HS-CLT
HS-CLT Minority Carrier Lifetime Tester has strong functions. It can not only measure carrier lifetime of wafer but also silicon ingot, silicon filament,silicon phosphorus ingot,silicon boron ingot, seed crystal and other irregular shape silicon material.The minority carrier testing ranges from 1μs to 6000μs, the minimum resistivity is 0.1Ω.cm, (can be extensive to 0.01Ω.cm). Dynamic curve monitoring in the whole process.
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Semiconductor Metrology Systems
MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Silicon heavy-doped Tweezer Tester
HS-MRTT
Mini resistivity tweezer tester is used to check heavy-dope silicon. adaptable for little granular material, little broken IC Wafer and other little silicon material. When the resistivity is lower than the set value, it will make alarm.
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Software
Junction Measurement and Analysis
Materials Development Corporation
A comprehensive set of analyses for junction diode or Schottky barriers begins with C-V data gathering that adjusts the voltage step to the slope of the C-V characteristics. This assures an optimum set of C-Vdata whether the voltage range is small or large. Doping profile and resistivity profile are both available at the touch of a key. Plots of 1/C2 - V or Log(C) - Log (V+ phi) show doping uniformity and doping slope factor. Exclusive recalculation options allow adjustment of stray capacitance and area to facilitate calibration using a standard reference wafer of known doping or resistivity.
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Wide Measurement Range Model Of Semi-automatic 4 Point Probe Sheet Resistance/resistivity Measurement
RT-3000/RG-2000 (RG-3000)
*User programable measurement pattern & programmable measuring pattern*Tester self-test function, wide measuring range*Thickness, edge, temperature correction for silicon wafer*Film thickness conversion function from sheet resistance*2 types measuring tester (S version: Standard type, H version: High range resistivity measurement type)
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Resistivity Meter
Integrated Geo Instruments & Services Private Limited
The instrument design incorporates several advanced techniques of digital circuitry to make it reliable Geophysical tool that provides high quality data useful for all types of mineral and groundwater exploration research etc. The SSR-MP1 sends the entire current into the ground without wasting power for constant current generation thus increasing the signal strength to probe deeper layers.
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Resistivity Meter
Resistivity meterRSM-500 is used for measuring the volume resistivity of transformer oil and other electrical insulating liquids. • Auto ranged from 109 to 1015 ohm cm • Test voltages: internally generated +500V DC
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Resistivity Meter
Model 2180
The unit is compact and lightweight. The basic system is 7″ wide by 2.5″ high and 12″ long. When measurements are needed below approximately 100 micro-ohm-centimeters, the basic system is piggybacked onto a second enclosure that houses a power amplifier with a current gain of ten. The combined unit measures 7″ wide by 5″ high and 12″ long. The combined unit weighs 11.5 pounds. Two short cables interconnect the two enclosures for powering the power amplifier and routing the signals to the fixture or four point probe. The front panel of the basic system includes a 32-character backlit LCD display and a set of function keys. An easy-to-use menu will allow access to user defined parameters such as sample thickness, sample volume, and calibration constants; upper and lower alarm limits, relative measurements, and several others.
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Resistivity Meters
SSR-MP-ATS
Integrated Geo Instruments & Services Private Limited
The instrument design incorporates several innovative features and advanced techniques of digital circuitry to make it a reliable Geophysical tool providing high quality data useful for mineral and groundwater exploration and any other Geophysical applications. The SSR-MP-ATS sends the entire current into the ground without wasting power for constant current generation thus increasing the signal strength to probe deeper layers.
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Resistivity Meters
DDR3
Integrated Geo Instruments & Services Private Limited
The DDR 3 Resistivity Meter is a specialized version of IGIS Resistivity meters designed for use in Resistivity surveys up to about 200m depth. It utilizes rechargeable batteries as power source to energize the ground thus eliminating the necessity of using the relatively expensive dry cells.
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Resistivity Meters
Precisely Measure Surface Resistivity, Volume Resistivity, or Resistance to Ground. Advanced Energy's Trek and Monroe resistivity meters offer accurate and repeatable measurements for surface resistivity, volume resistivity, or resistance to the ground.
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Resistivity Meters
Periodic compliance checks of ESD work surfaces are super important. Monitors only verify the ground plane, or path to ground. The surface itself can wear down, become dirty, or if you use low quality mat—just not hold up. A handheld Surface Meter is great for running monthly, or prescriptive compliance verification of your ESD surfaces.
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Wafer Analyzer
RAMANdrive
RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
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Wafer Bonder
AML
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Wafer Chucks
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Wafer Chucks
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Wafer Manufacturing
Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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WAFER MVM-SEM
E3300 Family
The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Wafer Prober
Prexa MS
The latest fully automated 300mm wafer prober for memory devices. Featuring high rigidity and exceptional thermal control, the system enables full-wafer contact testing.
